Abstract: A phased array antenna system comprising a plurality of isotropic radiating elements and/or omnidirectional receiving elements addressing close in fields and a plurality of non-isotropic radiating elements and/or non-omnidirectional receiving elements addressing remote fields with the combined elements used to extend the maximum range of the antenna system without increasing the number of element nor the output power of the antenna. The non-isotropic radiating elements and/or the non-omnidirectional receiving elements can be formed by adding focusing structures such as lenses or reflective structures in the radiating path of isotropic radiating elements and/or omnidirectional receiving elements. Antennas with combined isotropic radiating and non-isotropic radiating elements can be utilized for electromagnetic phased array radar, communication and imaging systems and for acoustic phased array sonar or ultrasound systems.

Abstract: A phased array antenna system comprising a plurality of isotropic radiating elements and/or omnidirectional receiving elements addressing close in fields and a plurality of non-isotropic radiating elements and/or non-omnidirectional receiving elements addressing remote fields with the combined elements used to extend the maximum range of the antenna system without increasing the number of element nor the output power of the antenna. The non-isotropic radiating elements and/or the non-omnidirectional receiving elements can be formed by adding focusing structures such as lenses or reflective structures in the radiating path of isotropic radiating elements and/or omnidirectional receiving elements. Antennas with combined isotropic radiating and non-isotropic radiating elements can be utilized for electromagnetic phased array radar, communication and imaging systems and for acoustic phased array sonar or ultrasound systems.

Abstract: A phased array antenna system comprising a plurality of isotropic radiating elements and/or omnidirectional receiving elements addressing close in fields and a plurality of non-isotropic radiating elements and/or non-omnidirectional receiving elements addressing remote fields with the combined elements used to extend the maximum range of the antenna system without increasing the number of element nor the output power of the antenna. The non-isotropic radiating elements and/or the non-omnidirectional receiving elements can be formed by adding focusing structures such as lenses or reflective structures in the radiating path of isotropic radiating elements and/or omnidirectional receiving elements. Antennas with combined isotropic radiating and non-isotropic radiating elements can be utilized for electromagnetic phased array radar, communication and imaging systems and for acoustic phased array sonar or ultrasound systems.

Abstract: A phased array antenna system comprising a plurality of isotropic radiating elements and/or omnidirectional receiving elements addressing close in fields and a plurality of non-isotropic radiating elements and/or non-omnidirectional receiving elements addressing remote fields with the combined elements used to extend the maximum range of the antenna system without increasing the number of element nor the output power of the antenna. The non-isotropic radiating elements and/or the non-omnidirectional receiving elements can be formed by adding focusing structures such as lenses or reflective structures in the radiating path of isotropic radiating elements and/or omnidirectional receiving elements. Antennas with combined isotropic radiating and non-isotropic radiating elements can be utilized for electromagnetic phased array radar, communication and imaging systems and for acoustic phased array sonar or ultrasound systems.

Abstract: A phased array antenna system comprising: a first plurality of array elements, each array element in the first plurality comprising a radiating element having a generally isotropic radiating pattern and/or a receiving element having a generally omnidirectional field of view; and a second plurality of array elements, each array element in the second plurality comprising a radiating element having a non-isotropic radiating pattern and/or a receiving element having a non-omnidirectional field of view; wherein: the generally isotropic radiating pattern comprises a field of at least 120° in azimuth and 90° in elevation; the generally omnidirectional field of view comprises a field of at least 120° in azimuth and 90° in elevation; the non-isotropic radiating pattern comprises a field of less than half of the field of the generally isotropic radiating pattern in azimuth and/or elevation; and the non-omnidirectional field of view comprises a field of less than half of the field of the omnidirectional field of view.

Abstract: A phased array antenna system comprising: a first plurality of array elements, each array element in the first plurality comprising a radiating element having a generally isotropic radiating pattern and/or a receiving element having a generally omnidirectional field of view; and a second plurality of array elements, each array element in the second plurality comprising a radiating element having a non-isotropic radiating pattern and/or a receiving element having a non-omnidirectional field of view; wherein: the generally isotropic radiating pattern comprises a field of at least 120° in azimuth and 90° in elevation; the generally omnidirectional field of view comprises a field of at least 120° in azimuth and 90° in elevation; the non-isotropic radiating pattern comprises a field of less than half of the field of the generally isotropic radiating pattern in azimuth and/or elevation; and the non-omnidirectional field of view comprises a field of less than half of the field of the omnidirectional field of view.

Abstract: An electronics package includes a support substrate, an electrical component having a first surface coupled to a first surface of the support substrate, and an insulating structure coupled to the first surface of the support substrate and sidewalls of the electrical component. The insulating structure has a sloped outer surface. A conductive layer encapsulates the electrical component and the sloped outer surface of the insulating structure. A first wiring layer is formed on a second surface of the support substrate. The first wiring layer is coupled to the conductive layer through at least one via in the support substrate.

Abstract: An acoustic phased array antenna system comprising a plurality of omnidirectional receiving elements for addressing close-in fields and a plurality of non-omnidirectional receiving elements for addressing remote fields with the combined elements used to extend the maximum range of the antenna system. The non-omnidirectional receiving elements can be formed by adding focusing structures such as cylindrical or oval lenses in the receiving path of omnidirectional receiving elements. Antennas with a plurality of isotropic radiating and a plurality of non-isotropic radiating elements can be utilized for sonar and ultrasound systems. An acoustic phased array antenna system comprising a first plurality of receiving elements with a first field of view and a second plurality of receiving elements with a second field of view that is at least 50% narrower. An acoustic phased array with a plurality of isotropic radiators and a plurality of non-isotropic radiators to extend the range of the system.

Abstract: An electronics package includes an insulating substrate, an electrical component having an active surface coupled to a first surface of the insulating substrate, and an insulating structure disposed adjacent the electrical component on the first surface of the insulating substrate. A first wiring layer is formed on a top surface of the insulating structure and extends down at least one sloped side surface of the insulating structure. A second wiring layer is formed on a second surface of the insulating substrate. The second wiring layer extends through a plurality of vias in the insulating substrate to electrically couple at least one contact pad on the active surface of the electrical component to the first wiring layer.

Abstract: An electronics package includes an insulating substrate, an electrical component having a back surface coupled to a first surface of the insulating substrate, and an insulating structure surrounding at least a portion of a perimeter of the electrical component. A first wiring layer extends from the first surface of the insulating substrate and over a sloped side surface of the insulating structure to electrically couple with at least one contact pad on an active surface of the electrical component. A second wiring layer is formed on a second surface of the insulating substrate and extends through at least one via therein to electrically couple with the first wiring layer.

Abstract: An electronics package includes a multilayer interconnect structure comprising insulating substrate layers and conductor layers. The electronics package also includes an electrical component comprising I/O pads electrically coupled to the conductor layers and conductive through vias extending through at least two insulating substrate layers and electrically connected to at least a portion of the I/O pads. The conductor layers include a first conductor layer including a ground plane buried in the multilayer interconnect structure, the ground plane forming direct electrical and physical connections with a conductive through via electrically connected to a ground I/O pad of the plurality of I/O pads. The conductor layers also include a second conductor layer including a power plane buried in the multilayer interconnect structure, the power plane forming direct electrical and physical connections with a conductive through via that is electrically connected to a power I/O pad of the plurality of I/O pads.

Abstract: An electronics package includes a multilayer interconnect structure comprising insulating substrate layers and conductor layers. The electronics package also includes an electrical component comprising I/O pads electrically coupled to the conductor layers and conductive through vias extending through at least two insulating substrate layers and electrically connected to at least a portion of the I/O pads. The conductor layers include a first conductor layer including a ground plane buried in the multilayer interconnect structure, the ground plane forming direct electrical and physical connections with a conductive through via electrically connected to a ground I/O pad of the plurality of I/O pads. The conductor layers also include a second conductor layer including a power plane buried in the multilayer interconnect structure, the power plane forming direct electrical and physical connections with a conductive through via that is electrically connected to a power I/O pad of the plurality of I/O pads.

Abstract: An electronics package includes an insulating substrate, an electrical component having a back surface coupled to a first surface of the insulating substrate, and an insulating structure surrounding at least a portion of a perimeter of the electrical component. A first wiring layer extends from the first surface of the insulating substrate and over a sloped side surface of the insulating structure to electrically couple with at least one contact pad on an active surface of the electrical component. A second wiring layer is formed on a second surface of the insulating substrate and extends through at least one via therein to electrically couple with the first wiring layer.

Abstract: An electronics package includes a support substrate, an electrical component having a first surface coupled to a first surface of the support substrate, and an insulating structure coupled to the first surface of the support substrate and sidewalls of the electrical component. The insulating structure has a sloped outer surface. A conductive layer encapsulates the electrical component and the sloped outer surface of the insulating structure. A first wiring layer is formed on a second surface of the support substrate. The first wiring layer is coupled to the conductive layer through at least one via in the support substrate.

Abstract: A reconfigured semiconductor logic device includes a semiconductor logic device comprising a plurality of input/output (I/O) pads formed on an active surface thereof and a redistribution layer. The redistribution layer comprises an insulating layer formed atop the active surface of the semiconductor logic device such that the insulating layer does not extend beyond an outer perimeter of the active surface and a patterned conductive wiring layer positioned above the insulating layer. The patterned conductive wiring layer includes a plurality of terminal buses formed on a top surface of the insulating layer. Each terminal bus of the plurality of terminal buses is electrically coupled to multiple I/O pads of the plurality of I/O pads through vias formed in the insulating layer.

Abstract: An electronics package includes a support substrate, an electrical component having a first surface coupled to a first surface of the support substrate, and an insulating structure coupled to the first surface of the support substrate and sidewalls of the electrical component. The insulating structure has a sloped outer surface. A conductive layer encapsulates the electrical component and the sloped outer surface of the insulating structure. A first wiring layer is formed on a second surface of the support substrate. The first wiring layer is coupled to the conductive layer through at least one via in the support substrate.

Abstract: An electronics package includes an insulating substrate, an electrical component having a back surface coupled to a first surface of the insulating substrate, and an insulating structure surrounding at least a portion of a perimeter of the electrical component. A first wiring layer extends from the first surface of the insulating substrate and over a sloped side surface of the insulating structure to electrically couple with at least one contact pad on an active surface of the electrical component. A second wiring layer is formed on a second surface of the insulating substrate and extends through at least one via therein to electrically couple with the first wiring layer.

Abstract: An electronics package is disclosed that comprises a multilayer interconnect structure including a plurality of insulating substrate layers each having a plurality of microvias formed therein, a plurality of conductive wiring layers positioned on the plurality of insulating substrate layers, and a plurality of conductive microvias in the plurality of microvias to, wherein a bottom wiring layer includes a plurality of first terminal pads that are positioned on a bottom surface of the multilayer interconnect structure. The electronics package also comprises an electrical component coupled to the bottom surface of the multilayer interconnect structure, the electrical component including first I/O pads aligned with the first terminal pads and second I/O pads aligned to regions of the multilayer interconnect structure without first terminal pads.

Abstract: An embedded electronics package and method of manufacture includes a support substrate, a power semiconductor component coupled to a first side of the support substrate, and a logic semiconductor component coupled to a second side of the support substrate, opposite the first side. A first insulating material surrounds the logic semiconductor component. A logic interconnect layer is electrically coupled to the logic semiconductor component by at least one conductive micro-via extending through a portion of the first insulating material. A power interconnect layer is electrically coupled to the power semiconductor component by at least one conductive macro-via extending through a thickness of the support substrate. The power interconnect layer is thicker than the logic interconnect layer.

Abstract: An electromagnetic phased array antenna system comprising a plurality of isotropic radiating elements addressing close in fields and a plurality of non-isotropic radiating elements addressing remote fields with the combined elements used to extend the maximum range of the antenna system. The non-isotropic radiating elements can be formed by adding focusing structures such as lenses or horns in the radiating path of isotropic radiating elements. Antennas with combined isotropic radiating and non-isotropic radiating elements can be utilized for radar, communication and imaging systems. An electromagnetic phased array antenna system comprising a first plurality of radiating elements with a first field of view and a second plurality of radiating elements with a second field of view that is at least 50% narrower. An electromagnetic phased array antenna system with a plurality of omnidirectional receivers and a plurality of non-omnidirectional receivers to extend the far range of the system.