Abstract: A method for making metal/ceramic superconductor thick film structures including the steps of preparing a silver/superconductor ink, applying the ink to a substrate, evaporating the ink's binder, decomposing a silver compound in the residue to coat the superconductor grains, sintering the coated superconductor grains, and oxygenating the superconductor grains through the silver coating. The resultant inter-granular silver increases the critical current and mechanical strength of the superconductor.

Abstract: An integration of a micromachined actuator and a signal transmission structure includes a thermal actuator on a side of a displaceable signal line opposite to a fixed signal line. The actuator includes first and second legs. The first leg has a cross-sectional area greater than the second leg, providing a differential in electrical resistance. As current is channeled through the legs, the second leg will elongate more and will deflect both of the legs. The deflection is in a direction to press the displaceable signal line into signal communication with the fixed signal line. Optionally, a thermally operated reset actuator can be positioned to provide a mechanical return of the displaceable signal line. In a preferred embodiment, a microwave transmission environment is provided.

Abstract: A micromachined signal switch for vertical displacement includes a fixed substrate having at least one signal line and includes an actuator substrate that is thermally actuated to selectively connect a second signal line to the first signal line. The actuator substrate includes a plurality of legs constructed of materials having sufficiently different coefficients of thermal expansion to create stresses that arc the legs when the legs are subjected to elevated temperatures. In the preferred embodiment, a first material for forming the legs is silicon and a second material is a metal, such as electroplated nickel. A displaceable contact region may be formed integrally with the actuator substrate, but the contact region is preferably a region of an interposer substrate between the fixed substrate and the actuator substrate.

Abstract: A micromachined device for selectively switching an optical fiber between a first and a second position includes a working leg that undergoes a greater degree of thermal expansion than a second leg with the conduction of an electrical current through the two legs. In a preferred embodiment, the working leg has a cross-sectional area that is less than that of the second leg, thereby presenting a greater electrical resistance to the current flow. The legs are each fixed to a substrate at first ends and are interconnected at second ends that are free to move relative to the substrate. The difference in electrical resistance provides a differential in thermal expansion, as the working leg lengthens to a greater degree than the second leg. The working leg deforms the second leg and the optical fiber is pressed into a second position until current flow is terminated.

Abstract: A method for making metal/ceramic superconductor thick film structures including the steps of preparing a silver/superconductor ink, applying the ink to a substrate, evaporating the ink's binder, decomposing a silver compound in the residue to coat the superconductor grains, sintering the coated superconductor grains, and oxygenating the superconductor grains through the silver coating. The resultant inter-granular silver increases the critical current and mechanical strength of the superconductor.

Abstract: A variable superconducting delay line system and method having a high temperature superconducting trace and ground plane characterized by a variable inductance L per unit length and capacitance C per unit length, wherein the system and method permit users to select a delay time for an incoming signal propagating through a the transmission line. The system is adapted to keep the ratio of L/C constant, while independently changing L and C to achieve the desired delay time, which corresponds to the product of L times C.

Abstract: An electronic clock has a single Josephson junction connected in parallel to a resonant circuit, which is a delay line with a matching resistance at the input end to provide series termination. The opposite end of the delay line is an open end to reflect pulses, and the pulse transit time on the line determines the clock rate. A zero crossing detector is provided to initiate the clock operation when an input signal rises above a given threshold, and a reset circuit is included to turn off the clock when the input signal falls below this threshold. A flip-flop circuit allows the clock to be turned on by alternate initiating signal pulses. A modification includes a pulse rejuvenating circuit at the end of the delay line to offset pulse degradation. All of the circuits are fabricated with Josephson junction elements, and the zero crossing detector, reset circuit, flip-flop circuit and pulse rejuvenator circuits include dc-SQUID's.

Abstract: A method for making metal/ceramic superconductor thick film structures including the steps of preparing a silver/superconductor ink, applying the ink to a substrate, evaporating the ink's binder, decomposing a silver compound in the residue to coat the superconductor grains, sintering the coated superconductor grains, and oxygenating the superconductor grains through the silver coating. The resultant inter-granular silver increases the critical current and mechanical strength of the superconductor.

Abstract: A superconducting power distribution structure for integrated circuits characterized by a support member and a relatively thin superconducting capacitor member. Vias extending through the support member and the capacitor member couple power and ground plates of the capacitor member to power and ground traces on the circuit board. The vias are solder-bump connected to an integrated circuit chip, and the entire chip is cryogenically cooled to cause the plates of the capacitor to superconduct. The superconducting capacitor provides a large reservoir of charge to the integrated circuit chip through minimal inductance and with minimal voltage drop across its power plane.

Abstract: A chip carrier for carrying integrated circuit chips is provided. Instead of placing individual circuit components either in the chips or next to them, the components are placed in or near the substrate of the chip carrier. This frees up expensive real-estate for logic chips at the chip level presently occupied by the components. The substrate of the carrier acts as a large heat sink to dissipate power generated by the components.