Abstract: A wafer-level-based packaging concept for MEMS components having at least one diaphragm structure formed in the component front side is described, according to which an interposer is connected to the front side of the MEMS component, which has at least one passage aperture as an access opening to the diaphragm structure of the MEMS component and which is provided with electrical through contacts so that the MEMS component is electrically contactable via the interposer. The cross-sectional area of the at least one passage aperture in the interposer is to be designed as significantly smaller than the lateral extension of the diaphragm structure of the MEMS component. The at least one passage aperture opens into a cavity between the diaphragm structure and the interposer.

Abstract: A component support allows cost-effective, space-saving and low-stress packaging of MEMS components having a sensitive structure. The component support is suited, in particular, for MEMS components, which are mounted in the cavity of a housing and are intended to be electrically contacted. The component support is produced as a composite part in the form of a hollow body open on one side, the composite part being made essentially of a three-dimensionally shaped carrier foil flexible in its shaping, and an encasing material. The encasing material is molded onto one side of the carrier foil, so that the carrier foil is situated on the inner wall of the component support. At least one mounting surface for at least one component is formed on the inner wall having the carrier foil. The carrier foil is also provided with contact surfaces and insulated conductive paths for electrically contacting the at least one component.

Abstract: A cost-effective and space-saving component that includes a MEMS element and an access channel to the membrane structure of the MEMS element. The MEMS element is mounted by the rear side of the component on a substrate and is at least partially embedded in a molding compound. An access port is formed in the molding compound. The component also includes at least one semiconductor component having at least one through hole that is integrated in the molding compound above the MEMS element at a distance from the membrane structure, so that a hollow space is located between the semiconductor component and the membrane structure. The access port in the molding compound opens into the through hole of the semiconductor component and, together with this and the hollow space between the further semiconductor component and the membrane structure, forms the access channel to the membrane structure.

Abstract: A method for producing an electrical circuit includes providing a main printed circuit board having a plurality of metalized plated-through holes through the main printed circuit board along at least one separating line between adjacent printed circuit board regions of the main printed circuit board. Each printed circuit board region has electrical contact connection pads on at least the main surface of the printed circuit board region that is to be populated, electrical lines for connection between the plurality of plated-through holes and the contact connection pads, and at least one semiconductor chip electrically contact-connected by means of the contact connection pads. The main printed circuit board is covered with a potting compound across the printed circuit board regions with the semiconductor chips.

Abstract: A method for producing a microfluidic system, containing at least one microfluidic component having at least one microfluidically active surface is disclosed. The method includes providing a microfluidic composite substrate having a connection side, comprising at least one microfluidic component introduced into a polymer composition, wherein the microfluidically active surface of said component forms a part of the connection side of the microfluidic composite substrate. The method further includes providing a mating substrate having a connection side for connection to the microfluidic composite substrate. Also, the method includes providing microfluidic structures at least on the connection side of the composite substrate and/or on the connection side of the mating substrate at least for the purpose of forming a microfluidic channel structure in the microfluidic system.

Abstract: A microfluidic system for purposes of analysis and diagnosis is made up of layers arranged substantially one above the other. The microfluidic system includes at least a first and a second conducting-through layer, which respectively comprise at least one channel for a fluid to be conducted through in the respective conducting-through layer. The microfluidic system further includes at least one chip layer, which comprises at least one active, micromechanical element, the active, micromechanical element being in operative connection with at least one of the channels, and the chip layer being arranged between the first and the second conducting-through layer, and the channels being fluidically connected to one another. A corresponding production method is disclosed in addition to the microfluid system.

Abstract: In a method for hot embossing at least one conductor track onto a substrate, a film having at least one electrically conductive layer is pressed against the substrate in a die direction using an embossing die having a structured die surface. The film remains on the substrate after ending the embossing process in at least two structure planes, which are spaced apart in the die direction.

Abstract: A leadless package for semiconductor elements has at least two semiconductor elements which are situated on a connection region of a lead frame of the leadless package in such a way that when deformations of the semiconductor elements occur, the deformations of the semiconductor elements compensate one another.