Abstract: A method of contact between two conductive or semiconductive layers deposited on a substrate is disclosed. The method comprises the following steps:the depositing and etching of a first layer,the depositing of an insulating layer under pressure and temperature conditions such that the insulating layer is thinned at the edges of the etched zones of the first layer as compared with the thickness on the surface of the substrate and on the surfaces of the etched zones of the first layer,the chemical etching of the insulating layer on a thickness at least equal to the thickness of the thinned layer but substantially smaller than the thickness elsewhere,the depositing and etching of the second conductive or semiconductive layer under pressure and temperature conditions leading to high covering capacity.

Abstract: The invention provides integrated circuit memories with repair circuits. These repair circuits allow redundant memory cell lines to be substituted for defective cell lines. The invention takes advantage of the existence of these substitution circuits for electrically, and no longer only functionally, decoupling the defective lines. A connection connects circuits for biasing the cell lines to the repair circuit of this line. When the line is repaired (i.e. neutralized) it is automatically unbiased.

Abstract: An integrated circuit memory is provided in which a repair circuit allows a redundant cell line to be substituted for a cell line which has proved defective. In the invention, access is had to the repair circuit by using the properties of the decoder of the memory. An instruction for decomposing a fuse is given, for all the repair circuits of the memory, through a single external terminal conected to a connection which serves all the repair circuits. When the fuse is decomposed, a bistable circuit changes state and switches the cell lines.