Abstract: A content addressable memory cell is described. In one embodiment, the content addressable memory cell includes first and second resistive memory elements being coupled in a first series connection and being connected between a first potential value and a second potential value being smaller than said first potential value, and means for their switching between states exhibiting different electric resistance values. The memory cell includes a first field effect transistor and a second field effect transistor, said first and second transistors having drain-source-paths and gate electrodes, said drain-source-paths of said first and second transistors being connected in a second series connection and being connected to at least one of first current lines. The first current line is connected to a potential value level detector for sensing a potential difference as to said third potential value.

Abstract: There are many inventions described and illustrated herein. In a first aspect, the present invention is directed to a memory cell and technique of reading data from and writing data into that memory cell. In this regard, in one embodiment of this aspect of the invention, the memory cell includes two transistors which store complementary data states. That is, the two-transistor memory cell includes a first transistor that maintains a complementary state relative to the second transistor. As such, when programmed, one of the transistors of the memory cell stores a logic low (a binary “0”) and the other transistor of the memory cell stores a logic high (a binary “1”). The data state of the two-transistor complementary memory cell may be read and/or determined by sampling, sensing measuring and/or detecting the polarity of the logic states stored in each transistor of complementary memory cell.

Abstract: There are many inventions described and illustrated herein. In a first aspect, the present invention is directed to a memory device and technique of reading data from and writing data into memory cells of the memory device. In this regard, in one embodiment of this aspect of the invention, the memory device and technique for operating that device that minimizes, reduces and/or eliminates the debilitating affects of the charge pumping phenomenon. This embodiment of the present invention employs control signals that minimize, reduce and/or eliminate transitions of the amplitudes and/or polarities. In another embodiment, the present invention is a semiconductor memory device including a memory array comprising a plurality of semiconductor dynamic random access memory cells arranged in a matrix of rows and columns.

Abstract: A configuration of resistive memory cells is disclosed. In one embodiment, the configuration of resistive memory cells comprises a plurality of first current lines; a plurality of second current lines; and a plurality of third current lines.

Abstract: The invention concerns a ROM circuit (40) including columns of storage cells, each column being connected to a bit site (BLi, BLi+1), wherein the columns are arranged in groups of two adjacent columns, each column of a group capable of being selectively activated relative to the other column of the group, thereby enabling the elimination of a connection to the ground of columns and the design of efficient reading amplifiers.

Abstract: A content addressable memory cell is described. In one embodiment, the content addressable memory cell includes first and second resistive memory elements being coupled in a first series connection and being connected between a first potential value and a second potential value being smaller than said first potential value, and means for their switching between states exhibiting different electric resistance values. The memory cell includes a first field effect transistor and a second field effect transistor, said first and second transistors having drain-source-paths and gate electrodes, said drain-source-paths of said first and second transistors being connected in a second series connection and being connected to at least one of first current lines. The first current line is connected to a potential value level detector for sensing a potential difference as to said third potential value.

Abstract: A resistive memory cell random access memory device and method for fabrication.

Abstract: A configuration of resistive memory cells is disclosed. In one embodiment, the configuration of resistive memory cells comprises a plurality of first current lines; a plurality of second current lines; and a plurality of third current lines.

Abstract: A magnetic memory element comprising a magnetic storage element having at least one magnetic layer made of a magnetic material and being vertically oriented relative to a wafer surface on which the magnetic memory element is formed, the magnetic layer having a magnetic anisotropy with its magnetization vector being magnetically coupled to at least one current line, and a magnetic sensor element for sensing the magnetization of the at least one magnetic layer of the magnetic storage element comprising at least one magnetic layer having a magnetization vector being magnetically coupled to the magnetization vector of the at least one magnetic layer of the magnetic storage element, the magnetic sensor element being conductively coupled to the at least one current line.

Abstract: A CAM cell with masking made in the form of an integrated circuit, including a first storage cell including a first transistor, first and second inverters in anti-parallel, and a second transistor; a comparison cell, including third and fourth transistors controlling a fifth transistor, connected in series with a sixth inhibiting transistor to a result line; and a second storage cell, including a seventh transistor in series with two inverters in anti-parallel and an eighth transistor, the second storage cell controlling the inhibiting transistor. The first, second, seventh, and eighth transistors may be N-channel transistors, and the third, fourth, fifth, and sixth transistors may be P-channel transistors.

Abstract: A MRAM storage device comprises a substrate, on/above of which a plurality of word lines, a plurality of bit lines, a plurality of memory cells, and a plurality of isolation diodes are provided. Each memory cell forms a resistive cross point of one word line and one bit line, respectively. Each memory cell is connected to one isolation diode such that a unidirectional conductive path is formed from a word line to a bit line via the corresponding memory cell, respectively. The substrate, at least a part of the word lines or at least a part of the bit lines, and the isolation diodes are realized as one common monocrystal semiconductor block.

Abstract: The present invention relates to an integrated circuit including at least one matrix network of identical elements capable of being individually addressed at least in a first direction and including, at least for this first direction, at least one redundancy element, and a circuit that reversibly inhibits the operation of a defective element and maintains the circuit operation by using the redundancy element. The integrated circuit also may include a circuit that definitely inhibits the operation of a defective element and maintains the circuit operation by using the redundancy element.

Abstract: There are many inventions described and illustrated herein. In a first aspect, the present invention is directed to a memory device and technique of reading data from and writing data into memory cells of the memory device. In this regard, in one embodiment of this aspect of the invention, the memory device and technique for operating that device that minimizes, reduces and/or eliminates the debilitating affects of the charge pumping phenomenon. This embodiment of the present invention employs control signals that minimize, reduce and/or eliminate transitions of the amplitudes and/or polarities. In another embodiment, the present invention is a semiconductor memory device including a memory array comprising a plurality of semiconductor dynamic random access memory cells arranged in a matrix of rows and columns.

Abstract: There are many inventions described and illustrated herein. In a first aspect, the present invention is directed to a memory device and technique of reading data from and writing data into memory cells of the memory device. In this regard, in one embodiment of this aspect of the invention, the memory device and technique for operating that device that minimizes, reduces and/or eliminates the debilitating affects of the charge pumping phenomenon. This embodiment of the present invention employs control signals that minimize, reduce and/or eliminate transitions of the amplitudes and/or polarities. In another embodiment, the present invention is a semiconductor memory device including a memory array comprising a plurality of semiconductor dynamic random access memory cells arranged in a matrix of rows and columns.

Abstract: A DRAM including an array of storage elements arranged in lines and columns, and for each column: write means adapted to biasing at least a selected one of the elements to a charge level chosen from among a first predetermined high level and a second predetermined low level, combined with read circuitry adapted to determining whether the stored charge level is greater or smaller than a predetermined charge level; and isolation circuitry adapted to isolating the array from the read and/or write means, each column further including refreshment means, distinct from the read and write circuit, for increasing, beyond the first and second predetermined levels, the charge stored in a storage element.

Abstract: The invention concerns an amplifier (1), capable of being controlled by an activation signal, for reading storage cells of a crossbar network comprising, for each column, a direct bit line (BLdi) and a reference bit line (BLri), the amplifier being common to two columns and producing an OR-Exclusive type combination of the states of the cells read in said two columns.

Abstract: An integrated circuit memory including at least two banks each provided with an array of storage elements having at least one redundancy column and each associated with specific sense amplifiers, a row of input/output buffer circuits common to the memory banks, and for each memory bank, a circuit for assigning the redundancy column to an input/output line connected to one of said buffers. The assigning can be performed, for a line of current rank, towards the columns of preceding rank and towards the columns of following rank.

Abstract: A random access memory cell and fabrication method therefor are disclosed. The random access memory cell includes a first and a second pull-down transistor cross-coupled such that a control terminal of the first pull-down transistor is connected to a conduction terminal of the second pull-down transistors, and the control terminal of the second pull-down transistor is connected to the conduction terminal of the first pull-down transistor. A first pass gate transistor is coupled between the conduction terminal of the first transistor and a first bit line of a bit line pair, and a second pass gate transistor is coupled between the conduction terminal of the second transistor and a second bit line of the bit line pair.

Abstract: There are many inventions described and illustrated herein. In a first aspect, the present invention is directed to a memory cell and technique of reading data from and writing data into that memory cell. In this regard, in one embodiment of this aspect of the invention, the memory cell includes two transistors which store complementary data states. That is, the two-transistor memory cell includes a first transistor that maintains a complementary state relative to the second transistor. As such, when programmed, one of the transistors of the memory cell stores a logic low (a binary “0”) and the other transistor of the memory cell stores a logic high (a binary “1”). The data state of the two-transistor complementary memory cell may be read and/or determined by sampling, sensing measuring and/or detecting the polarity of the logic states stored in each transistor of complementary memory cell.

Abstract: The invention concerns a ROM circuit (40) comprising columns of storage cells, each column being connected to a bit site (BLi, BLi+1), wherein the columns are arranged in groups of two adjacent columns, each column of a group capable of being selectively activated relative to the other column of the group, thereby enabling the elimination of a connection to the ground of columns and the design of efficient reading amplifiers.