Patents by Inventor Robert L. Borwick
Robert L. Borwick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120057839Abstract: A waveguide component encapsulation device may include a housing having first and second surfaces, the housing defining a channel extending through the first and second surfaces, a micromachined waveguide component configured to be positioned in the channel, the waveguide component having first and second ends extending outside the channel and beyond the first and second surfaces of the housing by a finite length, and a pair of spacing members configured to align and stabilize the waveguide component within the channel.Type: ApplicationFiled: September 7, 2010Publication date: March 8, 2012Inventors: Jonathan Hacker, Chris Hillman, Mark Field, Robert L. Borwick, III
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Patent number: 8088667Abstract: A fabrication method which forms vertical capacitors in a substrate. The method is preferably an all-dry process, comprising forming a through-substrate via hole in the substrate, depositing a first conductive material layer into the via hole using atomic layer deposition (ALD) such that it is electrically continuous across the length of the via hole, depositing an electrically insulating, continuous and substantially conformal isolation material layer over the first conductive layer using ALD, and depositing a second conductive material layer over the isolation material layer using ALD such that it is electrically continuous across the length of the via hole. The layers are arranged such that they form a vertical capacitor. The present method may be successfully practiced at temperatures of less than 200° C., thereby avoiding damage to circuitry residing on the substrate that might otherwise occur.Type: GrantFiled: November 5, 2008Date of Patent: January 3, 2012Assignee: Teledyne Scientific & Imaging, LLCInventors: Jeffrey F. DeNatale, Philip A. Stupar, Alexandros P. Papavasiliou, Robert L. Borwick, III
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Patent number: 8080736Abstract: A foldable microcircuit is initially a planar semiconductor wafer on which circuitry has been formed. The wafer is segmented into a plurality of tiles, and a plurality of hinge mechanisms are coupled between adjacent pairs of tiles such that the segmented wafer can be folded into a desired non-planar configuration having a high fill-factor and small gaps between tiles. The hinge mechanisms can comprise an organic material deposited on the wafer such that it provides mechanical coupling between adjacent tiles, with metal interconnections between tiles formed directly over the organic hinges, or routed between adjacent tiles via compliant bridges. Alternatively, the interconnection traces between tiles can serve as part or all of a hinge mechanism. The foldable microcircuit can be, for example, a CMOS circuit, with the segmented tiles folded to form, for example, a semi-spherical structure arranged to provide a wide FOV photodetector array.Type: GrantFiled: February 18, 2009Date of Patent: December 20, 2011Assignee: Teledyne Scientific & Imaging, LLCInventors: Jeffrey F. DeNatale, Philip A. Stupar, Robert L. Borwick, III
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Publication number: 20110232782Abstract: A system is disclosed for charging a compact vapor cell, including placing an alkali-filled capillary into a reservoir cell formed in a substrate, the reservoir cell in vapor communication with an interrogation cell in the substrate and bonding a transparent window to the substrate on a common face of the reservoir cell and the interrogation cell to form a compact vapor cell. Capillary action in the capillary delays migration of alkali in the alkali-filled capillary from the reservoir cell into the interrogation cell during the bonding.Type: ApplicationFiled: December 22, 2009Publication date: September 29, 2011Inventors: Robert L. Borwick, III, Alan L. Sailer, Jeffrey F. DaNatale, Philip A. Stupar, Chialun Tsai
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Publication number: 20110147367Abstract: A vapor cell includes an interrogation cell in a substrate, the interrogation cell having an entrance window and an exit window, and a first transparent thin-film heater in thermal communication with the entrance window. The transparent thin-film heater has a first layer in communication with a first pole contact at a proximal end of the heater and a layer coupler contact at a distal end, a second layer in communication with a second pole contact at the proximal end, and the second layer electrically coupled to the layer coupler contact at the distal end. An insulating layer is sandwiched between the first and second layers. The insulating layer has an opening at the distal end to admit the layer coupler contact and to insulate the remainder of the second layer from the first layer.Type: ApplicationFiled: December 22, 2009Publication date: June 23, 2011Inventors: Robert L. Borwick, III, Jeffrey F. DeNatale, Chialun Tsai, Philip A. Stupar, Ya-Chi Chen
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Publication number: 20110131798Abstract: The present invention relates to microfabricated inductors with through-wafer vias. In one embodiment, the present invention is an inductor including a first wafer, a first plurality of metal fillings located within the first wafer, and a first plurality of metal conductors connecting the first plurality of metal fillings together to form a first spiral with a first plurality of windings. In another embodiment, the present invention is a method for producing an inductor including the steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, and connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral.Type: ApplicationFiled: February 14, 2011Publication date: June 9, 2011Applicant: TELEDYNE SCIENTIFIC & IMAGING, LLCInventors: Alexandros Papavasiliou, Jeffrey F. DeNatale, Philip A. Stupar, Robert L. Borwick, III
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Publication number: 20110121427Abstract: An through-substrate via fabrication method requires forming a through-substrate via hole in a semiconductor substrate, depositing an electrically insulating, continuous and substantially conformal isolation material onto the substrate and interior walls of the via using ALD, depositing a conductive material into the via and over the isolation material using ALD such that it is electrically continuous across the length of the via hole, and depositing a polymer material over the conductive material such that any continuous top-to-bottom openings present in the via holes are filled by the polymer material. The basic fabrication method may be extended to provide vias with multiple conductive layers, such as coaxial and triaxial vias.Type: ApplicationFiled: January 26, 2011Publication date: May 26, 2011Inventors: Philip A. Stupar, Jeffrey F. DeNatale, Robert L. Borwick, III, Alexandros P. Papavasiliou
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Patent number: 7810379Abstract: A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer—typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments.Type: GrantFiled: August 30, 2007Date of Patent: October 12, 2010Assignee: Rockwell Scientific Licensing LLCInventors: Jeffrey F. DeNatale, Robert L. Borwick, III, Philip A. Stupar
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Publication number: 20100225436Abstract: The present invention relates to microfabricated inductors with through-wafer vias. In one embodiment, the present invention is an inductor including a first wafer, a first plurality of metal fillings located within the first wafer, and a first plurality of metal conductors connecting the first plurality of metal fillings together to form a first spiral with a first plurality of windings. In another embodiment, the present invention is a method for producing an inductor including the steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, and connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral.Type: ApplicationFiled: March 5, 2009Publication date: September 9, 2010Applicant: TELEDYNE SCIENTIFIC & IMAGING, LLCInventors: Alexandros Papavasiliou, Jeffrey F. DeNatale, Philip A. Stupar, Robert L. Borwick, III
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Publication number: 20100207229Abstract: A foldable microcircuit is initially a planar semiconductor wafer on which circuitry has been formed. The wafer is segmented into a plurality of tiles, and a plurality of hinge mechanisms are coupled between adjacent pairs of tiles such that the segmented wafer can be folded into a desired non-planar configuration having a high fill-factor and small gaps between tiles. The hinge mechanisms can comprise an organic material deposited on the wafer such that it provides mechanical coupling between adjacent tiles, with metal interconnections between tiles formed directly over the organic hinges, or routed between adjacent tiles via compliant bridges. Alternatively, the interconnection traces between tiles can serve as part or all of a hinge mechanism. The foldable microcircuit can be, for example, a CMOS circuit, with the segmented tiles folded to form, for example, a semi-spherical structure arranged to provide a wide FOV photodetector array.Type: ApplicationFiled: February 18, 2009Publication date: August 19, 2010Inventors: Jeffrey F. DeNatale, Philip A. Stupar, Robert L. Borwick, III
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Patent number: 7735362Abstract: A method for diagnosing a fluid includes sensing a property of the fluid and the temperature of the fluid at the time the property is sensed, then determining the status of the fluid from the sensing. The sample volume may be small in comparison to the total fluid volume.Type: GrantFiled: March 31, 2006Date of Patent: June 15, 2010Assignee: Teledyne Licensing, LLCInventors: Jeffrey F. DeNatale, Robert L. Borwick, III, Philip A. Stupar, Martin W. Kendig
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Publication number: 20100110607Abstract: A fabrication method which forms vertical capacitors in a substrate. The method is preferably an all-dry process, comprising forming a through-substrate via hole in the substrate, depositing a first conductive material layer into the via hole using atomic layer deposition (ALD) such that it is electrically continuous across the length of the via hole, depositing an electrically insulating, continuous and substantially conformal isolation material layer over the first conductive layer using ALD, and depositing a second conductive material layer over the isolation material layer using ALD such that it is electrically continuous across the length of the via hole. The layers are arranged such that they form a vertical capacitor. The present method may be successfully practiced at temperatures of less than 200° C., thereby avoiding damage to circuitry residing on the substrate that might otherwise occur.Type: ApplicationFiled: November 5, 2008Publication date: May 6, 2010Inventors: Jeffrey F. DeNatale, Philip A. Stupar, Alexandros P. Papavasiliou, Robert L. Borwick, III
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Patent number: 7538032Abstract: Embodiments of the present invention are directed to a process for forming small diameter vias at low temperatures. In preferred embodiments, through-substrate vias are fabricated by forming a through-substrate via; and depositing conductive material into the via by means of a flowing solution plating technique, wherein the conductive material releases a gas that pushes the conductive material through the via to facilitate plating the via with the conductive material. In preferred embodiments, the fabrication of the substrate is conducted at low temperatures.Type: GrantFiled: June 23, 2005Date of Patent: May 26, 2009Assignee: Teledyne Scientific & Imaging, LLCInventors: Robert L. Borwick, Philip A. Stupar, Jeffrey F. DeNatale, Chailun Tsai, Zhimin J. Yao, Kathleen Garrett, John White, Les Warren, Morgan Tench
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Publication number: 20080238446Abstract: A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer—typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments.Type: ApplicationFiled: August 30, 2007Publication date: October 2, 2008Inventors: Jeffrey F. DeNatale, Robert L. Borwick, Philip A. Stupar
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Patent number: 7346981Abstract: A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate to the one side of the wafer using an adhesive bonding agent, the substrate overlying the patterned layer of material; selectively removing portions of the wafer from the side opposite the one side to define stationary and movable MEMS elements; and selectively removing the adhesive bonding agent to release the movable MEMS element, at least a portion of the layer of material being disposed so as to be attached to the movable MEMS element.Type: GrantFiled: June 2, 2003Date of Patent: March 25, 2008Assignee: Teledyne Licensing, LLCInventors: Robert L. Borwick, III, Philip A. Stupar, Jeffrey F. DeNatale, Jun J. Yao, Sangtae Park
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Patent number: 7328604Abstract: A microelectromechanical (MEM) fluid health sensing device comprises a viscosity sensor which provides an output that varies with the viscosity of a fluid in which it is immersed, and at least one other sensor which provides an output that varies with another predetermined parameter of the fluid. The viscosity sensor is preferably a MEM device fabricated by means of a “deep etch” process. The sensors are preferably integrated together on a common substrate, though they might also be fabricated separately and packaged together to form a hybrid device. A data processing means may be included which receives the sensor outputs and provides one or more outputs indicative of the health of the fluid. Sensor types which may be part of the present device include, for example, a temperature sensor, a MEM electrochemical sensor, a MEM accelerometer, a MEM contact switch lubricity sensor, and/or an inductive metallic wear sensor.Type: GrantFiled: September 22, 2005Date of Patent: February 12, 2008Assignee: Teledyne Licensing, LLCInventors: Jeffrey F. DeNatale, Robert L. Borwick, III, Philip A. Stupar, Martin W. Kendig
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Patent number: 7329932Abstract: A MEM viscosity sensor comprises a substrate, with first and second support structures affixed to the substrate and spaced-apart. A compliant member is affixed to the support structures such that it is suspended above and can flex vertically with respect to the substrate. The member has a high density of perforations, through which a fluid whose viscosity is to be sensed can flow. The sensor includes a drive means to apply a force to the member, and a sensing means to sense the vertical motion of the member in response to the applied force. The member's perforations ensure that its resistance to motion will be shear in nature, and minimizes sensitivity to particulates. The substrate is also preferably perforated to further reduce non-shear forces and facilitate fluid exchange.Type: GrantFiled: September 12, 2005Date of Patent: February 12, 2008Assignee: Teledyne Licensing, LLCInventors: Jeffrey F. DeNatale, Robert L. Borwick, III, Philip A. Stupar
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Patent number: 7303935Abstract: A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer—typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments.Type: GrantFiled: September 8, 2005Date of Patent: December 4, 2007Assignee: Teledyne Licensing, LLCInventors: Jeffrey F. DeNatale, Robert L. Borwick, III, Philip A. Stupar
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Patent number: 7287415Abstract: Embodiments of the present invention are directed to a MEM viscosity sensor that is configured to be operated submerged in a liquid. The MEMS viscosity sensor comprises a MEMS variable capacitor comprising a plurality of capacitor plates capable of being submerged in a liquid. An actuator places a driving force on the variable capacitor which causes relative movement between the plates, where the movement creates a shear force between each moving plate and the liquid, which damps the movement of the plate and increases the capacitor's response time to the applied force in accordance with the liquid's viscosity. To determine the actual viscosity of the liquid, a sensor is coupled to the variable capacitor for sensing the response time of the plates as an indicator of the liquid's viscosity.Type: GrantFiled: September 30, 2004Date of Patent: October 30, 2007Assignee: Teledyne Licensing, LLCInventors: Robert L. Borwick, III, Philip A. Stupar, Jeffrey F. DeNatale
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Patent number: 7261430Abstract: A micromirror apparatus includes a device layer having a recess, a multilayer thin-film dielectric reflector coupled to and structurally supported by the device layer on the opposite side of the device layer from said recess, and a stress compensator seated in the recess, with the stress compensator operable to resist device layer bending moments resulting from intrinsic and thermal mismatch stresses between the multilayer thin-film dielectric reflector and the device layer.Type: GrantFiled: February 22, 2006Date of Patent: August 28, 2007Assignee: Teledyne Licensing, LLCInventors: Jeffrey F. DeNatale, Philip A. Stupar, Chialun Tsai, Robert L. Borwick, III