Abstract: A method of component management in a substrate processing system is disclosed. The substrate processing system has a set of components, at least a plurality of components of the set of components being designated to be smart components, each component of the plurality of components having an intelligent component enhancement (ICE). The method includes querying the plurality of components to request their respective unique identification data from their respective ICEs. The method further includes receiving unique identification data from the plurality of components if any of the plurality of components responds to the querying. The method additionally includes flagging the first component for corrective action if a first component of the plurality of components fails to provide first component unique identification data when the first component identification data is expected.

Abstract: A method of component management in a substrate processing system is disclosed. The substrate processing system has a set of components, at least a plurality of components of the set of components being designated to be smart components, each component of the plurality of components having an intelligent component enhancement (ICE). The method includes querying the plurality of components to request their respective unique identification data from their respective ICEs. The method further includes receiving unique identification data from the plurality of components if any of the plurality of components responds to the querying. The method additionally includes flagging the first component for corrective action if a first component of the plurality of components fails to provide first component unique identification data when the first component identification data is expected.

Abstract: An etch processor for etching a wafer includes a chuck for holding the wafer and a temperature sensor reporting a temperature of the wafer. The chuck includes a heater controlled by a temperature control system. The temperature sensor is operatively coupled to the temperature control system to maintain the temperature of the chuck at a selectable setpoint temperature. A first setpoint temperature and a second setpoint temperature are selected. The wafer is placed on the chuck and set to the first setpoint temperature. The wafer is then processed for a first period of time at the first setpoint temperature and for a second period of time at the second setpoint temperature.

Abstract: A component delivery mechanism for distributing a component inside a process chamber is disclosed. The component is used to process a work piece within the process chamber. The component delivery mechanism includes a plurality of component outputs for outputting the component to a desired region of the process chamber. The component delivery mechanism further includes a spatial distribution switch coupled to the plurality of component outputs. The spatial distribution switch is arranged for directing the component to at least one of the plurality of component outputs. The component delivery mechanism also includes a single component source coupled to the spatial distribution switch. The single component source is arranged for supplying the component to the spatial distribution switch.

Abstract: A component delivery mechanism for distributing a component inside a process chamber is disclosed. The component is used to process a work piece within the process chamber. The component delivery mechanism includes a plurality of component outputs for outputting the component to a desired region of the process chamber. The component delivery mechanism further includes a spatial distribution switch coupled to the plurality of component outputs. The spatial distribution switch is arranged for directing the component to at least one of the plurality of component outputs. The component delivery mechanism also includes a single component source coupled to the spatial distribution switch. The single component source is arranged for supplying the component to the spatial distribution switch.

Abstract: An etch processor for etching a wafer includes a chuck for holding the wafer and a temperature sensor reporting a temperature of the wafer. The chuck includes a heater controlled by a temperature control system. The temperature sensor is operatively coupled to the temperature control system to maintain the temperature of the chuck at a selectable setpoint temperature. A first setpoint temperature and a second setpoint temperature are selected. The wafer is placed on the chuck and set to the first setpoint temperature. The wafer is then processed for a first period of time at the first setpoint temperature and for a second period of time at the second setpoint temperature.

Abstract: A method and apparatus for calibrating a semi-empirical process simulator used to determine process values in a plasma process for creating a desired surface profile on a process substrate includes providing a test model which captures all mechanisms responsible for profile evolution in terms of a set of unknown surface parameters. A set of test conditions is derived for which the profile evolution is governed by only a limited number of parameters. For each set of test conditions, test values are selected and a test substrate is actually subjected to a test process defined by the test values, thereby creating a test surface profile. The test values are used to generate an approximate profile prediction and are adjusted to minimize the discrepancy between the test surface profile and the approximate profile prediction, thereby providing a final model of the profile evolution in terms of the process values.

Abstract: The invention provides a method for predicting a process surface profile that a given plasma process will create on a process substrate. The prediction is based on a test surface profile, the experimental outcome of a test process which is in general different from the plasma process of interest. In another aspect, the invention provides a technique for defining a plasma process that will produce a desired surface profile. Thus, in related aspects, the invention also provides apparatus for predicting a process surface profile and determining process values, a method of configuring a plasma reactor, a method of making semiconductor devices requiring limited empirical calibration, and a device made according to the method.

Abstract: Applicants have discovered that gallium arsenide surfaces can be dry passivated without heating or ion bombardment by exposing them downstream to ammonia plasma formation. Specifically, a workpiece having exposed gallium arsenide surfaces is passivated by placing the workpiece in an evacuable chamber, evacuating in the chamber, generating an ammonia plasma removed from the immediate vicinity of the workpiece, and causing the plasma products to flow downstream into contact with the workpiece. Preferably the plasma gas pressure is 0.5 to 6.0 Torr, the substrate temperature is less than 100.degree. C. and the time of exposure is in excess of 5 min. The plasma should be generated at a location sufficiently removed from the workpiece that the workpiece surface is not bombarded with ions capable of damaging the surface (more than about 10 cm) and sufficiently close to the workpiece that reactive plasma products exist in the flow (within about 30 cm).

Abstract: A novel vapor phase Si cleaning process comprises simultaneous exposure of the Si surface to a flux of neutral atomic hydrogen and to a flux of ionized particles. The former flux is substantially derived from a plasma, typically a microwave plasma, that is spaced apart from a second plasma, typically a RF plasma, from which the ionized particles are derived. The novel method can be implemented at relatively low cost and facilitates adjustment of the ratio between the two fluxes to result in optimal removal of, e.g., native oxide from the surface.

Abstract: The formation of latent images in photoresist can be monitored during exposure without spurious images by directing a pulsed beam of monochromatic light onto a region of the layer being exposed and selectively detecting the diffracted light. Peak formation in the normalized diffracted intensity versus time curve indicates optimal exposure of the resist.

Abstract: In accordance with the invention, a plasma generated within a plasma confinement chamber for use in manufacturing semiconductor devices is controlled by monitoring both the neutral gas pressure P and the neutral gas temperature T. The process parameters P and T are then adjusted to control P/T.sup.n. In a preferred embodiment the pressure is adjusted to maintain P/T constant by adjusting the gas flow rate or the outlet pumping speed. The result is a plasma exhibiting enhanced stability over prolonged periods of time.

Abstract: Hydrogen Plasma surface passivation of III-V Semiconductors is critically dependent on exposure time and pressure because of competition between plasma passivation and damage. Proper control of pressure according to the invention yields reproducible and stable passivation. Improved passivation is obtained using high pressure hydrogen plasmas, i.e. above 1 Torr.

Abstract: The formation of latent images in photoresist can be monitored during exposure without spurious images by directing a pulsed beam of monochromatic light onto a region of the layer being exposed and selectively detecting the diffracted light. Peak formation in the normalized diffracted intensity versus time curve indicates optimal exposure of the resist.

Abstract: The present invention is predicted upon the discovery by applicants that is scattered light from an etched workpiece is measured over many orders of diffraction, important characteristics of the etched workpiece can be correlated with the principal component content of the intensity characteristic. In accordance with the present invention, an etched workpiece is inspected by 1) exposing the workpiece to a beam of coherent light, 2) measuring the intensity of the light scattered from the workpiece over a range of spatial frequencies corresponding to a plurality of diffraction orders, 3) determining the principal component content of the tested workpiece intensity envelope, and 4) accepting or rejecting the workpiece in accordance with whether or not the principal component content satisfies predetermined criteria. In preferred embodiments the principal components are determined in relation to a plurality of reference measurements by singular value decomposition.

Abstract: Reactive ion plasma etching apparatus and method are based upon the discovery of enhanced uniformity of etching at low workpiece temperatures. With cooling to sufficiently low temperatures, spontaneous etching is inhibited and etching uniformity is controlled not by gas flow and pressure but rather by ion flux. As a result, one can eliminate uniformity enhancing apparatus which heretofore obstructed optical access to the workpiece, provide window means permitting optical access to a major portion of the workpiece and employ sophisticated optical monitoring techniques during the etching process.

Abstract: Gas phase processes such as plasma etching of a semiconductor substrate is monitored by utilizing the optogalvanic effect. The substrate is subjected to light and in response emits an electron current whose magnitude is representative of the composition at the surface of the substrate. The monitored current is a sensitive indication of surface contamination and of compositional changes associated with the gas phase procedure. The technique is effectively utilized in fabricating devices such as semiconductor devices.