Abstract: A maintenance chamber configured to reduce contamination on an electroplating chuck, the maintenance chamber including a positioning system configured to rotate, axially move, or both rotate and axially move the electroplating chuck, and a gas atomizing nozzle, wherein the nozzle is configured to spray an atomized fluid onto the electroplating chuck, wherein the atomized fluid is configured to reduce contamination on the electroplating chuck. Further, a method for reducing contamination of an electroplating chuck inside a maintenance chamber, including placing the electroplating chuck inside the maintenance chamber, spraying the electroplating chuck with an atomized fluid from one or more nozzles, and dislodging or eroding contaminants on the electroplating chuck by mechanical interactions between atomized liquid droplets and the contaminants.

Abstract: A maintenance chamber configured to reduce contamination on an electroplating chuck, the maintenance chamber including a positioning system configured to rotate, axially move, or both rotate and axially move the electroplating chuck, and a gas atomizing nozzle, wherein the nozzle is configured to spray an atomized fluid onto the electroplating chuck, wherein the atomized fluid is configured to reduce contamination on the electroplating chuck. Further, a method for reducing contamination of an electroplating chuck inside a maintenance chamber, including placing the electroplating chuck inside the maintenance chamber, spraying the electroplating chuck with an atomized fluid from one or more nozzles, and dislodging or eroding contaminants on the electroplating chuck by mechanical interactions between atomized liquid droplets and the contaminants.

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

Abstract: A lamp providing hands free illumination. The lamp includes a strap attachment for attaching the lamp to a backpack strap or other wearable webbing. The lamp body having a power source mounted within the body, with a LED light source exposed on a surface of the body, a power switch button mounted to the body to control the LED light source. The lamp with a hinge to pivot the lamp up and down to direct the light in front of the user.

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

Abstract: Systems and methods include generating an integrated technical data package that incorporates a plurality of objects associated with a development of a product so that each object is integrated with other objects based on a relationship between each of the objects. Embodiments of the present disclosure relate to incorporating the plurality of objects into a technical data package database. A relationship between each of the plurality of objects may be identified based on an impact each of the objects has on each other object in the development of the product. The plurality of objects may be integrated based on the relationship between each of the object so that an update to at least one object propagates through to each other object integrated with the at least one object. The integrated technical data package may be generated to provide an updated snapshot of the development of the product.

Abstract: Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The semiconductor substrate may define a plurality of features, which may include vias. The methods may include flowing a wetting agent into the processing chamber. A chamber pressure may be maintained below about 100 kPa. The methods may also include wetting the plurality of features defined in the substrate.

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

Abstract: A system and related method for simulating IR halos in a computer graphics display generates a set of halo candidates corresponding to each new scene by scanning the frame buffer for that scene to flag pixels associated with unocculted light sources as halo candidates, or prospective halo centers around which simulated halos are to be drawn. The system adjusts the defocus value of flagged halo candidates based on their pixel distance and determines whether identified halo centers are new, continuing, or expired by comparing the current scene and its halo candidate list to the preceding (currently displayed) image and its list of current halo centers. The system generates a dual visible/IR image, adding IR-only polygonal halos to the identified halo centers based on pixel attributes. The dual image is projected for viewing by night vision goggles, which the IR-only image and component halos will stimulate.

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Abstract: Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The semiconductor substrate may define a plurality of features, which may include vias. The methods may include flowing a wetting agent into the processing chamber. A chamber pressure may be maintained below about 100 kPa. The methods may also include wetting the plurality of features defined in the substrate.

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

Abstract: Systems and methods include generating an integrated technical data package that incorporates a plurality of objects associated with a development of a product so that each object is integrated with other objects based on a relationship between each of the objects. Embodiments of the present disclosure relate to incorporating the plurality of objects into a technical data package database. A relationship between each of the plurality of objects may be identified based on an impact each of the objects has on each other object in the development of the product. The plurality of objects may be integrated based on the relationship between each of the object so that an update to at least one object propagates through to each other object integrated with the at least one object. The integrated technical data package may be generated to provide an updated snapshot of the development of the product.

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.