Patents by Inventor Rajesh V.

Rajesh V. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150045862
    Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.
    Type: Application
    Filed: August 9, 2013
    Publication date: February 12, 2015
    Applicant: Medtronic, Inc.
    Inventors: Simon E. Goldman, Rajesh V. Iyer, Curtis E. Burgardt, Zhi Fang, Michael J. Galloway, Ryan J. Jensen, James A. Martin, Fabian A. Pena
  • Publication number: 20150045861
    Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.
    Type: Application
    Filed: August 9, 2013
    Publication date: February 12, 2015
    Applicant: Medtronic, Inc.
    Inventors: Simon E. Goldman, Rajesh V. Iyer, Curtis E. Burgardt, James A. Martin, Laxmi Kanth Peddi, William R. Schildgen
  • Patent number: 8946413
    Abstract: There is provided a compound of Formula I(a) or I(b): or a pharmaceutically acceptable salt thereof, wherein the various substitutents are defined herein.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: February 3, 2015
    Assignee: Pfizer Inc.
    Inventors: Robert O. Hughes, Rajesh V. Devraj, Donald J. Rogier, John I. Trujillo, Steve R. Turner, Wei Huang
  • Patent number: 8927538
    Abstract: The present invention provides a compound of general formulae A useful as potential antitumour agents against human cancer cell lines. The present invention further provides a process for the preparation of pyrrolo[2, 1-c][1,4]benzodiazepine hybrids of general formulae 6a-g, 10a-o, 14a-g and 18a-o.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: January 6, 2015
    Assignee: Council of Scientific & Industrial Research
    Inventors: Ahmed Kamal, Rajesh V. C. R. N. C Shetti, Srinivasa K. Reddy, Adla Malla Reddy
  • Patent number: 8921552
    Abstract: Compounds of general formula A useful as potential anticancer agents against human cancer cell lines and a process for the preparation thereof.
    Type: Grant
    Filed: August 2, 2013
    Date of Patent: December 30, 2014
    Assignee: Council of Scientific & Industrial Research
    Inventors: Ahmed Kamal, Adla Mallareddy, Paidakula Suresh, Rajesh V. C. R. N. C. Shetti, Harish Chandra Pal, Ajit Kumar Saxena
  • Publication number: 20140360748
    Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. In some examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule.
    Type: Application
    Filed: August 22, 2014
    Publication date: December 11, 2014
    Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
  • Patent number: 8889130
    Abstract: The present invention relates to the treatment of osteoarthritis and pain using IL-1? and IL-1? binding proteins, including anti-IL-1? and anti-IL-1? antibodies and engineered multivalent and multispecific IL-1? and IL-1? binding proteins.
    Type: Grant
    Filed: February 8, 2012
    Date of Patent: November 18, 2014
    Assignee: Abbvie Inc.
    Inventor: Rajesh V. Kamath
  • Patent number: 8892379
    Abstract: A system and method for soft-field reconstruction are provided. One method includes obtaining applied input and measured output information for an excited object using a plurality of transducers and forming an admittance matrix based on the applied input and measured output information. The method also includes determining a plurality of moments using the admittance matrix and calculating a property distribution of the excited object using the plurality of moments.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: November 18, 2014
    Assignee: General Electric Company
    Inventors: Rajesh V. V. L. Langoju, Wrichik Basu, Manoj Kumar Koyithitta Meethal, Sakethraman Mahalingam
  • Publication number: 20140335014
    Abstract: The present invention relates to engineered multivalent and multispecific binding proteins, methods of making, and specifically to their uses in the prevention, diagnosis, and/or treatment of disease.
    Type: Application
    Filed: April 8, 2014
    Publication date: November 13, 2014
    Applicant: AbbVie, Inc.
    Inventors: Tariq Ghayur, Peter C. Isakson, Lisa M. Olson, Chengbin Wu, Margaret Hugunin, Rajesh V. Kamath, Carolyn A. Cuff, Hamish Allen
  • Patent number: 8844103
    Abstract: Methods for making feedthrough assemblies including a capacitive filter array are disclosed. Methods disclosed include attaching a perimeter wall of the capacitor filter array to an interior wall of a ferrule, depositing a thick film conductive paste within at least one passageway to form a conductive pathway, and heating the ferrule, capacitor filter array and the thick film conductive paste to convert the paste to a relatively solid material.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: September 30, 2014
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
  • Patent number: 8849404
    Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a lead frame assembly. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. The lead frame assembly may include an electrically conductive lead electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: September 30, 2014
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
  • Publication number: 20140281712
    Abstract: A computer-implemented method for estimating maintenance task durations is provided. The method is implemented by at least one computing system including at least one processor and at least one memory device coupled to the processor. The method includes receiving a query including a first query maintenance task and a plurality of query factors, and identifying an initial baseline task duration based at least in part on the first query maintenance task. The initial baseline task duration includes a plurality of baseline task factors. The method further includes identifying at least one adjustment factor based at least in part on the differences between the plurality of query factors and the plurality of baseline task factors, calculating a maintenance task duration estimate based at least in part on the initial baseline task duration and the adjustment factors, and planning execution of the first query maintenance task based on maintenance task duration estimate.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicants: GENERAL ELECTRIC COMPANY, GE AVIATION SYSTEMS LIMITED, GE AVIATION SYSTEMS LLC
    Inventors: Rajesh V. Subbu, James Kenneth Aragones, Jonathan Mark Dunsdon, Steve John Schoonveld, Mark Thomas Harrington, Maria Louise Watson
  • Publication number: 20140279802
    Abstract: A computer includes a processor and a memory device. The computer is configured to a) receive decision-making criteria from at least one of at least a portion of a plurality of agents associated with a plurality of agent devices, the memory device, and a user, b) generate valid decision combinations using at least a portion of received decision-making criteria, c) transmit, to the plurality of agents, valid decision combinations, d) receive, from a deciding agent, a decision, and e) constrain, using the received decision, valid decision combinations. The computer is configured to f) return to c) until determining that no more decisions can be received. The computer is configured to g) transmit a final decision set to the plurality of agents upon determining that no more decisions can be received. The final decision set represents a complete combination of decisions including at least a portion of received decisions.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicants: GENERAL ELECTRIC COMPANY, GE AVIATION SYSTEMS LIMITED, GE AVIATION SYSTEMS LLC
    Inventors: Mark Thomas Harrington, Bernhard Joseph Scholz, Jonathan Mark Dunsdon, Tony Cecil Ramsaroop, Rajesh V. Subbu, Maria Louise Watson
  • Patent number: 8716450
    Abstract: The present invention relates to engineered multivalent and multispecific binding proteins, methods of making, and specifically to their uses in the prevention, diagnosis, and/or treatment of disease.
    Type: Grant
    Filed: October 15, 2010
    Date of Patent: May 6, 2014
    Assignee: AbbVie Inc.
    Inventors: Tariq Ghayur, Rajesh V. Kamath, Junian Liu, Marie P. Honore
  • Publication number: 20140111904
    Abstract: In one example, a capacitor structure may include a capacitor comprising a surface that defines at least one feedthrough aperture and a ceramic insulator layer attached to the surface. The surface of the capacitor may include a capacitor registration feature, and the ceramic insulator layer may include a ceramic insulator layer registration feature. The capacitor registration feature and the ceramic insulator layer registration feature may cooperate to substantially align the ceramic insulator layer to the capacitor, e.g., prior to the ceramic layer being attached to surface of the capacitor.
    Type: Application
    Filed: December 23, 2013
    Publication date: April 24, 2014
    Inventor: Rajesh V. Iyer
  • Patent number: 8706228
    Abstract: An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA includes conductive strips connected to a non-conductive block. The non-conductive block possesses, a top side, a bottom side, a front side and a back side. A seamless non-conductive barrier extends from the bottom side and between the front side and the back side. The barrier prevents a pin from contacting another pin and eliminates welding of the ground pin to the side of the ferrule.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: April 22, 2014
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Lea A. Nygren, Stephanie L. McCracken, Mukul Jain, Steven M Dufon, Christine Gale Kronich
  • Publication number: 20140049924
    Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
    Type: Application
    Filed: January 20, 2012
    Publication date: February 20, 2014
    Applicant: Medtronic, Inc.
    Inventors: Steven T. Deininger, Michael J. Baade, Rajesh V. Iyer
  • Publication number: 20140043739
    Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
    Type: Application
    Filed: January 20, 2012
    Publication date: February 13, 2014
    Applicant: Medtronic, Inc.
    Inventors: Steven T. Deininger, Michael J. Baade, Rajesh V. Iyer
  • Publication number: 20140039190
    Abstract: Compounds of general formula A useful as potential anticancer agents against human cancer cell lines and a process for the preparation thereof.
    Type: Application
    Filed: August 2, 2013
    Publication date: February 6, 2014
    Inventors: Ahmed Kamal, Adla Mallareddy, Paidakula Suresh, Rajesh V., C., R., N., C. Shetti, Harish Chandra Pal, Ajit Kumar Saxena
  • Patent number: 8644936
    Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: February 4, 2014
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich