Abstract: A method for forming a transmission line structure for a semiconductor device includes forming an interlevel dielectric layer over a first metallization level, removing a portion of the interlevel dielectric layer and forming a sacrificial material within one or more voids created by the removal of the portion of the interlevel dielectric layer. A signal transmission line is formed in a second metallization level formed over the interlevel dielectric layer, the signal transmission line being disposed over the sacrificial material. A portion of dielectric material included within the second metallization level is removed so as to expose the sacrificial material, wherein a portion of the sacrificial material is exposed through a plurality of access holes formed through the signal transmission line. The sacrificial material is removed so as to create an air gap beneath the signal transmission line.

Abstract: The present invention provides multiple test structures for performing reliability and qualification tests on MEMS switch devices. A Test structure for contact and gap characteristic measurements is employed having a serpentine layout simulates rows of upper and lower actuation electrodes. A cascaded switch chain test is used to monitor process defects with large sample sizes. A ring oscillator is used to measure switch speed and switch lifetime. A resistor ladder test structure is configured having each resistor in series with a switch to be tested, and having each switch-resistor pair electrically connected in parallel. Serial/parallel test structures are proposed with MEMS switches working in tandem with switches of established technology. A shift register is used to monitor the open and close state of the MEMS switches. Pull-in voltage, drop-out voltage, activation leakage current, and switch lifetime measurements are performed using the shift register.

Abstract: A backside contact structure and method of fabricating the structure. The method includes: forming a dielectric isolation in a substrate, the substrate having a frontside and an opposing backside; forming a first dielectric layer on the frontside of the substrate; forming a trench in the first dielectric layer, the trench aligned over and within a perimeter of the dielectric isolation and extending to the dielectric isolation; extending the trench formed in the first dielectric layer through the dielectric isolation and into the substrate to a depth less than a thickness of the substrate; filling the trench and co-planarizing a top surface of the trench with a top surface of the first dielectric layer to form an electrically conductive through via; and thinning the substrate from a backside of the substrate to expose the through via.

Abstract: A backside contact structure and method of fabricating the structure. The method includes: forming a dielectric isolation in a substrate, the substrate having a frontside and an opposing backside; forming a first dielectric layer on the frontside of the substrate; forming a trench in the first dielectric layer, the trench aligned over and within a perimeter Of the dielectric isolation and extending to the dielectric isolation; extending the trench formed in the first dielectric layer through the dielectric isolation and into the substrate to a depth less than a thickness of the substrate; filling the trench and co-planarizing a top surface of the trench with a top surface of the first dielectric layer to form an electrically conductive through via; and thinning the substrate from a backside of the substrate to expose the through via.

Abstract: Design structure embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes active circuitry on a substrate, a bond pad carried by the substrate, and a shielding structure disposed between the substrate and the bond pad. The shielding structure includes a plurality of electrically characterized devices configured to reduce noise transmission from the active circuitry to the bond pad.

Abstract: Semiconductor device structures and methods for shielding a bond pad from electrical noise generated by active circuitry of an integrated circuit carried on a substrate. The structure includes electrically characterized devices placed in a pre-determined arrangement under the bond pad. The pre-determined arrangement of the electrically characterized devices provides for a consistent high frequency environment under the bond pad, which simplifies modeling of the bond pad by a circuit designer.

Abstract: An integrated circuit (IC) system provides a broadband impedance matching function in a minimal IC area for operation with an external high-speed differential communications channel. The IC system includes a first semi-conductive substrate with a first face and an oppositely disposed second face substantially parallel to the first face. A second non-conductive substrate having substantially parallel first and second faces is arranged upon the first substrate so that the first face of the first substrate contacts the second face of the second substrate. An integrated semiconductor circuit (IC) is disposed in the first substrate and intended for differential high-speed communications operation with the external high-speed differential communications channel. First and second planar conductors are disposed in the second substrate to be electrically isolated from each other and from the first substrate, and arranged for maximum mutual magnetic additive coupling between them.

Abstract: A system and method for filtering various targets (such as ground vehicles, stationary objects, and aircraft) from display on a display screen within the cockpit of an “Own Ship” aircraft. The system and method withhold from display any non-exempt targets that have an altitude that is either: (1) greater than an upper-threshold altitude; or (2) less than a lower-threshold altitude. The upper-threshold altitude and the lower-threshold altitude may be set to user-specified, customized values as desired to accommodate current flying conditions. In addition, the system and method may also be configured to operate in a plurality of operating modes, each of which features a different upper threshold altitude/lower threshold altitude combination. The system and method are preferably configured to reset certain threshold altitudes to pre-defined default altitudes in response to the aircraft landing.

Abstract: A structure for shielding high frequency passive elements includes a first face of a semi-conductive substrate in parallel with a second face of a non-conductive substrate. The first face of the semi-conductive substrate is substantially parallel to a second face thereof. A passive element is disposed in the non-conductive substrate and is isolated from the second face of the non-conductive substrate. A plurality of conductive conduits disposed in the semi-conductive substrate extends from the first face to the second face thereof, each of the conduits isolated from one another by the semi-conductive substrate material and disposed substantially beneath the passive element. A ground plane disposed on the second face of the semi-conductive substrate electrically connects the conductive conduits disposed therein. An electrical connection between an electronic circuit in the semi-conductive substrate, the passive element and the ground plane holds the passive device and the ground plane at different potentials.

Abstract: Methods and a system are described for communication and information management. The methods create and manage multi-factor multi-level reputations, detect and manage fraudulent and manipulative behavior, permit management of information and communications, quantify qualitative information, and derive derivative uses (such as prediction and targeted advertising) from multi-factor reputations, data and behavior. The system described is hierarchical with progressive information and communication management capabilities as reputations increase. The structure of the system is designed to assist reputation calculations.

Abstract: A dermatologic hair-regrowth-inhibiting apparatus is disclosed which is cordless and sufficiently compact as to be hand-held. A self-contained housing is configured for gripping by a person's hand for cordless manipulation in a hair-regrowth-inhibiting procedure. A light source and electrical circuit are contained within the housing. The circuit includes one or more batteries for energizing the light source to produce output light pulses. A light path within the housing includes an aperture through which eye-safe light pulses are propagated out of the housing having properties sufficient for at least temporary hair-regrowth inhibition. A diffuser is disposed along the light path to reduce the integrated radiance to an eye-safe level.

Abstract: Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention can be applied to form passive elements and interconnects on a conventional semiconductor substrate after the typical BEOL, and prior to packaging. The method may provide better electromigration characteristics, lower resistivity, and higher Q factors for conductive structures. In addition, the method is backwardly compatible and customizable.

Abstract: A backside contact structure and method of fabricating the structure. The method includes: forming a dielectric isolation in a substrate, the substrate having a frontside and an opposing backside; forming a first dielectric layer on the frontside of the substrate; forming a trench in the first dielectric layer, the trench aligned over and within a perimeter of the dielectric isolation and extending to the dielectric isolation; extending the trench formed in the first dielectric layer through the dielectric isolation and into the substrate to a depth less than a thickness of the substrate; filling the trench and co-planarizing a top surface of the trench with a top surface of the first dielectric layer to form an electrically conductive through via; and thinning the substrate from a backside of the substrate to expose the through via.

Abstract: A microelectromechanical switch including: at least one pair of actuator electrodes; at least one input electrode and at least one output electrode for input and output, respectively, of a radio frequency signal; and a beam movable by an attraction between the at least one pair of actuator electrodes, the movable beam having at least a portion electrically connected to the at least one input electrode and to the at least one output electrode when moved by the attraction between the at least one pair of actuator electrodes to make an electrical connection between the at least one input and output electrodes; wherein the at least one pair of actuator electrodes are electrically isolated from each of the at least one input and output electrodes. The microelectromechanical switch can be configured in single or multiple-poles and/or single or multiple throws.

Abstract: The present invention provides multiple test structures for performing reliability and qualification tests on MEMS switch devices. A Test structure for contact and gap characteristic measurements is employed having a serpentine layout simulates rows of upper and lower actuation electrodes. A cascaded switch chain test is used to monitor process defects with large sample sizes. A ring oscillator is used to measure switch speed and switch lifetime. A resistor ladder test structure is configured having each resistor in series with a switch to be tested, and having each switch-resistor pair electrically connected in parallel. Serial/parallel test structures are proposed with MEMS switches working in tandem with switches of established technology. A shift register is used to monitor the open and close state of the MEMS switches. Pull-in voltage, drop-out voltage, activation leakage current, and switch lifetime measurements are performed using the shift register.

Abstract: A dermatologic treatment apparatus is disclosed that is cordless and sufficiently compact as to be hand-held. A self-contained housing is configured for gripping by a person's hand for cordless manipulation in a dermatologic treatment procedure. A light source and electrical circuit are contained within the housing. The circuit includes one or more batteries and an electronic control circuit for energizing the light source to produce output light pulses. A light path is within the housing including an aperture through which the output light pulses are propagated out of the housing having properties sufficient for providing efficacious treatment.

Abstract: A high performance inductor which has a relatively low sheet resistance that can be integrated within a semiconductor interconnect structure and can be used in RF applications, including RF CMOS and SiGe technologies, is provided. The inductor is either a dual-metal inductor including a first layer of metal which serves as an upper metal wire in the semiconductor structure and a second layer of metal located directly on top of the first layer of metal, or a tri metal inductor, which includes a third layer of metal located directly on top of the second layer of metal. No vias are located between the various metal layers of the inventive inductor.

Abstract: A system for graphically displaying on a cockpit display an indication of closure (i.e. a “closure indictor”) with a selected target aircraft. In a preferred embodiment of the invention, the system only displays a closure indicator if: (1) the selected target aircraft is within a pre-determined monitoring zone; and (2) the track of the selected target aircraft is within a pre-determined variation angle of the track of the Own Ship aircraft. If the rate of closure between the selected target aircraft and the Own Ship aircraft is within a predetermined range of values, the closure indicator includes a closing/receding indicia (such as an upwardly or downwardly directed arrow) that indicates whether the Own Ship aircraft is closing in on or receding from the selected target aircraft. The system preferably removes the closure indicator from display when the Own Ship aircraft or the selected target aircraft ceases to be airborne.

Abstract: A method for forming a transmission line structure for a semiconductor device includes forming an interlevel dielectric layer over a first metallization level, removing a portion of the interlevel dielectric layer and forming a sacrificial material within one or more voids created by the removal of the portion of the interlevel dielectric layer. A signal transmission line is formed in a second metallization level formed over the interlevel dielectric layer, the signal transmission line being disposed over the sacrificial material. A portion of dielectric material included within the second metallization level is removed so as to expose the sacrificial material, wherein a portion of the sacrificial material is exposed through a plurality of access holes formed through the signal transmission line. The sacrificial material is removed so as to create an air gap beneath the signal transmission line.

Abstract: Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention can be applied to form passive elements and interconnects on a conventional semiconductor substrate after the typical BEOL, and prior to packaging. The method may provide better electromigration characteristics, lower resistivity, and higher Q factors for conductive structures. In addition, the method is backwardly compatible and customizable.