Patents by Inventor Robert D. Horning

Robert D. Horning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10033354
    Abstract: A temperature stabilized device and method for temperature stabilization are provided. The temperature stabilized device comprises a substrate having a first surface, at least one component mounted on the first surface of the substrate, and a first conformal layer comprising a thermoelectric material, with the first conformal layer over the at least one component. A first temperature control circuit is electrically coupled to the first conformal layer. The first temperature control circuit is configured to control a current through the first conformal layer. The current through the first conformal layer is controlled to maintain the at least one component at a target operating temperature.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: July 24, 2018
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Grant H. Lodden
  • Patent number: 10024656
    Abstract: System and methods for highly integrated optical readout MEMS sensors are provided. In one embodiment, a method for an integrated waveguide optical-pickoff sensor comprises: launching a laser beam generated by a laser light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting an amount of coupling of the laser beam from the coupling port to a sensor component separated from the coupling port by a gap by measuring an attenuation of the laser beam at the optical output port.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: July 17, 2018
    Assignee: Honeywell International Inc.
    Inventors: Grant H. Lodden, Robert D. Horning
  • Patent number: 9803979
    Abstract: Systems and methods for a time-based optical pickoff for MEMS sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: October 31, 2017
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Grant Lodden
  • Patent number: 9534925
    Abstract: A method for fabricating a vibratory structure gyroscope is provided herein. An annular cavity is formed in a first surface of a substrate, the annular cavity defining an anchor post located in a central portion of the annular cavity. A bubble layer is formed over the first surface of the substrate and over the annular cavity. The substrate and the bubble layer are heated to form a hemitoroidal bubble in the bubble layer over the annular cavity. A sacrificial layer is deposited over the hemitoroidal bubble of the bubble layer and an aperture is formed in the sacrificial layer, the aperture disposed over the anchor post in the annular cavity. A resonator layer is deposited over the sacrificial layer and the sacrificial layer between the bubble layer and the resonator layer is removed.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: January 3, 2017
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Burgess R. Johnson, Robert Compton, Eugen Cabuz
  • Publication number: 20160377434
    Abstract: Systems and methods for a time-based optical pickoff for MEMS sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component.
    Type: Application
    Filed: September 21, 2015
    Publication date: December 29, 2016
    Inventors: Robert D. Horning, Grant Lodden
  • Publication number: 20160351436
    Abstract: A method of low temperature wafer bonding is provided. The method comprises: providing oxide to form a bonding layer on a deposition surface of at least one of two wafers, the bonding layer having a thickness in the range of 100 Angstroms to 500 Angstroms; soaking the wafers in a solution that makes bonding surfaces of the wafers hydrophilic; rinsing the wafers with water after soaking the wafers in the solution that makes bonding surfaces of the wafers hydrophilic; drying the wafers; optical-contact bonding the wafers with each other by bringing the bonding layers of the wafers in contact with each other to form a wafer pair; and annealing the wafer pair at a temperature less than or equal to 500° Celsius.
    Type: Application
    Filed: May 27, 2015
    Publication date: December 1, 2016
    Inventors: Daniel Endean, Bob Martin, Robert D. Horning
  • Patent number: 9493344
    Abstract: A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs. The proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one anchor having a second plurality of combs. The anchor is coupled to the substrate such that the anchor and second plurality of combs are fixed in position relative to the substrate. The first plurality of combs are interleaved with the second plurality of combs. Each of the combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that capacitance between the combs varies approximately linearly with displacement of the movable combs in an out-of-plane direction.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: November 15, 2016
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Ryan Supino
  • Publication number: 20160320180
    Abstract: System and methods for highly integrated optical readout MEMS sensors are provided. In one embodiment, a method for an integrated waveguide optical-pickoff sensor comprises: launching a laser beam generated by a laser light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting an amount of coupling of the laser beam from the coupling port to a sensor component separated from the coupling port by a gap by measuring an attenuation of the laser beam at the optical output port.
    Type: Application
    Filed: May 26, 2015
    Publication date: November 3, 2016
    Inventors: Grant H. Lodden, Robert D. Horning
  • Publication number: 20160233851
    Abstract: A temperature stabilized device and method for temperature stabilization are provided. The temperature stabilized device comprises a substrate having a first surface, at least one component mounted on the first surface of the substrate, and a first conformal layer comprising a thermoelectric material, with the first conformal layer over the at least one component. A first temperature control circuit is electrically coupled to the first conformal layer. The first temperature control circuit is configured to control a current through the first conformal layer. The current through the first conformal layer is controlled to maintain the at least one component at a target operating temperature.
    Type: Application
    Filed: May 19, 2015
    Publication date: August 11, 2016
    Inventors: Robert D. Horning, Grant H. Lodden
  • Patent number: 9227835
    Abstract: In an example, an interposer chip is provided. The interposer chip includes a base portion and a chip mounting portion. The interposer chip also includes one or more flexures connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections extends from the base portion towards the chip mounting portion, and a second plurality of projections extends from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: January 5, 2016
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Ryan Supino
  • Patent number: 9171964
    Abstract: Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: October 27, 2015
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Ryan Supino
  • Patent number: 9061891
    Abstract: Systems and methods for two degree of freedom dithering for micro-electromechanical system (MEMS) sensor calibration are provided. In one embodiment, a method for a device comprises forming a MEMS sensor layer, the MEMS sensor layer comprising a MEMS sensor and an in-plane rotator to rotate the MEMS sensor in the plane of the MEMS sensor layer. Further, the method comprises forming a first and second rotor layer and bonding the first rotor layer to a top surface and the second rotor layer to the bottom surface of the MEMS sensor layer, such that a first and second rotor portion of the first and second rotor layers connect to the MEMS sensor. Also, the method comprises separating the first and second rotor portions from the first and second rotor layers, wherein the first and second rotor portions and the MEMS sensor rotate about an in-plane axis of the MEMS sensor layer.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: June 23, 2015
    Assignee: Honeywell International Inc.
    Inventors: Ryan Supino, Eugen Cabuz, Burgess R. Johnson, Robert D. Horning
  • Publication number: 20150024534
    Abstract: Systems and methods for two degree of freedom dithering for micro-electromechanical system (MEMS) sensor calibration are provided. In one embodiment, a method for a device comprises forming a MEMS sensor layer, the MEMS sensor layer comprising a MEMS sensor and an in-plane rotator to rotate the MEMS sensor in the plane of the MEMS sensor layer. Further, the method comprises forming a first and second rotor layer and bonding the first rotor layer to a top surface and the second rotor layer to the bottom surface of the MEMS sensor layer, such that a first and second rotor portion of the first and second rotor layers connect to the MEMS sensor. Also, the method comprises separating the first and second rotor portions from the first and second rotor layers, wherein the first and second rotor portions and the MEMS sensor rotate about an in-plane axis of the MEMS sensor layer.
    Type: Application
    Filed: October 7, 2014
    Publication date: January 22, 2015
    Inventors: Ryan Supino, Eugen Cabuz, Burgess R. Johnson, Robert D. Horning
  • Patent number: 8887550
    Abstract: Systems and methods for two degree of freedom dithering for micro-electro-mechanical system (MEMS) sensor calibration are provided. In one embodiment, a method for a device comprises forming a MEMS sensor layer, the MEMS sensor layer comprising a MEMS sensor and an in-plane rotator to rotate the MEMS sensor in the plane of the MEMS sensor layer. Further, the method comprises forming a first and second rotor layer and bonding the first rotor layer to a top surface and the second rotor layer to the bottom surface of the MEMS sensor layer, such that a first and second rotor portion of the first and second rotor layers connect to the MEMS sensor. Also, the method comprises separating the first and second rotor portions from the first and second rotor layers, wherein the first and second rotor portions and the MEMS sensor rotate about an in-plane axis of the MEMS sensor layer.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: November 18, 2014
    Assignee: Honeywell International Inc.
    Inventors: Ryan Supino, Eugen Cabuz, Burgess R. Johnson, Robert D. Horning
  • Patent number: 8847143
    Abstract: Systems and methods for an encoder and control scheme are provided. In one embodiment, a micro-electromechanical system (MEMS) device comprises: a stator having a first marker and a second marker arranged on a surface of the stator to form a sensing pattern; a sweeping element that dithers in a plane parallel to the surface of the stator along a sweep path that crosses the first marker and a second marker; an overlap sense circuit operable to measure an area overlap between the sweeping element and the sensing pattern, wherein the overlap sense circuit generates a pulse train signal output that varies as a function of the area overlap.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: September 30, 2014
    Assignee: Honeywell International Inc.
    Inventors: Eugen Cabuz, Robert D. Horning, Ryan Supino, Burgess R. Johnson
  • Patent number: 8829423
    Abstract: System and methods for a vacuum cell apparatus for an atomic sensor are provided. In at least one embodiment, the apparatus comprises a cell wall encircling an enclosed volume, the cell wall having a first open end and a second open end opposite from the first open end and a first panel over the first open end of the cell wall and having a first surface, the first surface facing the enclosed volume and having a first set of diffractive optics therein. Further, the apparatus comprises a second panel over the second open end of the cell wall and having a second surface, the second surface facing the enclosed volume and having a second set of diffractive optics therein; wherein the first set of diffractive optics and the second of diffractive optics are configured to reflect at least one optical beam within the enclosed volume along a predetermined optical path.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: September 9, 2014
    Assignee: Honeywell International Inc.
    Inventors: Robert Compton, Robert D. Horning, Jeff A. Ridley
  • Patent number: 8776601
    Abstract: A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs, wherein the proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one fixed anchor having a second plurality of combs. The first plurality of combs is interleaved with the second plurality of combs. Each of the combs in the first plurality of combs and the second plurality of combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that fringing electric fields are screened to reduce motion of the first plurality of combs along a sense axis due to the fringing electric fields.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: July 15, 2014
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Ryan Supino
  • Patent number: 8748206
    Abstract: Systems and methods for a micro-electromechanical system (MEMS) apparatus are provided. In one embodiment, a system comprises a first double chip that includes a first base layer; a first device layer bonded to the first base layer, the first device layer comprising a first set of MEMS devices; and a first top layer bonded to the first device layer, wherein the first set of MEMS devices is hermetically isolated. The system also comprises a second double chip that includes a second base layer; a second device layer bonded to the second base layer, the second device layer comprising a second set of MEMS devices; and a second top layer bonded to the second device layer, wherein the second set of MEMS devices is hermetically isolated, wherein a first top surface of the first top layer is bonded to a second top surface of the second top layer.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: June 10, 2014
    Assignee: Honeywell International Inc.
    Inventor: Robert D. Horning
  • Publication number: 20140068931
    Abstract: A method for fabricating a vibratory structure gyroscope is provided herein. An annular cavity is formed in a first surface of a substrate, the annular cavity defining an anchor post located in a central portion of the annular cavity. A bubble layer is formed over the first surface of the substrate and over the annular cavity. The substrate and the bubble layer are heated to form a hemitoroidal bubble in the bubble layer over the annular cavity. A sacrificial layer is deposited over the hemitoroidal bubble of the bubble layer and an aperture is formed in the sacrificial layer, the aperture disposed over the anchor post in the annular cavity. A resonator layer is deposited over the sacrificial layer and the sacrificial layer between the bubble layer and the resonator layer is removed.
    Type: Application
    Filed: November 26, 2013
    Publication date: March 13, 2014
    Applicant: Honeywell International Inc.
    Inventors: Robert D. Horning, Burgess R. Johnson, Robert Compton, Eugen Cabuz
  • Patent number: 8631702
    Abstract: One exemplary embodiment is directed to a vibratory structure gyroscope having a substrate having a top surface. The vibratory structure gyroscope can also include a resonator having a hemitoroidal shape, the resonator including a stem and an outer lip that surrounds the stem, the stem attached to the top surface of the substrate and the outer lip located apart from the top surface to allow the resonator to vibrate.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: January 21, 2014
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Burgess R. Johnson, Robert Compton, Eugen Cabuz