Abstract: A MEMS module is provided comprising at least one MEMS device adhesively bonded to a substrate or wafer, such as a CMOS die, carrying pre-processed electronic circuitry. The at least one MEMS device, which may comprise a sensor or an actuator, may thus be integrated with related control, readout/signal conditioning, and/or signal processing circuitry. An example of a method pursuant to the invention comprises the adhesive bonding of a pre-processed electronics substrate or wafer to a layered structure preferably in the form of a silicon-on-insulator (SOI) substrate. The SOI is then bulk micromachined to selectively remove portions thereof to define the MEMS device. Prior to release of the MEMS device, the device and the associated electronic circuitry are electrically interconnected, for example, by wire bonds or metallized vias.

Abstract: A MEMS module is provided comprising at least one MEMS device adhesively bonded to a substrate or wafer, such as a CMOS die, carrying pre-processed electronic circuitry. The at least one MEMS device, which may comprise a sensor or an actuator, may thus be integrated with related control, readout/signal conditioning, and/or signal processing circuitry.

Abstract: Micro-electromechanical (MEM) devices having their fixed and movable members immersed in a liquid medium. Movement is effected by applying a stimulus which creates a force that causes the movable member to move with respect to the fixed member. The movable and fixed members are immersed in a liquid medium having desired characteristics. The liquid is preferably selected to have a viscosity which critically damps the motion of the movable member. The liquid may also be chosen to provide a dielectric constant greater than one, which, where applicable, increases the electrostatic force created for a given drive voltage, and the device's capacitance sensing range, over what they would be in air. The liquid medium might also be used to improve the device's thermal dissipation characteristics, or to provide improved isolation between structures.

Abstract: A MEMS device of the invention comprises a substrate and a pair of MEMS elements supported by the substrate, each of the MEMS elements having a bottom surface facing the substrate, a top surface and a side wall. The side walls are in spaced-apart, confronting relationship and the bottom surfaces are substantially coplanar. The bottom surface of each of the MEMS elements carries an electrically conductive layer, at least one of the pair of MEMS elements being movable relative to the other MEMS element to vary the spacing between the side walls.

Abstract: Micro-electromechanical (MEM) devices having their fixed and movable members immersed in a liquid medium. Movement is effected by applying a stimulus which creates a force that causes the movable member to move with respect to the fixed member. The movable and fixed members are immersed in a liquid medium having desired characteristics. The liquid is preferably selected to have a viscosity which critically damps the motion of the movable member. The liquid may also be chosen to provide a dielectric constant greater than one, which, where applicable, increases the electrostatic force created for a given drive voltage, and the device's capacitance sensing range, over what they would be in air. The liquid medium might also be used to improve the device's thermal dissipation characteristics, or to provide improved isolation between structures.

Abstract: A microelectromechanical system (MEMS), formed on a substrate, comprises a utilization device having a first state and a second state, and a Lorentz force actuator having an actuator element coupled to the utilization device. The actuator element is displaceable by the Lorentz force to alter the state of the utilization device from the first state to the second state thereof. An electrostatic device, coupled to the utilization device, is electrically chargeable to electrostatically hold the utilization device in the second state thereof with minimal electrical power consumption. The utilization device may be of any kind including electrical, fluidic, optical or mechanical. For example, the utilization device may comprise an electrical switch, in which case the first state of the utilization device may comprise an open state of the switch and the second state may comprise a closed state of the switch.