Abstract: A system and method are provided for simulating circuits that transmit bidirectional signals between some ports using simulators designed originally for electrical circuits and systems, that eliminate the need for different port interfaces. The system and method can be applied to simulate photonic circuits either standalone or integrated with electrical circuits and systems. In one method implemented by the system potential and flow representations, available for example in Verilog-A simulators, are used to create bidirectional signals on a single bus line to transmit optical signals. In another method implemented by the system, the system auto-configures each optical port type as left or right at runtime or during a pre-simulation initialization to allow for bidirectional signals with a single port interface.

Abstract: A method of generating an image is disclosed. A mask and descriptive text associated with a subject are received. The descriptive text comprises a text prompt. The mask is resized to fit within a predefined bounding box and the resized mask is centered on a background image. The centered mask is filled with noise. Output of an image of the subject on a solid background is received from a generative AI model in response to a passing of a request to the generative AI model. The request includes the noise-filled mask and the descriptive text.

Abstract: An integrated circuit includes a semiconductor substrate. The integrated circuit also includes a trench in the semiconductor substrate, the trench including a layer of a nanoparticle material. The integrated circuit further includes an interconnect region above the trench.

Abstract: An integrated circuit has a substrate that includes a semiconductor material, and an interconnect region disposed on the substrate. The integrated circuit includes a thermal routing trench in the substrate. The thermal routing trench includes a cohered nanoparticle film in which adjacent nanoparticles are cohered to each other. The thermal routing trench has a thermal conductivity higher than the semiconductor material contacting the thermal routing trench. The cohered nanoparticle film is formed by an additive process.

Abstract: The present application is directed towards compounds, pharmaceutically acceptable salts or prodrugs thereof, which are inhibitors of Histone Deacetylase (HDAC) binding or function. The compounds especially may have some selectivity for inhibiting Class IIa versus Class I HDACs. The present application also relates to methods of using the compounds and to uses of the compounds, especially in relation to the prevention of a disease, disorder or condition associated with Class IIa HDAC activity. In one form, the compounds are (ortho-phenyl) phenyl hydroxamates. In another form, the compounds are as provided in Formula (I), wherein R1 is a phenyl or cycloalkenyl which may be optionally substituted.

Abstract: A system and method are provided for simulating circuits that transmit bidirectional signals between some ports using simulators designed originally for electrical circuits and systems, that eliminate the need for different port interfaces. The system and method can be applied to simulate photonic circuits either standalone or integrated with electrical circuits and systems. In one method implemented by the system potential and flow representations, available for example in Verilog-A simulators, are used to create bidirectional signals on a single bus line to transmit optical signals. In another method implemented by the system, the system auto-configures each optical port type as left or right at runtime or during a pre-simulation initialization to allow for bidirectional signals with a single port interface.

Abstract: An integrated circuit has a substrate and an interconnect region disposed on the substrate. The interconnect region includes a plurality of interconnect levels. Each interconnect level includes interconnects in dielectric material. The integrated circuit includes a thermal via in the interconnect region. The thermal via extends vertically in at least one of the interconnect levels in the interconnect region. The thermal via includes a cohered nanoparticle film in which adjacent nanoparticles are cohered to each other. The thermal via has a thermal conductivity higher than dielectric material touching the thermal via. The cohered nanoparticle film is formed by a method which includes an additive process.

Abstract: An integrated circuit has a substrate and an interconnect region disposed on the substrate. The interconnect region includes a plurality of interconnect levels. Each interconnect level includes interconnects in dielectric material. The integrated circuit includes a thermal via in the interconnect region. The thermal via extends vertically in at least one of the interconnect levels in the interconnect region. The thermal via includes a cohered nanoparticle film in which adjacent nanoparticles are cohered to each other. The thermal via has a thermal conductivity higher than dielectric material touching the thermal via. The cohered nanoparticle film is formed by a method which includes an additive process.

Abstract: A system and method are provided for simulating circuits that transmit bidirectional signals between some ports using simulators designed originally for electrical circuits and systems, that eliminate the need for different port interfaces. The system and method can be applied to simulate photonic circuits either standalone or integrated with electrical circuits and systems. In one method implemented by the system potential and flow representations, available for example in Verilog-A simulators, are used to create bidirectional signals on a single bus line to transmit optical signals. In another method implemented by the system, the system auto-configures each optical port type as left or right at runtime or during a pre-simulation initialization to allow for bidirectional signals with a single port interface.

Abstract: A cover for a car includes a cloth or clothlike cover base, a tinted aluminum coating disposed on an outer surface of the cloth or clothlike cover base; and one or more security flaps connected to an inner surface of the cloth or clothlike cover base at a position that enables the one or more security flaps to be inserted into one or more of the car's doors.

Abstract: An inverse design machine for making a manufactured article that includes a designer Impact-mitigating architectured isotropic structure includes: an input unit that receives a primary structure; a primary structure analyzer that receives the primary structure from the input unit and determines primary properties of the primary structure; a structure adjuster that receives the primary properties from the primary structure analyzer, receives impact-mitigating properties from a structural property manager, and produces the designer Impact-mitigating architectured isotropic structure from the impact-mitigating properties; and the structural property manager that provides the impact-mitigating properties to the structure adjuster.

Abstract: An inverse design machine for making a manufactured article that includes a designer Impact-mitigating architectured isotropic structure includes: an input unit that receives a primary structure; a primary structure analyzer that receives the primary structure from the input unit and determines primary properties of the primary structure; a structure adjuster that receives the primary properties from the primary structure analyzer, receives impact-mitigating properties from a structural property manager, and produces the designer Impact-mitigating architectured isotropic structure from the impact-mitigating properties; and the structural property manager that provides the impact-mitigating properties to the structure adjuster.

Abstract: Systems and methods of sequestering carbon dioxide in concrete are described herein. The methods include combining water and a foaming agent to form a foaming agent mixture, adding a gas comprising carbon dioxide to the foaming agent mixture in a first mixing chamber, mixing the water, the gas comprising carbon dioxide and the foaming agent to form a foam mixture in the first mixing chamber, the foam mixture comprising a plurality of foam bubbles containing the at least a portion of the carbon dioxide, combining the foam mixture with concrete materials in a second mixing chamber so that the foam mixture contacts the concrete materials, the concrete materials comprising cement, and mixing the foam mixture and the concrete materials in the second mixing chamber to form the concrete having the carbon dioxide sequestered therein.

Abstract: A device for cleaning an instrument includes a manifold comprising one or more fluid inlets, and a tubular member rotatable relative to and extending distally from the manifold. The tubular member includes a proximal end, a distal end, and a fluid outlet at the distal end. The fluid outlet is configured to direct a flow of fluid generally across the distal end of the tubular member. The tubular member also includes one or more fluid passages fluidically coupled to the fluid outlet, and the one or more fluid passages extend from the fluid outlet to the manifold. The manifold and tubular member are configured to receive a shaft of an imaging instrument in a position such that the shaft of the imaging instrument extends through the manifold to the distal end of the tubular member. Systems and methods relate to instruments and cleaning devices.

Abstract: A packaged electronic device includes an integrated circuit and an electrically non-conductive encapsulation material in contact with the integrated circuit. A thermal conduit extends from an exterior of the package, through the encapsulation material, to the integrated circuit. The thermal conduit has a thermal conductivity higher than the encapsulation material contacting the thermal conduit. The thermal conduit includes a cohered nanoparticle film. The cohered nanoparticle film is formed by a method which includes an additive process.

Abstract: A surgical instrument comprises first and second jaws movable relative to each other between open and closed positions, a cutting electrode with a cutting surface for tissue dissection and at least one sealing electrode for sealing or coagulating tissue. The cutting electrode includes one or more insulation layers for securing the cutting electrode to one of the jaws and for protecting the jaws from the heat and energy generated at the cutting surface during operation. An actuator mechanism is coupled to the first and second jaws for moving the jaws between the open and closed positions. At least one portion of the actuator mechanism comprises a conductive pathway for electrically coupling the cutting and/or sealing electrode(s) to a source of energy. Thus, the mechanical components of the actuator mechanism include electrically conductive pathways to reduce the number of conductors extending through the device, thereby providing a more compact and maneuverable instrument.

Abstract: A packaged electronic device includes an integrated circuit and an electrically non-conductive encapsulation material in contact with the integrated circuit. A thermal conduit extends from an exterior of the package, through the encapsulation material, to the integrated circuit. The thermal conduit has a thermal conductivity higher than the encapsulation material contacting the thermal conduit. The thermal conduit includes a cohered nanoparticle film. The cohered nanoparticle film is formed by a method which includes an additive process.

Abstract: An integrated circuit has a substrate that includes a semiconductor material, and an interconnect region disposed on the substrate. The integrated circuit includes a thermal routing trench in the substrate. The thermal routing trench includes a cohered nanoparticle film in which adjacent nanoparticles are cohered to each other. The thermal routing trench has a thermal conductivity higher than the semiconductor material contacting the thermal routing trench. The cohered nanoparticle film is formed by an additive process.

Abstract: A method for modifying an aperture in a component, a system for modifying flow through a component, and a turbine component are disclosed. The method includes providing a substrate having at least one aperture having an electrically-conductive surface, providing a deposition device including an ESD torch, the ESD torch including an aperture penetrating electrode including a conductive material, inserting the aperture penetrating electrode at least partially into the aperture, and generating an arc between the aperture penetrating electrode and the electrically-conductive surface to deposit electrode material within the aperture. The system includes the ESD torch removably supported in an electrode holder. The turbine component includes at least one aperture having an electrospark deposited material along an electrically-conductive surface, the electrospark deposited material providing modified fluid flow through the turbine component.

Abstract: An integrated circuit has a substrate which includes a semiconductor material, and an interconnect region disposed on the substrate. The integrated circuit includes a thermal routing trench in the substrate. The thermal routing trench includes a cohered nanoparticle film in which adjacent nanoparticles are cohered to each other. The thermal routing trench has a thermal conductivity higher than the semiconductor material contacting the thermal routing trench. The cohered nanoparticle film is formed by an additive process.