Patents by Inventor Randy Harris
Randy Harris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11935771Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.Type: GrantFiled: October 28, 2021Date of Patent: March 19, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Randy A. Harris, Coby Scott Grove, Paul Zachary Wirth, Avinash Shantaram, Alpay Yilmaz, Amir Nissan, Jitendra Ratilal Bhimjiyani, Niranjan Pingle, Vincent Dicaprio
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Patent number: 11935770Abstract: Methods and apparatus bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing a substrate includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer configured to hold a plurality of the one or more types of substrates, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates between the buffer, the one or more process chambers, and a buffer disposed in an adjacent automation module of the plurality of automation modules.Type: GrantFiled: February 17, 2021Date of Patent: March 19, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Randy A. Harris, Coby Scott Grove, Paul Zachary Wirth, Avinash Shantaram, Alpay Yilmaz, Amir Nissan, Vincent Dicaprio
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Patent number: 11899366Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: GrantFiled: September 7, 2021Date of Patent: February 13, 2024Assignee: Applied Materials, Inc.Inventors: Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani, Daniel J. Woodruff, Randy Harris, Robert B. Moore
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Publication number: 20220262652Abstract: Methods and apparatus bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing a substrate includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer configured to hold a plurality of the one or more types of substrates, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates between the buffer, the one or more process chambers, and a buffer disposed in an adjacent automation module of the plurality of automation modules.Type: ApplicationFiled: February 17, 2021Publication date: August 18, 2022Inventors: Randy A. HARRIS, Coby Scott GROVE, Paul Zachary WIRTH, Avinash SHANTARAM, Alpay YILMAZ, Amir NISSAN, Vincent DICAPRIO
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Publication number: 20220262653Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.Type: ApplicationFiled: October 28, 2021Publication date: August 18, 2022Inventors: Randy A. HARRIS, Coby Scott GROVE, Paul Zachary WIRTH, Avinash SHANTARAM, Alpay YILMAZ, Amir NISSAN, Jitendra Ratilal BHIMJIYANI, Niranjan PINGLE, Vincent Dicaprio
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Publication number: 20220004104Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: ApplicationFiled: September 7, 2021Publication date: January 6, 2022Inventors: Viachslav BABAYAN, Douglas A. BUCHBERGER, JR., Qiwei LIANG, Ludovic GODET, Srinivas D. NEMANI, Daniel J. WOODRUFF, Randy HARRIS, Robert B. MOORE
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Patent number: 11112697Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: GrantFiled: February 11, 2019Date of Patent: September 7, 2021Assignee: Applied Materials, Inc.Inventors: Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani, Daniel J. Woodruff, Randy Harris, Robert B. Moore
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Publication number: 20200400290Abstract: A lamp providing hands free illumination. The lamp includes a strap attachment for attaching the lamp to a backpack strap or other wearable webbing. The lamp body having a power source mounted within the body, with a LED light source exposed on a surface of the body, a power switch button mounted to the body to control the LED light source. The lamp with a hinge to pivot the lamp up and down to direct the light in front of the user.Type: ApplicationFiled: June 21, 2019Publication date: December 24, 2020Inventor: Randy Harris
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Patent number: 10837119Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.Type: GrantFiled: June 20, 2018Date of Patent: November 17, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Robert B. Moore, David Silvetti, Paul Wirth, Randy Harris, Daniel J. Woodruff, Gregory J. Wilson
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Patent number: 10474033Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: GrantFiled: August 31, 2017Date of Patent: November 12, 2019Assignee: Applied Materials, Inc.Inventors: Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani, Daniel J. Woodruff, Randy Harris, Robert B. Moore
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Patent number: 10372834Abstract: Systems and methods include generating an integrated technical data package that incorporates a plurality of objects associated with a development of a product so that each object is integrated with other objects based on a relationship between each of the objects. Embodiments of the present disclosure relate to incorporating the plurality of objects into a technical data package database. A relationship between each of the plurality of objects may be identified based on an impact each of the objects has on each other object in the development of the product. The plurality of objects may be integrated based on the relationship between each of the object so that an update to at least one object propagates through to each other object integrated with the at least one object. The integrated technical data package may be generated to provide an updated snapshot of the development of the product.Type: GrantFiled: January 15, 2016Date of Patent: August 6, 2019Assignee: Discus Software CompanyInventors: Dan Z. Sokol, Randy Harris, Robert Roush, Randy Strobel
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Patent number: 10373864Abstract: Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The semiconductor substrate may define a plurality of features, which may include vias. The methods may include flowing a wetting agent into the processing chamber. A chamber pressure may be maintained below about 100 kPa. The methods may also include wetting the plurality of features defined in the substrate.Type: GrantFiled: December 22, 2017Date of Patent: August 6, 2019Assignee: Applied Materials, Inc.Inventors: Paul McHugh, Bridger Hoerner, Marvin Bernt, Thomas H. Oberlitner, Brian Aegerter, Richard W. Plavidal, Andrew Anten, Adam McClure, Randy Harris
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Publication number: 20190187563Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: ApplicationFiled: February 11, 2019Publication date: June 20, 2019Inventors: Viachslav BABAYAN, Douglas A. BUCHBERGER, JR., Qiwei LIANG, Ludovic GODET, Srinivas D. NEMANI, Daniel J. WOODRUFF, Randy HARRIS, Robert B. MOORE
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Patent number: 10249078Abstract: A system and related method for simulating IR halos in a computer graphics display generates a set of halo candidates corresponding to each new scene by scanning the frame buffer for that scene to flag pixels associated with unocculted light sources as halo candidates, or prospective halo centers around which simulated halos are to be drawn. The system adjusts the defocus value of flagged halo candidates based on their pixel distance and determines whether identified halo centers are new, continuing, or expired by comparing the current scene and its halo candidate list to the preceding (currently displayed) image and its list of current halo centers. The system generates a dual visible/IR image, adding IR-only polygonal halos to the identified halo centers based on pixel attributes. The dual image is projected for viewing by night vision goggles, which the IR-only image and component halos will stimulate.Type: GrantFiled: June 8, 2017Date of Patent: April 2, 2019Assignee: Rockwell Collins, Inc.Inventors: David A. Buckmiller, Layne H. Thorup, Thomas P. Skowyra, David Quinn LeBaron, Randy Harris
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Patent number: 10203604Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: GrantFiled: January 6, 2016Date of Patent: February 12, 2019Assignee: Applied Materials, Inc.Inventors: Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani, Daniel J. Woodruff, Randy Harris, Robert B. Moore
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Patent number: 10174437Abstract: A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer. A wafer plate may be provided on the other side of the backing plate assembly. The ring has contact fingers electrically connected to a ring bus bar, and with the ring bus bar electrically connected to a power source in the processor via the backing plate assembly when the ring is engaged to the backing plate assembly. A wafer seal on the ring overlies the contact fingers. A chuck seal may be provided around a perimeter. Maintenance of the electrical contacts and the seal is performed remotely from the processors.Type: GrantFiled: June 30, 2016Date of Patent: January 8, 2019Assignee: Applied Materials, Inc.Inventors: Randy A. Harris, Michael Windham
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Publication number: 20180298513Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.Type: ApplicationFiled: June 20, 2018Publication date: October 18, 2018Inventors: Robert B. Moore, David Silvetti, Paul Wirth, Randy Harris
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Patent number: 10087544Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.Type: GrantFiled: June 23, 2016Date of Patent: October 2, 2018Assignee: Applied Materials, Inc.Inventors: Robert B. Moore, David Silvetti, Paul Wirth, Randy Harris
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Publication number: 20180182664Abstract: Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The semiconductor substrate may define a plurality of features, which may include vias. The methods may include flowing a wetting agent into the processing chamber. A chamber pressure may be maintained below about 100 kPa. The methods may also include wetting the plurality of features defined in the substrate.Type: ApplicationFiled: December 22, 2017Publication date: June 28, 2018Applicant: Applied Materials, Inc.Inventors: Paul McHugh, Bridger Hoerner, Marvin Bernt, Thomas H. Oberlitner, Brian Aegerter, Richard W. Plavidal, Andrew Anten, Adam McClure, Randy Harris
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Publication number: 20170363960Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: ApplicationFiled: August 31, 2017Publication date: December 21, 2017Inventors: Viachslav BABAYAN, Douglas A. BUCHBERGER, Jr., Qiwei LIANG, Ludovic GODET, Srinivas D. NEMANI, Daniel J. WOODRUFF, Randy HARRIS, Robert B. MOORE