Abstract: A semiconductor wafer for use in the fabrication of semiconductor devices which includes a circular wafer (13) of semiconductor material having a perimeter and a notch (11) having a wall disposed in the wafer and extending to the perimeter which includes a preferably rounded apex (5) interior of the perimeter and a pair of rounded intersections (7, 9) between the wall and the perimeter. The notch is formed with a tool (23) for forming rounded corners in the semiconductor wafer which includes a body of a material having a hardness greater than the semiconductor wafer which has a generally rounded or paraboloidally shaped front portion having a forwardmost tip (25) portion and a wing portion (27) extending outwardly from the body and having a taper narrowing in the direction of the forwardmost tip portion. The wing portion can be one or more spaced apart wing members or the wing portion can be a single member which extends completely around the tool axis.

Abstract: A semiconductor wafer for use in the fabrication of semiconductor devices which includes a circular wafer (13) of semiconductor material having a perimeter and a notch (11) having a wall disposed in the wafer and extending to the perimeter which includes a preferably rounded apex (5) interior of the perimeter and a pair of rounded intersections (7, 9) between the wall and the perimeter. The notch is formed with a tool (23) for forming rounded corners in the semiconductor wafer which includes a body of a material having a hardness greater than the semiconductor wafer which has a generally rounded or paraboloidally shaped front portion having a forwardmost tip (25) portion and a wing portion (27) extending outwardly from the body and having a taper narrowing in the direction of the forwardmost tip portion. The wing portion can be one or more spaced apart wing members or the wing portion can be a single member which extends completely around the tool axis.

Abstract: A photolithography system includes a photolithography tool 32 that includes a stage upon which a semiconductor wafer is mounted. The tool is operable to move the stage to automatically focus a pre-determined image on a surface of the semiconductor wafer. The tool is further operable to log movements of the stage. The system also includes an automation host computer 36 operable to poll the photolithography tool 32 to obtain data reflecting the logged movements of the stage. The automation host computer 36 is further operable to analyze the data and compare the data to pre-determined error conditions. The host computer also takes a pre-determined action, including sending an electronic mail message to the personal computers 38 of relevant line personnel, in the event the data meets the pre-determined error conditions.

Abstract: An electroplating system is described which provides for the formation of a conductive layer on a workpiece. The current used to electroplate the workpiece is controlled by a controller. The rotation of the workpiece within a solution containing conductive material is controlled by a rotation controller. The current level and/or rotation of the workpiece is controlled in such a way that the non-uniform growth of large grains within the conductive film is minimized.

Abstract: Wafer cleaning systems (10, 25) utilizing both chemical and physical action to clean integrated circuit wafers (14, 24) is disclosed. Chemical cleaning action is provided by liquid retained within a tank (2, 22), sized either to hold a single wafer (24) or a batch of wafers (14) held within a carrier (12). Physical action is provided in the wafer cleaning system either by way of inert gas bubbling through a baffle (5) or by way of ultrasonic energy applied by transducers (28) located in the tank (2, 22). The systems (10, 25) have a programmable controller (20, 30) for initiating the physical cleaning action after insertion of the wafers (14, 24) into the chemical bath, and for ceasing the physical action prior to removal of the wafers (14, 24). After a waiting time after the ceasing of the physical action, to calm the chemical bath and to permit any retained bubbles to escape to the atmosphere, the wafers (14, 24) may then be removed from the chemical bath, with reduced risk of staining and particle release.

Abstract: Wafer cleaning systems (10, 25) utilizing both chemical and physical action to clean integrated circuit wafers (14, 24) is disclosed. Chemical cleaning action is provided by liquid retained within a tank (2, 22), sized either to hold a single wafer (24) or a batch of wafers (14) held within a carrier (12). Physical action is provided in the wafer cleaning system either by way of inert gas bubbling through a baffle (5) or by way of ultrasonic energy applied by transducers (28) located in the tank (2, 22). The systems (10, 25) have a programmable controller (20, 30) for initiating the physical cleaning action after insertion of the wafers (14, 24) into the chemical bath, and for ceasing the physical action prior to removal of the wafers (14, 24). After a waiting time after the ceasing of the physical action, to calm the chemical bath and to permit any retained bubbles to escape to the atmosphere, the wafers (14, 24) may then be removed from the chemical bath, with reduced risk of staining and particle release.

Abstract: The marking of identification and orientation information along the edge (E) of a semiconductor wafer (20, 20′) is disclosed. The information may be marked by way of laser marking at one or more locations (10) along a flat portion (14) or bevel (12t, 12b) of the edge (E) of the wafer (20, 20′). The wafer marking (10) may be encoded, for example by way of a 2-D bar code. A system (30) for reading the identification information from wafers (20, 20′) in a carrier (32) is also disclosed. The system (30) includes a sensor (36) for sensing reflected light from the wafer markings (10) along the wafer edge (E), and for decoding identification and orientation therefrom. A motor (38), under the control of feedback (RFB) from the sensor (36), rotates the wafers (20, 20′) by way of a roller (39) until the wafer marking (10) is in view by the sensor (36). A processing system (40), which includes a rotatable chuck (41) upon which the wafer (20, 20′) is placed, is also disclosed.

Abstract: A semiconductor wafer for use in the fabrication of semiconductor devices which includes a circular wafer (13) of semiconductor material having a perimeter and a notch (11) having a wall disposed in the wafer and extending to the perimeter which includes a preferably rounded apex (5) interior of the perimeter and a pair of rounded intersections (7, 9) between the wall and the perimeter. The notch is formed with a tool (23) for forming rounded corners in the semiconductor wafer which includes a body of a material having a hardness greater than the semiconductor wafer which has a generally rounded or paraboloidally shaped front portion having a forwardmost tip (25) portion and a wing portion (27) extending outwardly from the body and having a taper narrowing in the direction of the forwardmost tip portion. The wing portion can be one or more spaced apart wing members or the wing portion can be a single member which extends completely around the tool axis.

Abstract: A system (10) is disclosed for cleaning a vertical furnace (12) pedestal (34) and cap (36) including at least one inlet conduit (40) in fluid communication with a pressurized cleaning medium source (46). The system also includes at least one exhaust conduit (42) in fluid communication with a negative pressure source (48). A boat assembly (30) may be positioned such that the at least one conduit (40) is operable to direct cleaning medium at the boat assembly (30) to dislodge contaminate particles associated with the boat assembly. The exhaust outlet (42) then evacuates the cleaning medium and any dislodged contaminate particles. The system may operate automatically within a closed processing environment and after each process cycle.

Abstract: The marking of identification and orientation information along the edge (E) of a semiconductor wafer (20, 20′) is disclosed. The information may be marked by way of laser marking at one or more locations (10) along a flat portion (14) or bevel (12t, 12b) of the edge (E) of the wafer (20, 20′). The wafer marking (10) may be encoded, for example by way of a 2-D bar code. A system (30) for reading the identification information from wafers (20, 20′) in a carrier (32) is also disclosed. The system (30) includes a sensor (36) for sensing reflected light from the wafer markings (10) along the wafer edge (E), and for decoding identification and orientation therefrom. A motor (38), under the control of feedback (RFB) from the sensor (36), rotates the wafers (20, 20′) by way of a roller (39) until the wafer marking (10) is in view by the sensor (36). A processing system (40), which includes a rotatable chuck (41) upon which the wafer (20, 20′) is placed, is also disclosed.

Abstract: Wafer order is randomized in-situ by use of a separate wafer staging area and randomly shuffling wafers to and from this staging area to shuffle the processing order of the wafer lot. Positional data is captured for each wafer at both the send and receive ends of the process.

Abstract: An in-situ particle monitor in an exhaust controls a particle sampler so that when a predetermined particle threshold is detected, the particle sampler is caused to gather samples from the exhaust in real-time. Electrical control signals are monitored to correlate variations in the signals with particle excursions for both analysis and sample collection triggering.

Abstract: A method and system for cleaning a reticle. There is provided a clean chamber and a reticle having a pair of opposing edges and a pair of opposing surfaces which is to be cleaned disposed in the clean chamber. A gas inert to the reticle is directed in a direction tangential to each of the surfaces of the reticle and along one the edge of the reticle. The gas is exhausted from a location spaced from the other of the pair of opposing edges and remote form the one edge. An optional monitor monitors the particles in the exhausted gas. The gas is preferably applied in pulses which have a pulse length of from about 0.05 second to about 1 second and a pulse repetition rate of from about 0.5/second to about 40/second. The gas is preferably ionized and preferably is applied at a pressure of from about 20 psi to about 120 psi. The stepper chamber is vibrationally isolated from the blow-off chamber.

Abstract: A method for reducing thickness of spin-on glass on semiconductor wafers includes rotatably mounting a semiconductor wafer and positioning a grinding member proximate an outer edge of the semiconductor wafer. The method further includes rotating both the semiconductor wafer and the grinding member, and engaging the rotating grinding member with the outer edge of the rotating semiconductor wafer while applying a chemical to the outer edge.

Abstract: A system for cleaning a reticle. There is provided a clean chamber and a reticle having a pair of opposing edges and a pair of opposing surfaces which is to be cleaned disposed in the clean chamber. A gas inert to the reticle is directed in a direction tangential to each of the surfaces of the reticle and along one the edge of the reticle. The gas is exhausted from a location spaced from the other of the pair of opposing edges and remote form the one edge. An optional monitor monitors the particles in the exhausted gas. The gas is preferably applied in pulses which have a pulse length of from about 0.05 second to about 1 second and a pulse repetition rate of from about 0.5/second to about 40/second. The gas is preferably ionized and preferably is applied at a pressure of from about 20 psi to about 120 psi. The stepper chamber is vibrationally isolated from the blow-off chamber.

Abstract: A system (10) is disclosed for cleaning a vertical furnace (12) pedestal (34) and cap (36) including at least one inlet conduit (40) in fluid communication with a pressurized cleaning medium source (46). The system also includes at least one exhaust conduit (42) in fluid communication with a negative pressure source (48). A boat assembly (30) may be positioned such that the at least one conduit (40) is operable to direct cleaning medium at the boat assembly (30) to dislodge contaminate particles associated with the boat assembly. The exhaust outlet (42) then evacuates the cleaning medium and any dislodged contaminate particles. The system may operate automatically within a closed processing environment and after each process cycle.

Abstract: A method of detecting object scratching during robotic arm movement of the object. The method includes providing a robotic arm for grasping and placing of an object into a cassette and providing a cassette having an entrance for receiving an object therein. A vibration sensor is placed on at least one of the robotic arm or under the cassette control of the robotic arm is provided in response to a malfunction indication at least one of the vibration sensors. There can further be provided an air flow across the entrance of the cassette with placement of a particle counter at the downstream end of the air flow across cassette entrance, wherein the control of said robotic arm is provided in response to a malfunction indication at least one of the vibration sensors and the particle counter. The control can also be provided in response to both of the vibration sensors or one or both of the vibration sensors and the particle counter.

Abstract: An ammonium or amide aqueous solution without oxidzers for cleaning semiconductor wafers with exposed TiN (103). Effective particulate (109) removal occurs without the standard use of hydrogen peroxide which would attack the TiN (103). Solution temperatures up to 90° C. plus applied ultrasonic energy enhance the cleaning efficiency. Surfactants may be included.

Abstract: A method of filtering a bath (1,31) having a liquid containing particles of varying sizes therein and the recirculation and filtering system. The method and system require providing a recirculation route from the bath outflow and returning to the bath inflow. The route includes a first path communicating with the bath outflow and having serially a first controllable valve (5,9) and a filter having a relatively large pore size. The route also includes a second path communicating with the bath outflow and having serially a second controllable valve (11,15) and a filter having a relatively small pore size. There is a return path from each filter to the bath inflow. The return path from each filter can be a separate path or the paths can be connected at the output end before returning to the bath.

Abstract: A semiconductor wafer for use in the fabrication of semiconductor devices which includes a circular wafer (13) of semiconductor material having a perimeter and a notch (11) having a wall disposed in the wafer and extending to the perimeter which includes a preferably rounded apex (5) interior of the perimeter and a pair of rounded intersections (7, 9) between the wall and the perimeter. The notch is formed with a tool (23) for forming rounded corners in the semiconductor wafer which includes a body of a material having a hardness greater than the semiconductor wafer which has a generally rounded or paraboloidally shaped front portion having a forwardmost tip (25) portion and a wing portion (27) extending outwardly from the body and having a taper narrowing in the direction of the forwardmost tip portion. The wing portion can be one or more spaced apart wing members or the wing portion can be a single member which extends completely around the tool axis.