Abstract: A wafer processing system has a wafer loading system accommodating sufficient wafer carriers to substantially maximize the processing speed capability of the processing system. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading tracks. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. One or more process robots in a process module move wafers from buffers, or other locations, to processors in the process module.

Abstract: A wafer loading system accommodates sufficient wafer carriers to substantially maximize the processing speed capability of wafer processing systems. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading elements, such as overhead track systems. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. Methods of operating the loading system allow delivery and removal of wafers to and from the processing systems to meet or exceed the processing speeds of the processing systems.

Abstract: A wafer processing system has a moveable drain assembly having multiple drain rings. The drain rings may be spaced apart sufficiently to allow a process fluid applicator to move between them. Each drain ring provides a separate drain path, optionally in a separate recirculation loop carrying a single process fluid. The drain rings may be sequentially moved into position to collect process fluid moving off of the workpiece. As a result, process fluids may be more uniformly applied and used process fluids can be separately removed, collected, and either recycled or processed for disposal. Mixing of used process fluids is largely avoided. A lower process fluid outlet allows for processing the back side of the wafer as well, without flipping the wafer.

Abstract: A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holding positions is provided for holding a batch or workpieces or wafers. The process chamber vessel is moveable to a position where it substantially encloses the holder, so that wafers in the holder may be processed in a controlled environment. A cooling shroud may be provided to absorb heat from the heater before or after thermal processing. The thermal processor is compact and thermally shielded, and may be used in an automated processing system having other types of processors.

Abstract: An integrated tool that enables wet chemical processing chambers, lift-rotate units and other hardware to be quickly interchanged without having to recalibrate the transport system or other components to the replacement items. These tools are expected to reduce the down time associated with repairing or maintaining processing chambers and/or lift-rotate units so that the tools can maintain a high throughput. Several aspects of these tools are particularly useful for applications that have stringent performance requirements because components are more likely to require maintenance more frequently, and reducing the down time associated with maintaining such components will significantly enhance the integrated tool.

Abstract: End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of abutments and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments.

Abstract: A system and method are provided for reliable and customer-friendly delivery of documents. One method of the present invention include the steps of: producing document data for printing documents; accepting requests to print selected documents; determining whether a selected document is accepted for electronic delivery or for non-electronic delivery; printing documents accepted for non-electronic delivery; and electronically delivering documents accepted for electronic delivery.

Abstract: A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holding positions is provided for holding a batch or workpieces or wafers. The process chamber vessel is moveable to a position where it substantially encloses the holder, so that wafers in the holder may be processed in a controlled environment. A cooling shroud may be provided to absorb heat from the heater before or after thermal processing. The thermal processor is compact and thermally shielded, and may be used in an automated processing system having other types of processors.

Abstract: End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of end-effectors and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments. An alternative end-effector includes at least three abutments, at least one of which is resiliently connected to an actuator for movement between a retracted position and a deployed position wherein it engages a workpiece.

Abstract: A system and method are provided for monitoring information delivered through an electronic delivery system. One method for monitoring electronically delivering documents is provided which includes the steps of: creating log files for storing selected data related to selected electronic document preparation events; forwarding the log files to a central database for storage; and providing access to the log files for retrieval and analysis.

Abstract: The invention provides an apparatus for cleaning and drying a container for semiconductor workpieces. The apparatus comprises a load port with a fixture that receives a dirty container and delivers it to a deck assembly with a carrier that removably receives the container for further handling. While the container is received by the carrier, a robot with a first end effector removes the container door and places it on a portion of the carrier. The robot includes a second end effector that engages the carrier and elevates the carrier and container for insertion into a process chamber. The process chamber includes a rotor with at least one receptacle wherein the rotor is rotated to create both high pressure and low pressure regions. Once the container and carrier are loaded into the rotor, the rotor is rotated and means for cleaning injects a processing fluid onto the container and carrier. After a rinse stage and while the rotor is rotating, the means for drying delivers air across the container and carrier.

Abstract: End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of end-effectors and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments. An alternative end-effector includes at least three abutments, at least one of which is resiliently connected to an actuator for movement between a retracted position and a deployed position wherein it engages a workpiece.

Abstract: An integrated tool and automatic calibration systems that enable wet chemical processing chambers, lift-rotate units and other hardware to be quickly interchanged without having to recalibrate the transport system or other components to the replacement items. These tools are expected to reduce the down time associated with repairing or maintaining processing chambers and/or lift-rotate units so that the tools can maintain a high throughput. Several aspects of these tools are particularly useful for applications that have stringent performance requirements because components are more likely to require maintenance more frequently, and reducing the down time associated with maintaining such components will significantly enhance the integrated tool.

Abstract: End-effectors and associated control and guidance systems and methods are disclosed. A transfer device in one embodiment includes a base unit, an arm carried by the base unit and movable relative to the base unit, and an end-effector carried by the arm and rotatable relative to the arm. The end-effector includes two grippers, at least one being movable toward and away from the other between a grip position and a release position. A transmission is coupled between a motor and the movable gripper to receive an input force from the motor and apply an output force to the gripper that increases as the gripper moves to the grip position.

Abstract: A piñata-like device is formed from cardboard panels and sub-panels. The structure is formed and held together by masking tape which is partially cut, across the seams of the panels and sub-panels. The container has an access opening to facilitate placement of goodies into the cavity. Each panel and sub-panel is provided with a ribbon. By pulling on the ribbons, the panels are frangibly detachable from one another. The strength of the attachment of the ribbons to the panels and sub-panels exceeds the strength of the masking tape holding the panels and sub-panels into a container form. When the ribbons are pulled, preferably substantially simultaneously, the panels substantially detach from one another, and any contents disposed within the cavity are made available, usually in a somewhat explosive manner. An end of each ribbon is passed through one or more slits in each panel and securely attached to a surface of the panel.

Abstract: An apparatus and method for handling and/or pre-processing microelectronic workpieces. In one embodiment, the apparatus includes an input/output station configured to removably receive a plurality of microelectronic workpieces at an input/output location, a transfer station, and a first transfer device that moves the microelectronic workpieces directly between the input/output location and the transfer station. A second transfer device moves the microelectronic workpieces directly from the transfer station to at least one process station. The transfer station can include a pre-process station configured to identify and/or align the microelectronic workpieces. The apparatus can further include a storage station configured to support a plurality of microelectronic workpieces and can be positioned to at least partially overlap the pre-process station.

Abstract: A modular tool unit for wet chemical processing of microfeature workpieces including a dimensionally stable mounting module having front alignment elements at predetermined locations, positioning elements, and attachment elements. The tool unit further includes a wet chemical processing chamber and a transport system attached to the mounting module. The wet chemical processing chamber has chamber interface members engaged with corresponding positioning elements and chamber fasteners engaged with corresponding attachment elements. Similarly, the transport system has transport interface members engaged with corresponding positioning elements and transport fasteners engaged with corresponding attachment elements. The positioning elements for the wet chemical processing chamber and the transport system are precisely located at known points within the fixed reference frame defined by the dimensionally stable mounting module.

Abstract: Processing tools, components of tools, and methods of making and using such devices for electrochemical processing of microelectronic workpieces. One aspect of the invention is directed toward reaction vessels for electrochemical processing of microelectronic workpieces, processing stations including such reaction vessels, and methods for using these devices. For example, one embodiment of a reaction vessel includes an outer container having an outer wall, a first outlet configured to introduce a primary fluid flow into the outer container, and at least one second outlet configured to introduce a secondary fluid flow into the outer container separate from the primary fluid flow. The reaction vessel can also include at least one electrode, and it can also have a field shaping unit.

Abstract: A method and apparatus for manually and automatically processing microelectronic workpieces. The apparatus can include a tool having a plurality of processing stations, all of which are manually accessible to a user, and an input/output station configured to support at least one microelectronic workpiece for automatic transfer to and from the processing stations. A transfer device is positioned proximate to the input/output station and the processing stations and is configured to automatically transfer microelectronic workpieces between the input/output station and the processing stations. The apparatus can be used for both manual and automatic processing of microelectronic workpieces, either sequentially or simultaneously.

Abstract: A modular apparatus for thermally processing a microelectronic workpiece is provided. The modular apparatus comprises a mounting module having a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loading station, a heating station and a cooling station. The thermal processing modular apparatus has a front docking unit for removeably connecting it to a load/unload module and a rear docking unit for removeably connecting it to a wet chemical processing tool, or another tool for otherwise processing a workpiece. A transport system (i.e., robot) services the modular tool units that can be automatically calibrated to work with individual processing components of the tool units.