Patents by Inventor Robert D. Tolles
Robert D. Tolles has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6572446Abstract: A pad conditioning assembly includes a conditioner head with an end effector movable into contact with a polishing pad,a plurality of downwardly-projecting movable conditioning elements disposed at a bottom of the end effector; and a compliant backing member disposed above and adjacent the conditioning elements, wherein forces applied by the compliant backing member are transferred to the movable conditioning elements to move the conditioning elements. In one aspect, a pressurization circuit applies a pressure from a pressure source to the compliant backing member to flex the compliant backing member against the movable conditioning elements.Type: GrantFiled: September 18, 2000Date of Patent: June 3, 2003Assignee: Applied Materials Inc.Inventors: Thomas H. Osterheld, Manoocher Birang, Robert D. Tolles, Steven Zuniga, Charles C. Garretson
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Patent number: 6533645Abstract: A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the polishing material with a brittle texture. The fibers can be cellulose, and the binder material can be a phenolic resin.Type: GrantFiled: January 18, 2000Date of Patent: March 18, 2003Assignee: Applied Materials, Inc.Inventor: Robert D. Tolles
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Patent number: 6527624Abstract: A carrier head of a chemical mechanical polishing apparatus to apply and distribute a polishing slurry to a polishing pad. The retaining ring includes a trough and one or more channels to channel the polishing slurry to the polishing pad.Type: GrantFiled: October 19, 1999Date of Patent: March 4, 2003Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Sidney Huey
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Patent number: 6524164Abstract: The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from the chemical mechanical polishing process is prevented from penetrating the impermeable transparent sheet to the bottom layer of the polishing pad.Type: GrantFiled: August 29, 2000Date of Patent: February 25, 2003Assignee: Applied Materials, Inc.Inventor: Robert D. Tolles
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Publication number: 20030003846Abstract: A material with a mesh of fibers and a binder material holding the fibers in the mesh can be used on a carrier head or a polishing pad. A polishing apparatus can include a pad cleaner with nozzles to direct jets of cleaning fluid onto the polishing pad and a brush to agitate a surface of the polishing pad.Type: ApplicationFiled: June 27, 2002Publication date: January 2, 2003Inventor: Robert D. Tolles
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Publication number: 20020164928Abstract: A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the polishing material with a brittle texture. The fibers can be cellulose, and the binder material can be a phenolic resin.Type: ApplicationFiled: May 7, 2002Publication date: November 7, 2002Applicant: Applied Materials, Inc., a Delaware corporationInventor: Robert D. Tolles
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Patent number: 6454630Abstract: An arrangement for polishing a workpiece in a chemical mechanical polishing apparatus has a rotatable platen with an aperture that allows a laser interferometric measuring device to measure the surface condition of a workpiece being polished. A transparent block is flexibly attached to the top surface of the platen over the platen aperture to rotate with the platen. A polishing pad is disposed on the top surface of the platen, and has a hole extending through the pad configured to fit over the transparent block attached to the platen.Type: GrantFiled: September 14, 2000Date of Patent: September 24, 2002Assignee: Applied Materials, Inc.Inventor: Robert D. Tolles
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Publication number: 20020132569Abstract: A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the polishing material with a brittle texture. The fibers can be cellulose, and the binder material can be a phenolic resin.Type: ApplicationFiled: February 28, 2002Publication date: September 19, 2002Inventor: Robert D. Tolles
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Patent number: 6443823Abstract: A carrier head for a chemical mechanical polishing apparatus. A layer of conformable material is disposed in a recess of the carrier head to provide a mounting surface for a substrate. The conformable material may be elastic and undergo normal strain in response to an applied load. The carrier head may also include a support fixture detachably connected to a backing fixture, a retaining ring connected directly to the conformable material, and a shield ring which projects over a portion of the layer of conformable material.Type: GrantFiled: January 5, 2000Date of Patent: September 3, 2002Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Tsungan Cheng, John Prince
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Publication number: 20020086619Abstract: A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the polishing material with a brittle texture. The fibers can be cellulose, and the binder material can be a phenolic resin.Type: ApplicationFiled: January 9, 2002Publication date: July 4, 2002Applicant: Applied Materials, Inc., a Delaware CorporationInventor: Robert D. Tolles
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Publication number: 20020077034Abstract: A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the polishing material with a brittle texture. The fibers can be cellulose, and the binder material can be a phenolic resin.Type: ApplicationFiled: January 18, 2000Publication date: June 20, 2002Applicant: T0LLESInventor: Robert D Tolles
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Patent number: 6348124Abstract: A polishing agent delivery system for a wafer processing system includes multiple tanks each of which can hold a supply of a respective polishing agent constituent, such as a slurry constituent, a buffing agent or a cleansing agent. The system also includes multiple containers, each one of which can hold a respective polishing agent constituent. Additionally, each container has a motor-driven piston that can be operated to cause the respective polishing agent constituent to be dispensed from the container to a wafer processing station and which can be operated to cause additional polishing agent constituent to be drawn into the container from a corresponding one of the tanks. The apparatus also includes a controller for controlling a respective rate of linear displacement of each motor-driven piston. Stepper motors or servo-motors can be used. The system allows changes to slurry mixtures to be made quickly and efficiently, and different slurry or buffing mixtures can be used for different polishing stations.Type: GrantFiled: December 14, 1999Date of Patent: February 19, 2002Assignee: Applied Materials, Inc.Inventors: Matthew G. Garbett, Robert D. Tolles, John S. Hearne, Manoocher Birang
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Publication number: 20010055939Abstract: ??Training A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the polishing pad. The area of the adhesive layer corresponding to the transparent regions of the mask is cured to be less adhesive. The area of the adhesive layer corresponding to the opaque regions remain adhesive.Type: ApplicationFiled: August 14, 2001Publication date: December 27, 2001Applicant: Applied Materials, Inc.Inventor: Robert D. Tolles
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Patent number: 6299516Abstract: A polishing layer for chemical mechanical polishing includes a frozen binder material solution which has a liquid state at room temperature, and solid particles dispersed in the frozen binder material. The solid particles may be abrasives, such as colloidal silica or alumina, and/or non-reactive particles, such as pieces of polyurethane or polymerized resins. The polishing layer can also include a chemical etchant. The frozen polishing pad can be formed and reconditioned in situ.Type: GrantFiled: September 28, 1999Date of Patent: October 9, 2001Assignee: Applied Materials, Inc.Inventor: Robert D. Tolles
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Patent number: 6290589Abstract: A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the polishing pad. The area of the adhesive layer corresponding to the transparent regions of the mask is cured to be less adhesive. The area of the adhesive layer corresponding to the opaque regions remain adhesive.Type: GrantFiled: December 9, 1998Date of Patent: September 18, 2001Assignee: Applied Materials, Inc.Inventor: Robert D. Tolles
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Patent number: 6280297Abstract: Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and thinly across the polishing pad. A control system coordinates the distribution of slurry to the polishing pad with the motion of the carrier head.Type: GrantFiled: January 11, 2000Date of Patent: August 28, 2001Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, William L. Guthrie, Jeffrey Marks, Tsungnan Cheng
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Publication number: 20010008830Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.Type: ApplicationFiled: January 12, 2001Publication date: July 19, 2001Applicant: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Steven Zuniga, Hung Chen
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Publication number: 20010005667Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: ApplicationFiled: January 12, 2001Publication date: June 28, 2001Applicant: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
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Patent number: 6220942Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: GrantFiled: April 2, 1999Date of Patent: April 24, 2001Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
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Patent number: 6217426Abstract: A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.Type: GrantFiled: April 6, 1999Date of Patent: April 17, 2001Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Steven Zuniga, Hung Chen