Abstract: An electrical circuit arrangement provides a substrate and at least two conductive surfaces. The substrate comprises at least one layer disposed between the conductive surfaces. The conductive surfaces form a capacitor and overlap in part and form an overlapping area. In the event of a displacement of the conductive surfaces relative to one another, the resulting overlapping area is largely constant up to a threshold value of the displacement.

Abstract: The circuit arrangement according to the invention provides a substrate (10), a connecting element (18) and a chip (16). The substrate (10) provides at least a partial metallisation (11) on its surface. The connecting element (18) is applied to the metallisation (11). The chip (16) is applied to the connecting element (18). The connecting element (18) provides an electrically non-conductive glass layer (14), which is applied directly to the metallisation (11), and an adhesive layer (15) between the chip (16) and the glass layer (14).

Abstract: A overcap is provided which covers the opening of a container. The overcap, in one form, engages an exterior of the container around the rim and along an inwardly directed flange which defines an opening of the container. The overcap snappingly engages with the container to produce an audible indication that the overcap is firmly attached to the container and that air is being expelled from inside the container. In another form, the overcap includes an invertible dome which is transformable between an upward convex position and an upward concave position.

Abstract: An electrical circuit arrangement provides a substrate and at least two conductive surfaces. The substrate comprises at least one layer disposed between the conductive surfaces. The conductive surfaces form a capacitor and overlap in part and form an overlapping area. In the event of a displacement of the conductive surfaces relative to one another, the resulting overlapping area is largely constant up to a threshold value of the displacement.

Abstract: A container assembly with a closure and the structure of the closure. The container has multiple compartments for holding different materials. The container has a closure with a fitment that attaches to the container. The fitment has separate bottom receptacle areas on one side and a top receptacle on the other. The separate receptacle areas are each exposed to different compartments within the container. The top receptacle area is connected to each of the separate receptacle areas by conduits. A selection head is provided having a pour spout and a plurality of baffle chambers. The pour spout has an open central conduit, wherein only some of the baffle chambers are open to that central conduit. The baffle chambers are received within the top receptacle area of the fitment. Different combinations of the baffle chambers selectively align with different conduits as the selection head rotates within the fitment.

Abstract: An electrical circuit arrangement provides a substrate and at least two conductive surfaces. The substrate comprises at least one layer disposed between the conductive surfaces. The conductive surfaces form a capacitor and overlap in part and form an overlapping area. In the event of a displacement of the conductive surfaces relative to one another, the resulting overlapping area is largely constant up to a threshold value of the displacement.

Abstract: A system and method of secure PIN processing in a network transaction includes a transaction manager that sends terminal data to a terminal. The terminal generates corollary data from user input and the terminal data. The corollary data is sent to the transaction manager. The transaction manager then sends the corollary data and HSM data to a hardware security module. The hardware security module generates a PIN from the corollary data and the HSM data, encrypts the PIN and generates a PIN block. The transaction manager uses the PIN block and transaction data to send a transaction request to the ATM Network.