Patents by Inventor Ren Liu
Ren Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132410Abstract: The invention presents a near-infrared photothermal coupling curing non-oxide ceramic slurry, along with its preparation method and application. The ceramic slurry consists of various raw materials, with weight fractions as follows: non-oxide ceramic powder (40˜90 parts), photosensitive resin (0.5˜20 parts), photosensitive monomer (1˜40 parts), photoinitiator (0.25˜4 parts), thermal initiator (0.25˜4 parts), additive (0.75˜5 parts), and up-conversion luminescent material (0.5˜4 parts). The non-oxide ceramic powders can include Si3N4, TiN, BN, AlN, SiC, WC, TiC, ZrC, TiB2, and ZrB2. By combining the photochemical and photothermal dual curing system using near-infrared up-conversion, this invention addresses the issue of insufficient curing encountered in single photocuring or thermal curing processes.Type: ApplicationFiled: July 30, 2023Publication date: April 25, 2024Inventors: Ren LIU, Xinxin SANG, Yongqin ZHAO, Jiatao MIAO
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Publication number: 20240131486Abstract: A full-electric drive cementing control system is disclosed.Type: ApplicationFiled: March 15, 2022Publication date: April 25, 2024Applicant: YANTAI JEREH PETROLEUM EQUIPMENT & TECHNOLOGIES CO., LTD.Inventors: Pengyuan ZHANG, Kai WANG, Jihua WAN, Ren LIU, Jun WANG, Song ZHANG, Kaishen LIU, Shuzhen CUI, Zhuqing MAO, Weiwei LIU
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Publication number: 20240136447Abstract: A semiconductor device is provided. The semiconductor device includes a semiconductor substrate, a first deep well region, at least two second well regions, at least one isolation structure and an implantation region. The first deep well region is disposed in the semiconductor substrate, wherein the first deep well region has a first conductivity type. The second well regions are disposed on the first deep well region, wherein the second well regions have a second conductivity type. The isolation structure covers a portion of the first deep well region and surrounds at least a portion of the second well regions. The implantation region is located under a top surface of the semiconductor substrate, wherein the implantation region has a discontinuous portion, and the discontinuous portion partially overlaps the first deep well region.Type: ApplicationFiled: October 24, 2022Publication date: April 25, 2024Applicant: Vanguard International Semiconductor CorporationInventors: Chung-Ren LAO, Hsiao-Ying YANG, Hsing-Chao LIU, Ching-Chung CHEN
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Publication number: 20240132733Abstract: A method is described for preparing metal ink for additive manufacturing based on photo-thermal synergistic curing, relating to functional ink technology. The ink includes 50%-95% metal powder, 1%-35% photosensitive resin, 1%-35% photosensitive monomer, 0.1%-7% photoinitiator, 0.1%-5% thermal initiator, 0.1%-5% up-conversion material, and 0%-2% auxiliary agent. The method includes adding metal ink to the ink tank of a direct ink writing 3D printer, extruding the metal ink from the nozzle under computer control to the printing specific shapes on the platform, and curing under real-time illumination of a specific light source to obtain the green body. The method includes performing high-temperature debinding treatment on the obtained green body in a specific atmosphere. The treated green body is subjected to a high-temperature and high-pressure sintering treatment in a specific atmosphere and then cooled to room temperature.Type: ApplicationFiled: August 28, 2023Publication date: April 25, 2024Inventors: Ren LIU, Guo Wei, Junzhao Yuan, Xinxin Sang
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Publication number: 20240128214Abstract: An integrated circuit structure includes an aluminum pad layer on a dielectric stack, a passivation layer covering the aluminum pad layer, and an aluminum shield layer including aluminum routing patterns disposed directly above an embedded memory area and embedded in the dielectric stack. The aluminum shield layer is electrically connected to the uppermost copper layer through a plurality of tungsten vias. The plurality of tungsten vias is embedded in the dielectric stack.Type: ApplicationFiled: December 28, 2023Publication date: April 18, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Aaron Chen, Chi Ren, Yi Hsin Liu
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Publication number: 20240128928Abstract: A demodulation signal generator, coupled to an air-pulse generator comprising a flap pair, includes a resonance circuit. The resonance circuit produces a first demodulation signal and a second demodulation signal. The resonance circuit and the flap pair co-perform a resonance operation, such that the first demodulation signal and the second demodulation signal are generated via the co-performed resonance operation and have opposite polarity. The flap pair performs a differential movement to form an opening to perform a demodulation operation on a modulated air pressure variation.Type: ApplicationFiled: December 26, 2023Publication date: April 18, 2024Applicant: xMEMS Labs, Inc.Inventors: Jemm Yue Liang, Jing-Meng Liu, Jye Ren
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Patent number: 11957955Abstract: Provided is an electric lifting slope adjustment device having a vibration damping function and a treadmill. The electric lifting slope adjustment device includes: two lifting supports, a rotating shaft, a driving component and a vibration damping assembly; each of the lifting supports has a rotating end, and the rotating ends of the two lifting supports are rotatably connected to a first inner wall and a second inner wall respectively; the driving component is hinged to a third inner wall, the driving component includes a lifting motor and a lifting rod, a driving end of the lifting motor is connected to the lifting rod; the vibration damping assembly includes a mounting frame and a vibration damping spring, and a compression direction of the vibration damping spring is perpendicular to an axis of the rotating shaft.Type: GrantFiled: December 26, 2023Date of Patent: April 16, 2024Inventors: Ren Liu, Jinsong Fan
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Patent number: 11947426Abstract: Embodiments of the present disclosure relate to a method, an electronic device, and a computer program product for recommending a protection strategy. The method includes obtaining contents of attributes of a plurality of data assets adjusted. The method further includes generating a plurality of vector representations for the plurality of data assets based on the contents of the attributes. The method further includes dividing the plurality of data assets into at least one category based on the plurality of vector representations. The method further includes if it is determined that a protection strategy for one data asset in the at least one category exists, determining the protection strategy as a recommended strategy for another data asset in the at least one category.Type: GrantFiled: November 10, 2021Date of Patent: April 2, 2024Assignee: EMC IP HOLDING COMPANY LLCInventors: Ren Wang, Qi Wang, Yun Zhang, Ming Zhang, Weiyang Liu
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Patent number: 11938673Abstract: The invention relates to the use of a compatible thermoplastic material (film, sheet, or raft) as the base sheet or layer for 3-D printing an article. The use of the base film provides a means of printing a large article, and of reducing warpage by printing directly on the film. The printed article adheres to the film better than to traditional printer surfaces (glass, metal, glue, or reusable films), because the printed article and film weld together by forming chain entanglements, due to being compatible, miscible, or semi-miscible in the melt.Type: GrantFiled: September 28, 2018Date of Patent: March 26, 2024Assignee: ARKEMA INC.Inventors: David Shin-Ren Liu, Camille Khadraoui, Mark A. Aubart
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Publication number: 20240096834Abstract: A method is provided. The method includes determining a first bump map indicative of a first set of positions of bumps. The method includes determining, based upon the first bump map, a first plurality of bump densities associated with a plurality of regions of the first bump map. The method includes smoothing the first plurality of bump densities to determine a second plurality of bump densities associated with the plurality of regions of the first bump map. The method includes determining, based upon the second plurality of bump densities, a second bump map indicative of the first set of positions of the bumps and a set of sizes of the bumps.Type: ApplicationFiled: March 27, 2023Publication date: March 21, 2024Inventors: Shih Hsuan HSU, Chan-Chung CHENG, Chun-Chen LIU, Cheng-Hung CHEN, Peng-Ren CHEN, Wen-Hao CHENG, Jong-l MOU
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Publication number: 20240084450Abstract: A shower head structure and a plasma processing apparatus are provided. The shower head structure includes a plate body with a first zone and a second zone on a first surface. A plurality of first through holes are in the first zone, each of the first through holes having a diameter uniform with others of the first through holes. A plurality of second through holes are in the second zone. The first zone is in connection with the second zone, and the diameter of each of the first through holes is greater than a diameter of each of the second through holes. A plasma processing apparatus includes the shower head structure is also provided.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: HUAN-CHIEH CHEN, JHIH-REN LIN, TAI-PIN LIU, SHYUE-SHIN TSAI, KEITH KUANG-KUO KOAI
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Publication number: 20240088775Abstract: A power conversion apparatus and an energy storage system, including a power conversion circuit, a first power terminal, a second power terminal, and a third power terminal. The power conversion circuit includes a first positive end, a first negative end, a second positive end, a second negative end, and at least one power device. The first negative end and the second negative end have a same potential. The power conversion circuit is configured to convert a first voltage input by a first device into a second voltage and output the second voltage to a second device. The first power terminal is connected to the first positive end, the first negative end or the second negative end is connected to the second power terminal, and the third power terminal is connected to the second positive end.Type: ApplicationFiled: September 13, 2023Publication date: March 14, 2024Applicant: Huawei Digital Power Technologies Co., Ltd.Inventors: Baoguo CHEN, Ren SHENG, Rui GE, Ling LIU
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Publication number: 20240034766Abstract: Anti-angiogenic agents or polypeptides have an amino acid segment substantially similar to domain one of CD2. The polypeptide has a ?-sheet formed by two segments. Methods of using such agents and polypeptide are also included.Type: ApplicationFiled: February 14, 2023Publication date: February 1, 2024Inventors: Zhi-Ren Liu, Jenny Yang
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Patent number: 11845792Abstract: This application provides, inter alia, antibodies or antigen-binding fragments thereof, targeting cell surface GRP78 expressed on tumor cells, tumor endothelial cells, and tumor initiating cancer cells. These anti-GRP78 antibodies, or antigen-binding fragments thereof, have a high affinity for GRP78 and are less immunogenic compared to their unmodified parent antibodies in a given species, e.g., a human, and function to inhibit GRP78. Importantly, these isolated novel antibodies and antigen-binding fragments thereof, attenuate PI3K signaling and promote apoptosis in tumor cells, while leaving normal cells unaffected. The antibodies and antigen-binding fragments are useful for UPR-targeted cancer therapeutic treatments.Type: GrantFiled: October 22, 2020Date of Patent: December 19, 2023Assignee: University of Southern CaliforniaInventors: Parkash Gill, Ren Liu, Amy Lee
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Publication number: 20230364879Abstract: Provided a device and method for paperboard stamping forming, relates to the technical field of paper material stamping forming equipment, comprising a punch-pin and a pressure-applying component, the pressure-applying component acting on a paperboard through a fluid medium; before the punch-pin carries out a stamping forming on the paperboard, the pressure-applying component pre-deforms the paperboard and a direction of the pre-deformation is opposite to a direction of the stamping forming; aiming to the current problem that the forming depth that is difficult to meet requirements resulted in the paperboard forming paper container limited by the deformation capacity of the paperboard, the forming depth of the paper container is improved by making the paperboard deform twice in opposite directions, bringing into play the deformation capacity of the full area of the paperboard, increasing the deformable amount of the paperboard, and reducing problems such as cracks and breakage in the forming process.Type: ApplicationFiled: September 14, 2022Publication date: November 16, 2023Applicant: SHANDONG UNIVERSITYInventors: Zhong JI, Ying GAO, Guoxin LU, Ren LIU
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Publication number: 20230268841Abstract: A converting circuit and a charging apparatus and relates to the field of electronic technologies. In the converting circuit, two groups of parallel connected primary-side converting circuits are connected in a one-to-one correspondence with a primary side of a first transformer and a primary side of a second transformer, and two groups of parallel connected secondary-side converting circuits are connected in a one-to-one correspondence with a secondary side of the first transformer and a secondary side of the second transformer, and the two groups of parallel connected primary-side converting circuits or the two groups of parallel connected secondary-side converting circuits include a first input end and a second input end separately connected to a primary side of a third transformer. Therefore, a primary-side converting circuit does not need to be disposed for the third transformer, to effectively reduce circuit complexity and reduce the circuit costs.Type: ApplicationFiled: February 15, 2023Publication date: August 24, 2023Applicant: Huawei Digital Power Technologies Co., Ltd.Inventors: Ren LIU, Weiping LIU, Shanchuan SHI
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Publication number: 20230179011Abstract: Embodiments of this application provide a voltage conversion circuit, a control method, a DC/DC converter and a device. The voltage conversion circuit includes a failure isolation module, a soft start module, and a voltage conversion module. The voltage conversion module includes an output filter capacitor. Both a first terminal of the failure isolation module and a first terminal of the soft start module are connected to a positive electrode of a first battery, both a second terminal of the failure isolation module and a second terminal of the soft start module are connected to a first terminal of the output filter capacitor, and a second terminal of the output filter capacitor is connected to a negative electrode of the first battery. The soft start module is configured to connect the first battery and the output filter capacitor, so that the first battery charges the output filter capacitor.Type: ApplicationFiled: January 30, 2023Publication date: June 8, 2023Applicant: Huawei Digital Power Technologies Co., Ltd.Inventors: Tao Liang, Weiping Liu, Ren Liu, Dong Li
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Publication number: 20230159739Abstract: An acrylic alloy composition that can be 3-D printed by a material extrusion additive manufacturing process, an acrylic filament that has a very uniform diameter useful in the extrusion additive manufacturing process, acrylic articles made from the acrylic alloy composition by a material extrusion additive process, and a material extrusion additive manufacturing process for producing the acrylic articles. The acrylic alloy composition is an alloy of an acrylic polymer, and a low melt viscosity polymer, such as polylactic acid. The alloy may optionally be impact modified, preferably with hard core core-shell impact modifiers.Type: ApplicationFiled: January 23, 2023Publication date: May 25, 2023Applicant: Arkema FranceInventors: David Shin-Ren LIU, Jack J. REILLY, Mark A. AUBART
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Patent number: 11623968Abstract: A method for making xanthan gum copolymer nanomicelles comprising: 1) degrading xanthan gum in aqueous solution to obtain degraded xanthan gum; 2) preparing xanthan gum bromide from the degraded xanthan gum; 3) preparing xanthan gum copolymer from the xanthan gum bromide and 4) making the gum copolymer nanomicelles from the xanthan gum copolymer. The xanthan gum copolymer nanomicelles have good morphological regularity, good biocompatibility and stable performance as an anticancer drug carriers.Type: GrantFiled: November 26, 2019Date of Patent: April 11, 2023Assignee: JIANGNAN UNIVERSITYInventors: Liping Zhang, Caihua Ni, Ren Liu, Gang Wang
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Patent number: 11578114Abstract: Anti-angiogenic agents or polypeptides have an amino acid segment substantially similar to domain one of CD2. The polypeptide has a ?-sheet formed by two segments. Methods of using such agents and polypeptide are also included.Type: GrantFiled: October 30, 2015Date of Patent: February 14, 2023Inventors: Zhi-Ren Liu, Jenny Yang, Yin Lu