Patents by Inventor Ren Lai

Ren Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250241837
    Abstract: The present disclosure belongs to the technical field of cosmetic preparation and provides a modified cone snail polypeptide, preparation method and use thereof. The amino acid residues are modified on the basis of the wild-type ?-cone snail polypeptide PIIIA, and the blocking effect of ?-cone snail polypeptide on sodium channels is moderately weakened, while maintaining stability under acidic and alkaline conditions and maintaining the stability of the isoelectric point and the target specificity. The modified cone snail polypeptide provided by the present disclosure has the characteristics of high stability and low production cost. The modified cone snail polypeptide after transformation and modification retains a strong anti-wrinkle function. The modified cone snail polypeptide avoids facial muscle stiffness and paralysis resulting from excessive inhibition of skeletal muscle sodium channel Nav1.4.
    Type: Application
    Filed: November 9, 2023
    Publication date: July 31, 2025
    Inventors: Ren LAI, Fuwen WEI, Aili WANG, Wenliang ZHOU
  • Patent number: 12355251
    Abstract: An energy storage system and a control method thereof are provided. The control method includes steps of: (a) providing an energy storage system including N energy storage modules; (b) obtaining a first sequence and a second sequence by sorting the N energy storage units based on the quantity of electricity in descending order and ascending order respectively; (c) determining a required power of the power grid according to a grid frequency; (d) when the required power is positive, controlling first X energy storage units in the first sequence to discharge for collectively providing an electrical energy, having same magnitude with the required power, to the power grid; and (e) when the required power is negative, controlling first Y energy storage units in the second sequence to collectively receive an electrical energy, having same magnitude with the required power, from the power grid for charging.
    Type: Grant
    Filed: December 7, 2023
    Date of Patent: July 8, 2025
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hsueh-Han Lu, Ying-Chuan Huang, Mu-Jhen Lin, Chao-Yuan Lai, Ya-Chen Chen, Hung-Ren Lai
  • Publication number: 20250200710
    Abstract: This disclosure provides systems, methods, and devices for image capture that support image processing. In a first aspect, a method of image processing includes receiving first image data from a first image sensor; receiving second image data from a second image sensor of a second camera, wherein at least one of the first image data or the second image data is received through a variable aperture (VA) having an adjusted aperture setting applied by the first camera or the second camera; and/or determining a first output frame based on the first image data and the second image data by adjusting the second image data to match a characteristic of the first image data. Other aspects and features are also claimed and described.
    Type: Application
    Filed: May 10, 2022
    Publication date: June 19, 2025
    Inventors: Wen-Chun Feng, Yu-Ren Lai, Hsin Yueh Chang, Hanlu Zhu
  • Publication number: 20250126365
    Abstract: This disclosure provides systems, methods, and devices for image signal processing that provide transitioning between cameras of different dynamic range capability. In a first aspect, a method of image processing includes receiving first image data comprising first image frames from a first camera having a first dynamic range capability and second image data comprising second image frames from a second camera having a second dynamic range capability; determining a dynamic range of a representation of a scene in the first image frames satisfies first criteria; when the dynamic range satisfies the first criteria, determining output image frames based on a first image frames and the second image frames by processing the first image frames and the second image frames to determine the output image frames having a transition from the first dynamic range capability to the second dynamic range capability. Other aspects and features are also claimed and described.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 17, 2025
    Inventors: Wen-Chun Feng, Hsin Yueh Chang, Yu-Ren Lai
  • Publication number: 20250111525
    Abstract: This disclosure provides systems, methods, and devices for image processing. In a first aspect, a method of image processing includes receiving first image data from a first camera of an image capture device, wherein the first camera is different from a second camera of the image capture device; determining a first portion of the first image data; transforming the first portion of the first image data with a first strength based on an alignment difference between the first camera and the second camera; transforming a second portion of the first image data with a second strength based on the alignment difference between the first camera and the second camera; and determining a first output image frame based on the first image data after transforming the first portion of the first image data and transforming the second portion of the first image data. Other aspects and features are also described.
    Type: Application
    Filed: March 25, 2022
    Publication date: April 3, 2025
    Inventors: Wen-Chun Feng, Jie Song, Yu-Ren Lai, Shizhong Liu, Weiliang Liu
  • Patent number: 12266612
    Abstract: A device includes an interposer, which includes a substrate having a top surface. An interconnect structure is formed over the top surface of the substrate, wherein the interconnect structure includes at least one dielectric layer, and metal features in the at least one dielectric layer. A plurality of through-substrate vias (TSVs) is in the substrate and electrically coupled to the interconnect structure. A first die is over and bonded onto the interposer. A second die is bonded onto the interposer, wherein the second die is under the interconnect structure.
    Type: Grant
    Filed: December 1, 2023
    Date of Patent: April 1, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun Ren Lai, Yung-Chi Lin
  • Publication number: 20250083552
    Abstract: The present disclosure provides a charging management system including a memory device and a processor. The memory device is configured to store a plurality of preset algorithms and a plurality of custom algorithms. The processor determines at least one of the preset algorithms and at least one of the custom algorithms according to a distribution strategy associated with a charging hub, to allocate an available power to a plurality of charging points of the charging hub. The processor allocates a partial amount of the available power to the charging points according to the first subset of the preset algorithms, and distributes a remaining amount of the available power to the charging points according to the first subset of the custom algorithms, in which the remaining amount of the available power is derived by subtracting the partial amount of the available power from the available power.
    Type: Application
    Filed: February 21, 2024
    Publication date: March 13, 2025
    Inventors: Jyun-Kai CHEN, Shih-Hung LIU, Tse-Hsing YEH, Hung-Ren LAI
  • Publication number: 20250088001
    Abstract: An energy storage system and a control method thereof are provided. The control method includes steps of: (a) providing an energy storage system including N energy storage modules; (b) obtaining a first sequence and a second sequence by sorting the N energy storage units based on the quantity of electricity in descending order and ascending order respectively; (c) determining a required power of the power grid according to a grid frequency; (d) when the required power is positive, controlling first X energy storage units in the first sequence to discharge for collectively providing an electrical energy, having same magnitude with the required power, to the power grid; and (e) when the required power is negative, controlling first Y energy storage units in the second sequence to collectively receive an electrical energy, having same magnitude with the required power, from the power grid for charging.
    Type: Application
    Filed: December 7, 2023
    Publication date: March 13, 2025
    Inventors: Hsueh-Han LU, Ying-Chuan HUANG, Mu-Jhen LIN, Chao-Yuan LAI, Ya-Chen CHEN, Hung-Ren LAI
  • Publication number: 20240387393
    Abstract: A device includes an interposer, which includes a substrate having a top surface. An interconnect structure is formed over the top surface of the substrate, wherein the interconnect structure includes at least one dielectric layer, and metal features in the at least one dielectric layer. A plurality of through-substrate vias (TSVs) is in the substrate and electrically coupled to the interconnect structure. A first die is over and bonded onto the interposer. A second die is bonded onto the interposer, wherein the second die is under the interconnect structure.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Inventors: Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun Ren Lai, Yung-Chi Lin
  • Publication number: 20240303779
    Abstract: This disclosure provides systems, methods, and devices for image signal processing that support adjusting a Bokeh effect in image data. In a first aspect, a method of image processing includes receiving a first user input specifying a first depth of focus. A camera is configured with a first aperture size of a plurality of aperture sizes of the camera that is nearest a second aperture size that corresponds to the first depth of focus. The first aperture size is smaller than the second aperture size. Image data representing a scene is received that is captured with the first aperture size of the camera. First modified image data is determined by applying a first blur kernel to the image data. The first modified image data represents the scene at the depth of focus corresponding to the second aperture size. Other aspects and features are also claimed and described.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 12, 2024
    Inventors: Wen-Chun Feng, Yu-Ren Lai, Su-Chin Chiu
  • Patent number: 12076364
    Abstract: An agent for inhibiting binding of transferrin receptor to SARS-CoV-2 spike protein or an anti-SARS-CoV-2 medicament is provided, where active pharmaceutical ingredients of the agent or the medicament include interference peptides, and the interference peptides include: SL8, FG8, DL12, RK4, SD6, HF7, and/or QK8.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: September 3, 2024
    Assignee: KUNMING INSTITUTE OF ZOOLOGY, CHINESE ACADEMY OF SCIENCES
    Inventors: Ren Lai, Xiaopeng Tang, Zhiyi Liao
  • Publication number: 20240144717
    Abstract: Disclosed are systems, apparatuses, processes, and computer-readable media to capture images. A method of processing image data includes determining a first region of interest (ROI) in an image. The first ROI is associated with a first object. The method can include determining one or more image characteristics of the first ROI. The method can further include determining whether to perform an upsampling process on image data in the first ROI based on the one or more image characteristics of the first ROI.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 2, 2024
    Inventors: Wen-Chun FENG, Kai LIU, Su-Chin CHIU, Chung-Yan CHIH, Yu-Ren LAI
  • Publication number: 20240105632
    Abstract: A device includes an interposer, which includes a substrate having a top surface. An interconnect structure is formed over the top surface of the substrate, wherein the interconnect structure includes at least one dielectric layer, and metal features in the at least one dielectric layer. A plurality of through-substrate vias (TSVs) is in the substrate and electrically coupled to the interconnect structure. A first die is over and bonded onto the interposer. A second die is bonded onto the interposer, wherein the second die is under the interconnect structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Inventors: Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun Ren Lai, Yung-Chi Lin
  • Patent number: 11863881
    Abstract: The present disclosure provides systems, apparatus, methods, and computer-readable media that support multi-frame depth-of-field (MF-DOF) for deblurring background regions of interest (ROIs), such as background faces, that may be blurred due to a large aperture size or other characteristics of the camera used to capture the image frame. The processing may include the use of two image frames obtained at two different focus points corresponding to the multiple ROIs in the image frame. The corrected image frame may be determined by deblurring one or more ROIs of the first image frame using an AI-based model and/or local gradient information. The MF-DOF may allow selectively increasing a depth-of-field (DOF) of an image to provide focused capture of multiple regions of interest, without causing a reduction in aperture (and subsequently an amount of light available for photography) or background blur that may be desired for photography.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: January 2, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Wen-Chun Feng, Yu-Ren Lai, Hsin Yueh Chang
  • Patent number: 11854990
    Abstract: A device includes an interposer, which includes a substrate having a top surface. An interconnect structure is formed over the top surface of the substrate, wherein the interconnect structure includes at least one dielectric layer, and metal features in the at least one dielectric layer. A plurality of through-substrate vias (TSVs) is in the substrate and electrically coupled to the interconnect structure. A first die is over and bonded onto the interposer. A second die is bonded onto the interposer, wherein the second die is under the interconnect structure.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun Ren Lai, Yung-Chi Lin
  • Publication number: 20230342889
    Abstract: Systems, methods, and non-transitory media are provided for frequency domain edge enhancement of multi-exposure high dynamic range (HDR) images. An example method can include determining an alignment between an HDR frame and a frame having an exposure time above a threshold; adjusting the frame based on the alignment; determining a gradient estimation map representing differences between image blocks in the HDR frame and image blocks in the frame; and generating, based on the gradient estimation map, a merged frame that includes a combination of at least some image data from the HDR frame and at least some image data from the frame.
    Type: Application
    Filed: April 26, 2022
    Publication date: October 26, 2023
    Inventors: Wen-Chun FENG, Hsuan-Ying LIAO, Hsin Yueh CHANG, Yu-Ren LAI, Shizhong LIU, Weiliang LIU
  • Patent number: 11792505
    Abstract: Systems and techniques are provided for processing image data. According to some aspects, a process can include obtaining a frame captured using an image sensor of a device. The process can include detecting an orientation of the device using a position sensor. The process can further include determining, based on the orientation, a transform to be applied to a region of interest in the frame. The process can include applying the transform to the region of interest. The process can further include providing the transformed region of interest to the object detection algorithm.
    Type: Grant
    Filed: February 2, 2022
    Date of Patent: October 17, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Wen-Chun Feng, Yu-Ren Lai, Hsin Yueh Chang
  • Publication number: 20230319401
    Abstract: Disclosed are systems, apparatuses, processes, and computer-readable media to capture images with subjects at different depths of fields. A method of processing image data includes determining, based on a depth map of a previously captured image, a first distance to a first object and a second distance to a second object; identifying a focal point of a camera lens at least in part using the first distance and the second distance; capturing an image using the focal point as a basis for the capture, the image including a first region corresponding to the first object and a second region corresponding to the second object; and generating a second image from the image at least in part by enhancing at least one of the first region or the second region using a point spread function (PSF).
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Inventors: Wen-Chun FENG, Su-Chin CHIU, Yu-Ren LAI, Hang-Wei LIAW, Jian-Jia SU
  • Patent number: 11756221
    Abstract: Image processing performed on images captured with image capture devices may be used to improve upon some of the problems with images captured from devices, including images captured from devices with larger aperture lenses, and, in some particular examples, mobile devices with larger aperture lenses. Multiple images may be captured by the capture device and processing applied to generate a single image through fusing of the multiple images. One potential benefit obtained with fusion of multiple images is a single image with an effective depth of focus (DOF) larger than that available in a single image obtained from the capture device. The DOF of the fused image may be larger than a single image and/or may include multiple distinct in-focus focal distances, whereas a single image from a single capture device has only a single in-focus focal distance.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: September 12, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Wen-Chun Feng, Hsuan-Ming Liu, Yu-Ren Lai
  • Publication number: 20230060040
    Abstract: The present disclosure provides use of transferrin, a transferrin receptor and an antibody thereof in the preparation of an anti-SARS-CoV-2 drug. Use of the transferrin, the transferrin receptor or the transferrin receptor antibody in the preparation of an anti-SARS-CoV-2 drug is provided. Both surface plasmon resonance (SPR) and immunofluorescence confirm that the SARS-CoV-2 binds to the transferrin receptor through SARS-CoV-2 spike protein; the transferrin and/or the transferrin receptor antibody competitively bind(s) to the transferrin receptor of the body, or the transferrin receptor competitively binds to a site of the SARS-CoV-2 to inhibit binding of the SARS-CoV-2 to the transferrin receptor of the body; thus, the opportunity that the SARS-CoV-2 infects cells is blocked, and the antiviral effect of the body is realized.
    Type: Application
    Filed: June 29, 2020
    Publication date: February 23, 2023
    Inventors: Ren LAI, Xiaozhong PENG, Xiaopeng TANG, Zhiyi LIAO, Shuaiyao LU, Hongqi LIU