Abstract: A shielded connector for a shielded electrical cable which reduces radio frequency and other electromagnetic interference. The shielded connector comprises a pair of opposed, interconnected shield members enclosing insulated conductors extending from the cable and a unitary outer housing enclosing the shield members. The shield members are electrically connected and bonded at opposite ends to a metallic connector housing and a shield layer extending from the cable. Adhesive is interposed between the outer housing and the shield members and cable. The shield members have neck portions that are connected to the shield layer in the cable.

Abstract: An O.sub.2 sensor built on a silicon chip which has a SiO.sub.2 dielectric layer bridging over a depression in the surface of the chip. A ZrO.sub.2 layer overlies the bridge and a pair of spaced apart palladium electrodes are on the surface of the ZrO.sub.2. A heater for the ZrO.sub.2 is embedded in the SiO.sub.2 bridge.

Abstract: A semiconductor body comprises (100) silicon having a (100) plane and a [110] direction. A depression is formed in a first surface of the semiconductor body which is substantially parallel to the (100) plane. A slotted diaphragm is located over the depression and comprises a layer of thin film material and a resistance film. The depression is bounded at the first surface by four perpendicular boundary edges either in line with or perpendicular to the [110] direction. The slotted diaphragm has first and second slots having a first end located at a maximum width of the depression as measured along the line oriented at substantially 45 degrees to the [110] direction. Each of the first and second slots has a second end located so that each of the first and second slots extends only a portion of the distance across the maximum width of the depression as measured along the line oriented at substantially 45 degrees to the [110] direction.

Abstract: Disclosed is an integrated voltage-isolation power supply comprising a thin film heater, a thin film thermocouple, and a thin film of dielectric. A semiconductor body supports a portion of the thin film of dielectric out of contact with the body. The thin film of dielectric out of contact with the body supports at least a major portion of the heater and the thermocouple. The thermocouple has a hot junction disposed adjacent to the heater but out of electrical contact with the heater.

Abstract: Disclosed is an integral flow sensor and channel assembly comprising a flow sensor having a sensing element integral to a semiconductor body. The assembly further comprises support structure for supporting the flow sensor, the support structure having a first surface. An enclosed flow channel comprises the first surface formed into a groove running below the sensing element. The flow channel comprises an inlet and an outlet for providing flow across the sensing element. The sensing element is located in the flow channel between the inlet and the outlet. The support structure comprises apparatus for flip-chip mounting the semiconductor body, and the semiconductor body is flip-chip mounted so that the sensing element is positioned over the groove in the support structure.

Abstract: A robotics manipulator utilizes a fluid pressure control system to provide a response to the gripping force of the robotics manipulator on an object. The force is converted to a change in fluid pressure that is sensed in a fluid flow channel. This change in pressure or flow is in turn used to provide the control system for the robotics manipulator with information on how hard an object is being gripped.

Abstract: A shielded connector for a shielded electrical cable which reduces radio frequency and other electro-magnetic interference. The shielded connector comprises a pair of opposed, interconnected shield members enclosing insulated conductors extending from the cable and a unitary outer housing enclosing the shield members. The shield members are electrically connected and bonded at opposite ends to a metallic connector housing and a shield layer extending from the cable. Adhesive is interposed between the outer housing and the shield members and cable. The shield members have neck portions that are connected to the shield layer in the cable.

Abstract: A flow sensor comprising a pair of thin film heat sensors and a thin film heater is disclosed. A base supports the sensors and heater out of contact with the base with the sensors disposed on opposite sides of the heater and closely adjacent thereto.

Abstract: A flow sensor comprising a pair of thin film heat sensors and a thin film heater is disclosed. The flow sensor further comprises a semiconductor body with a depression therein and structure connecting the heater and the sensors to the body and bridging the depression so that at least a major portion of the heater and the sensors are out of contact with the body. The sensors are disposed on opposite sides of the heater, the structure connecting comprising two thin film members bridging the depression, each member comprising one sensor and a portion of the heater.

Abstract: A semiconductor device comprising a semiconductor body having a depression formed into the first surface of the body. The device further comprises member means comprising a thermal-to-electric or static electric element, the member means having a predetermined configuration suspended over the depression. The member means is connected to the first surface at least at one location, the depression opening to the first surface around at least a portion of the predetermined configuration. The depression provides substantial physical and thermal isolation between the element and the semiconductor body. In this manner, an integrated semiconductor device provides an environment of substantial physical and thermal isolation between the element and the semiconductor body.

Abstract: A permalloy thin film temperature sensing element in which the NiFe film material is deposited on a substrate in very narrow lines less than about 15 .mu.m wide and in film thicknesses in excess of about 400A.degree. preferably in the range of 1600.degree.-3200A.degree..

Abstract: A conductivity type thin film humidity sensor on a silicon chip which sensor includes structure which electrically shields the sensing area from highly dissociative contaminants.

Abstract: A trailer attachment for a tree harvester is disclosed herein. The trailer attachment consists of a main frame having a grapple frame supported thereon through a support frame and the support frame is rotated about a vertical axis on the main frame while the grapple frame is supported for pivotal movement about a horizontal axis on the support frame. First and second biasing means are interposed respectively between the main frame and support frame and the support frame and grapple frame so that the grapple frame is returned to a predetermined position wherein an upper support surface extends generally horizontally and the horizontal pivot axis extends generally parallel to the main axle for the trailer.