Abstract: A method and an apparatus to regulate voltage supply have been disclosed. In one embodiment, the apparatus includes a power converter block to generate an output voltage from an input voltage and a voltage regulator controller coupled to the power converter block to input at least one time-modulated signal to the power converter block, the at least one time-modulated signal having a duty cycle, the voltage regulator controller including a counter having an increment value substantially proportional to the input voltage, wherein the counter is used to adjust the duty cycle of the at least one time-modulated signal. Other embodiments have been claimed and described.

Abstract: A method and a system for configurably generating enabling pulse clocks are disclosed herein. In various embodiments, enabling pulse clocks are configurably generated for a selected one of a first and a second signaling mode, employing a configurable enabling pulse clock generator configurable to so generate the enabling pulse clocks.

Abstract: Apparatus and systems, as well as methods and articles, may operate to detect an input/output access operation associated with a configuration memory address and a first memory address bit size. The configuration memory address and associated configuration data may be combined into a packet having a second memory address bit size (e.g., 64 bits) greater than the first memory address bit size (e.g., 32 bits). The packet may be used to establish compatibility for legacy operating systems that attempt to communicate with peripheral component interconnect (PCI) interface-based peripherals, and similar platform devices, that have been integrated into the same package as the processor.

Abstract: The invention relates to a metal/plastic hybrid and to a shaped body produced therefrom. By combining metallic additives in plastic, it has been shown for the first time that specific volume resistances of less than 10?2 ?cm can be realized while the compounds have, at the same time, a good processability during the injection molding process.

Abstract: In one embodiment, there is provided a method comprising determining a target operating point for an electronic device, the target operating point including a target operating frequency and a target operating voltage; and dynamically changing a current operating point for the electronic device including a current operating frequency and a current operating voltage by non-contemporaneously changing the current operating frequency to the target operating frequency and a current operating voltage to the target operating voltage, wherein during the changing the electronic device is in an active state.

Abstract: In one embodiment, the present invention includes a method for performing an operation in a processor of a uniprocessor system, initiating a write transaction to send a result of the operation to a memory of the uniprocessor system, and issuing a global observation point for the write transaction to the processor before the result is written into the memory. In some embodiments, the global observation point may be issued earlier than if the processor were in a multiprocessor system. Other embodiments are described and claimed.

Abstract: Architectures and techniques that allow legacy pin functionality to be replaced with a “virtual wire” that may communicate information that would otherwise be communicated by a wired interface. A message may be passed between a system controller and a processor that includes a virtual wire value and a virtual wire change indicator. The virtual wire value may include a signal corresponding to one or more pins that have been eliminated from the physical interface and the virtual wire change value may include an indication of whether the virtual wire value has changed. The combination of the virtual wire value and the virtual wire change indicator may allow multiple physical pins to be replaced by message values.

Abstract: In one embodiment, there is provided a method comprising determining a target operating point for an electronic device, the target operating point including a target operating frequency and a target operating voltage; and dynamically changing a current operating point for the electronic device including a current operating frequency and a current operating voltage by non-contemporaneously changing the current operating frequency to the target operating frequency and a current operating voltage to the target operating voltage, wherein during the changing the electronic device is in an active state.

Abstract: A method and a system for configurably generating enabling pulse clocks are disclosed herein. In various embodiments, enabling pulse clocks are configurably generated for a selected one of a first and a second signaling mode, employing a configurable enabling pulse clock generator configurable to so generate the enabling pulse clocks.

Abstract: Enabling pulse clocks are configurably generated for a selected one of a first and a second signaling mode, employing a configurable enabling pulse clock generator configurable to so generate the enabling pulse clocks.

Abstract: According to the invention, the inventive sealed contact bushings for plastic components consist of a glass/plastic compound based on a thermoplastic, which contains a low-melting sulphophosphate glass with the following composition: 4 to 10% Li2O, 40 to 10% Na2O 4 to 8% K2O, 1 to 2 % CaO, 35 to 37% ZnO, 0 to 3% La2O3, 19 to 22% P2O5 and 19 to 22% SO3, in addition to a high-performance thermoplastic.

Abstract: In one embodiment, there is provided a method comprising determining a target operating point for an electronic device, the target operating point including a target operating frequency and a target operating voltage; and dynamically changing a current operating point for the electronic device including a current operating frequency and a current operating voltage by non-contemporaneously changing the current operating frequency to the target operating frequency and a current operating voltage to the target operating voltage, wherein during the changing the electronic device is in an active state.

Abstract: Systems and methods of managing transactions provide for receiving a first flush command at a first I/O hub, wherein the first flush command is dedicated to non-posted transactions. One embodiment further provides for halting an inbound ordering queue of the first I/O hub with regard to non-posted transactions in response to the first flush command and flushing a non-posted transaction from an outgoing buffer of the first I/O hub to a second I/O hub while the inbound ordering queue is halted with regard to non-posted transactions.

Abstract: Techniques for a processor temperature control interface. In one embodiment, a processor includes a bidirectional interface and output logic to assert a first signal indicating an internal high temperature on the bidirectional interface. Throttling logic throttles operations of the processor if either the internal high temperature is indicated or if an external signal is received on the bidirectional interface.

Abstract: In one embodiment of the present invention, a method includes verifying an initiating logical processor of a system; validating a trusted agent with the initiating logical processor if the initiating logical processor is verified; and launching the trusted agent on a plurality of processors of the system if the trusted agent is validated. After execution of such a trusted agent, a secure kernel may then be launched, in certain embodiments. The system may be a multiprocessor server system having a partially or fully connected topology with arbitrary point-to-point interconnects, for example.

Abstract: An apparatus and method are provided for operating a processor core. This may include a first circuit to operate at a frequency that is dependent on a power supply voltage. A frequency control circuit may be provided to control a frequency of the first circuit by directing a voltage regulator to increase or decrease the power supply voltage.

Abstract: A method involves sheathing a superconductor with a thermoplastic insulation material on all sides. The conductor exits a guide channel that extends in the propulsion direction. A melt hose is extruded from the molten insulation material in the propulsion direction and through a nozzle that has an outlet which embraces the conductor, whereby a distance is kept on all sides. The melt hose is stretched via the propulsion of the conductor. The hose is drawn to the surface of the conductor and is compacted by cooling. The method can especially be used for sheathing band-shaped high-Tc-superconductors. Materials having processing temperatures between 200° C. and 450° C., are selected as thermoplastic insulation materials.

Abstract: Enabling pulse clocks are configurably generated for a selected one of a first and a second signaling mode, employing a configurable enabling pulse clock generator configurable to so generate the enabling pulse clocks.

Abstract: A multi conductor (L) arrangement for transferring energy and/or data. The system contains a plurality of conductor elements (1i) respectively comprising a conductor (1A) which is surrounded by an insulation (2) and an insulating sleeve (3), the conductor elements being mechanically connected to each other. Elements (12) for contacting the conductive elements are also provided. The system is provided with a flexible tubular or pipe-shaped support (10) made of an insulating material having a maximum thickness (D) of 1 mm, the conductive elements (1I) are arranged on the inside wall of the support, and the insulating sleeves (3) of the conductive elements have a respective thickness (d) which is at the most equal to the thickness (D) of the support. A thermoplastic elastomer is preferably used as an insulating material.

Abstract: A method for producing a component from a glass/polymer mixture where, a component is formed from a mixture of a thermoplastic with a processing temperature T1 and first glass particles with saturated surface bonds and a glass temperature T2<T1, at a temperature T3>T1. By melting the first glass particles, second glass particles are produced with surface bonds which can be saturated. The bonds are saturated by being bonded to the thermoplastic.