Patents by Inventor Randy Harris
Randy Harris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9812344Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.Type: GrantFiled: February 3, 2015Date of Patent: November 7, 2017Assignee: Applied Materials, Inc.Inventors: Jason Rye, Mario David Silvetti, Randy A. Harris, Bryan Puch, Vincent Steffan Francischetti, Satish Sundar
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Publication number: 20170206237Abstract: Systems and methods include generating an integrated technical data package that incorporates a plurality of objects associated with a development of a product so that each object is integrated with other objects based on a relationship between each of the objects. Embodiments of the present disclosure relate to incorporating the plurality of objects into a technical data package database. A relationship between each of the plurality of objects may be identified based on an impact each of the objects has on each other object in the development of the product. The plurality of objects may be integrated based on the relationship between each of the object so that an update to at least one object propagates through to each other object integrated with the at least one object. The integrated technical data package may be generated to provide an updated snapshot of the development of the product.Type: ApplicationFiled: January 15, 2016Publication date: July 20, 2017Inventors: Dan Z. Sokol, Randy Harris, Robert Roush, Randy Strobel
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Publication number: 20170154797Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.Type: ApplicationFiled: January 6, 2016Publication date: June 1, 2017Inventors: Viachslav Babayan, Douglas A. Buchberger, JR., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani, Daniel J. Woodruff, Randy Harris, Robert B. Moore
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Patent number: 9598788Abstract: An electroplating apparatus has a rotor in a head, with a contact ring on the rotor. A lift/rotate actuator may move the head to position a sector of the contact ring into a deplate channel of a deplating station. Electrical current and a deplate liquid are applied directly onto the contacts of the contact ring, from a position radially inward of the contacts. Electrical current and a deplate liquid may also be separately applied onto the back side of the ring contact, from a position radially to the outside of the contact ring. A seal on the deplating station makes sliding contact with the contact ring as the contact ring rotates through the deplate channel, with the seal associated with an exhaust or vacuum opening that pulls deplating and rinse liquid through openings in the contact ring.Type: GrantFiled: September 25, 2013Date of Patent: March 21, 2017Assignee: APPLIED Materials, Inc.Inventors: Randy A. Harris, Bryan J. Puch
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Publication number: 20170009367Abstract: A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer. A wafer plate may be provided on the other side of the backing plate assembly. The ring has contact fingers electrically connected to a ring bus bar, and with the ring bus bar electrically connected to a power source in the processor via the backing plate assembly when the ring is engaged to the backing plate assembly. A wafer seal on the ring overlies the contact fingers. A chuck seal may be provided around a perimeter. Maintenance of the electrical contacts and the seal is performed remotely from the processors.Type: ApplicationFiled: June 30, 2016Publication date: January 12, 2017Inventors: Randy A. Harris, Michael Windham
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Publication number: 20160298255Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.Type: ApplicationFiled: June 23, 2016Publication date: October 13, 2016Inventors: Robert B. Moore, David Silvetti, Paul Wirth, Randy Harris
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Publication number: 20160237584Abstract: A method for processing a wafer includes holding the wafer in a face-up position with a seal ring contacting the wafer on a contact circumference. A bead of liquid is applied onto the entire contact circumference, with the bead of liquid contacting the wafer and the seal ring. The wafer is then inverted into a head-down position, lowered into contact with electrolyte and plated with a conductive film. Formation of the bead of liquid helps to displace air bubbles as the wafer is immersed into the electrolyte which reduces plating defects.Type: ApplicationFiled: February 12, 2015Publication date: August 18, 2016Inventors: Paul R. McHugh, Gregory J. Wilson, John L. Klocke, Randy A. Harris, Bridger Hoerner, Paul Van Valkenburg
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Publication number: 20160225656Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.Type: ApplicationFiled: February 3, 2015Publication date: August 4, 2016Inventors: Jason Rye, Mario David Silvetti, Randy A. Harris, Bryan Puch, Vincent Steffan Francischetti, Satish Sundar
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Patent number: 9399827Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.Type: GrantFiled: April 23, 2014Date of Patent: July 26, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Robert B. Moore, David Silvetti, Paul Wirth, Randy Harris
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Publication number: 20150075976Abstract: An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.Type: ApplicationFiled: November 25, 2014Publication date: March 19, 2015Inventors: Randy A. Harris, Daniel J. Woodruff, Jeffrey I. Turner, Gregory J. Wilson, Paul R. McHugh
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Patent number: 8968533Abstract: An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.Type: GrantFiled: May 10, 2012Date of Patent: March 3, 2015Assignee: APPLIED Materials, IncInventors: Randy A. Harris, Daniel J. Woodruff, Jeffrey I. Turner, Gregory J. Wilson, Paul R. McHugh
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Patent number: 8900425Abstract: An electro-processing apparatus includes a rotor in a head, and a contact ring assembly on the rotor. The contact ring assembly may have one or more strips of contact fingers on a ring base, with contact fingers clamped into position on the ring base. The strips may have spaced apart projection openings, with the projections on the ring base extending into or through the projection openings. A shield ring may be attached to the ring base, to clamp the contact fingers in place, and/or to provide an electric field shield over at least part of the contact fingers. The contact fingers may be provided as a plurality of adjoining forks, with substantially each fork including at least two contact fingers.Type: GrantFiled: November 29, 2011Date of Patent: December 2, 2014Assignee: Applied Materials, Inc.Inventors: Randy A. Harris, Paul R. McHugh, Gregory J. Wilson
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Publication number: 20140318977Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.Type: ApplicationFiled: April 23, 2014Publication date: October 30, 2014Inventors: Robert B. Moore, David Silvetti, Paul Wirth, Randy Harris
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Publication number: 20140262795Abstract: A substrate processor uses pressurized gas to create a vortex for lifting and holding a wafer, and to create a vacuum to prevent the wafer from adhering to a contact ring seal after electroplating the wafer. A processor head has a rotor movable into and out of an electrolyte vessel. A backing plate on the rotor includes vortex outlets which create the vortex in the rotor. A vacuum channel adjacent to the perimeter of the rotor applies vacuum to the wafer edges to hold the wafer onto the backing plate. A solenoid or switch in the head has a first position to supply gas flow to the vortex outlets, and a second position to supply gas flow to an aspirator which creates the vacuum in the vacuum channel.Type: ApplicationFiled: March 14, 2013Publication date: September 18, 2014Inventors: Nolan L. Zimmerman, Randy A. Harris, Daniel J. Woodruff
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Publication number: 20140083862Abstract: An electroplating apparatus has a rotor in a head, with a contact ring on the rotor. A lift/rotate actuator may move the head to position a sector of the contact ring into a deplate channel of a deplating station. Electrical current and a deplate liquid are applied directly onto the contacts of the contact ring, from a position radially inward of the contacts. Electrical current and a deplate liquid may also be separately applied onto the back side of the ring contact, from a position radially to the outside of the contact ring. A seal on the deplating station makes sliding contact with the contact ring as the contact ring rotates through the deplate channel, with the seal associated with an exhaust or vacuum opening that pulls deplating and rinse liquid through openings in the contact ring.Type: ApplicationFiled: September 25, 2013Publication date: March 27, 2014Inventors: Randy A. Harris, Bryan J. Puch
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Publication number: 20130299343Abstract: An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.Type: ApplicationFiled: May 10, 2012Publication date: November 14, 2013Applicant: APPLIED MATERIALS, INC.Inventors: Randy A. Harris, Daniel J. Woodruff, Jeffrey I. Turner, Gregory J. Wilson, Paul R. McHugh
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Publication number: 20130134035Abstract: An electro-processing apparatus includes a rotor in a head, and a contact ring assembly on the rotor. The contact ring assembly may have one or more strips of contact fingers on a ring base, with contact fingers clamped into position on the ring base. The strips may have spaced apart projection openings, with the projections on the ring base extending into or through the projection openings. A shield ring may be attached to the ring base, to clamp the contact fingers in place, and/or to provide an electric field shield over at least part of the contact fingers. The contact fingers may be provided as a plurality of adjoining forks, with substantially each fork including at least two contact fingers.Type: ApplicationFiled: November 29, 2011Publication date: May 30, 2013Applicant: APPLIED MATERIALS, INC.Inventors: Randy A. Harris, Paul R. McHugh, Gregory J. Wilson
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Patent number: 7934898Abstract: A wafer processing system has a wafer loading system accommodating sufficient wafer carriers to substantially maximize the processing speed capability of the processing system. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading tracks. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. One or more process robots in a process module move wafers from buffers, or other locations, to processors in the process module.Type: GrantFiled: July 16, 2007Date of Patent: May 3, 2011Assignee: Semitool, Inc.Inventors: Randy A. Harris, Steve L. Eudy, Paul Z. Wirth
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Patent number: 7849865Abstract: A wafer processing system has a moveable drain assembly having multiple drain rings. The drain rings may be spaced apart sufficiently to allow a process fluid applicator to move between them. Each drain ring provides a separate drain path, optionally in a separate recirculation loop carrying a single process fluid. The drain rings may be sequentially moved into position to collect process fluid moving off of the workpiece. As a result, process fluids may be more uniformly applied and used process fluids can be separately removed, collected, and either recycled or processed for disposal. Mixing of used process fluids is largely avoided. A lower process fluid outlet allows for processing the back side of the wafer as well, without flipping the wafer.Type: GrantFiled: January 5, 2007Date of Patent: December 14, 2010Assignee: Semitool, Inc.Inventor: Randy A. Harris
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Patent number: 7520286Abstract: The invention provides an apparatus for cleaning and drying a container for semiconductor workpieces. The apparatus comprises a load port with a fixture that receives a dirty container and delivers it to a deck assembly with a carrier that removably receives the container for further handling. While the container is received by the carrier, a robot with a first end effector removes the container door and places it on a portion of the carrier. The robot includes a second end effector that engages the carrier and elevates the carrier and container for insertion into a process chamber. The process chamber includes a rotor with at least one receptacle wherein the rotor is rotated to create both high pressure and low pressure regions. Once the container and carrier are loaded into the rotor, the rotor is rotated and means for cleaning injects a processing fluid onto the container and carrier. After a rinse stage and while the rotor is rotating, the means for drying delivers air across the container and carrier.Type: GrantFiled: December 5, 2005Date of Patent: April 21, 2009Assignee: Semitool, Inc.Inventors: Jeffry Alan Davis, Randy A. Harris