Abstract: A new Static Random Access Memory (SRAM) cell using a restoring device and a strong inverter is disclosed. An SRAM cell comprises a strong inverter and a strong access transistor constructed on a high-mobility semiconductor substrate layer. An N to 1 programmable multiplexer positioned above the inverter provides the input to said strong inverter from N available discrete voltage levels. A high mobility conducting path is used to read data quickly, while very small programmable elements vertically integrated in one or more planes increase the storage density at no extra area penalty. N data values are stored in one latch location, reducing memory area and cost significantly without sacrificing on time to access the stored data.

Abstract: A semiconductor device with two selectable manufacturing configurations, comprising: a first module layer having a plurality of circuit blocks; and a second module layer positioned substantially above the first module layer, wherein in a first selectable configuration a plurality of memory circuits are formed to control a portion of the circuit blocks, and wherein in a second selectable configuration a conductive pattern is formed to control substantially the same portion of the circuit blocks.

Abstract: A new Static Random Access Memory (SRAM) cell using Thin Film Transistors (TFT) is disclosed. In a first embodiment, an SRAM cell comprises a strong inverter and a strong access device constructed on a semiconductor substrate layer, and a weak inverter and a weak access device constructed in a semiconductor thin film layer located vertically above the strong devices. The strong devices are used in the data read and write paths, and the weak devices are used for latch feed-back and sector data erase. This first embodiment is used for high density and high speed memory applications. In a second embodiment, an SRAM cell comprises thin film inverters and thin film access devices constructed in a semiconductor thin film layer located substantially above logic transistors. The TFT SRAM cell is buried above the logic gates of an Integrated Circuit to consume no extra Silicon real estate. This second embodiment is used for slow access and Look-Up-Tables type memory applications.

Abstract: A three-dimensional semiconductor device, comprising: a first module layer having a plurality of circuit blocks; and a second module layer positioned substantially above the first module layer, including a plurality of configuration circuits; and a third module layer positioned substantially above the second module layer, including a plurality of circuit blocks; wherein, the configuration circuits in the second module control a portion of the circuit blocks in the first and third module layers.

Abstract: A new Static Random Access Memory (SRAM) cell using Thin Film Transistors (TFT) is disclosed. In a first embodiment, an SRAM cell comprises a strong inverter and a strong access device constructed on a semiconductor substrate layer, and a weak inverter and a weak access device constructed in a semiconductor thin film layer located vertically above the strong devices. The strong devices are used in the data read and write paths, and the weak devices are used for latch feed-back and sector data erase. This first embodiment is used for high density and high speed memory applications. In a second embodiment, an SRAM cell comprises thin film inverters and thin film access devices constructed in a semiconductor thin film layer located substantially above logic transistors. The TFT SRAM cell is buried above the logic gates of an Integrated Circuit to consume no extra Silicon real estate. This second embodiment is used for slow access and Look-Up-Tables type memory applications.

Abstract: A highly economical alterable ASIC contains multiple fully optimized custom ASIC designs in one IC foot-print, each design utilizing the entire IC. The user can switch between multiple independently stored optimized logic applications instantly. The alterable ASIC comprises programmable logic blocks and user configurable circuits. Either random access memory (RAM) configuration circuits or mask configured read only memory (ROM) configuration circuits are stacked in separate module layers above a single logic module layer. Each RAM or ROM layer implements one design application and global control signals provide user selection. Alterable ASIC dissever the effective die cost, requires one smaller package, occupies one site on the PC board and needs less board level wires. An extremely low cost solution for system designs is realized with an alterable ASIC.

Abstract: A new Static Random Access Memory (SRAM) cell using a restoring device and a strong inverter is disclosed. An SRAM cell comprises a strong inverter and a strong access transistor constructed on a high-mobility semiconductor substrate layer. An N to 1 programmable multiplexer positioned above the inverter provides the input to said strong inverter from N available discrete voltage levels. A high mobility conducting path is used to read data quickly, while very small programmable elements vertically integrated in one or more planes increase the storage density at no extra area penalty. N data values are stored in one latch location, reducing memory area and cost significantly without sacrificing on time to access the stored data.

Abstract: A mask configurable semiconductor device, comprising: a first module layer having a plurality of circuit blocks including at least one programmable logic block; and a second module layer deposited substantially above the first module layer, including a read only memory (ROM) configuration circuit to program said logic block to a user specification.

Abstract: A method of forming a semiconductor device includes fabricating digital circuits comprising a programmable logic circuit on a substrate; selectively fabricating either a memory circuit or a conductive pattern substantially above the digital circuits to program said programmable logic circuit; and fabricating a common interconnect and routing layer substantially above the digital circuits and memory circuits to connect digital circuits and one of the memory circuit or the conductive pattern.

Abstract: A new Static Random Access Memory (SRAM) cell using Thin Film Transistors (TFT) is disclosed In a first embodiment, an SRAM cell comprises a strong inverter and a strong access device constructed on a semiconductor substrate layer, and a weak inverter and a weak access device constructed in a semiconductor thin film layer located vertically above the strong devices. The strong devices are used in the data read and write paths, and the weak devices are used for latch feed-back and sector data erase. This first embodiment is used for high density and high speed memory applications. In a second embodiment, an SRAM cell comprises thin film inverters and thin film access devices constructed in a semiconductor thin film layer located substantially above logic transistors. The TFT SRAM cell is buried above the logic gates of an Integrated Circuit to consume no extra Silicon real estate. This second embodiment is used for slow access and Look-Up-Tables type memory applications.

Abstract: A semiconductor device with two selectable manufacturing configurations, comprising: a first module layer having a plurality of circuit blocks; and a second module layer positioned substantially above the first module layer, wherein in a first selectable configuration a plurality of memory circuits are formed to control a portion of the circuit blocks, and wherein in a second selectable configuration a conductive pattern is formed to control substantially the same portion of the circuit blocks.

Abstract: A new Static Random Access Memory (SRAM) cell using Thin Film Transistors (TFT) is disclosed. In a first embodiment, an SRAM cell comprises a strong inverter and a strong access device constructed on a semiconductor substrate layer, and a weak inverter and a weak access device constructed in a semiconductor thin film layer located vertically above the strong devices. The strong devices are used in the data read and write paths, and the weak devices are used for latch feed-back and sector data erase. This first embodiment is used for high density and high speed memory applications. In a second embodiment, an SRAM cell comprises thin film inverters and thin film access devices constructed in a semiconductor thin film layer located substantially above logic transistors. The TFT SRAM cell is buried above the logic gates of an Integrated Circuit to consume no extra Silicon real estate. This second embodiment is used for slow access and Look-Up-Tables type memory applications.

Abstract: An inexpensive, re-configurable storage device for programmable and application specific logic is disclosed. A configurable storage device comprising a storage circuit including at least one output and at least one input capable of changing said output in a well defined response sequence; and a configuration circuit including at least one memory element to control a portion of said storage circuit; and a programmable means of altering said storage circuit response sequence. This allows the user greater flexibility in picking the most desired flip-flop from a variety of choices. The user programmed flip-flop option converts to an application specific conductive pattern with no change in storage device performance.