Abstract: Chip scale package such as a chip scale package having a chip integrated therein to provide an integrated chip scale package.

Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

Abstract: Some examples include a machine-readable storage medium with instructions executable by a processing resource of a device to process a file according to a pre-defined workflow. The machine-readable storage medium comprises instructions to receive a message to process the file at a workflow queue, to forward the file, by a policy workflow worker, to a first workflow process worker that corresponds to the file, and to perform, at the first workflow process worker, a first workflow process on the message. The machine-readable storage medium further comprises instructions to return, by the first workflow process worker, the processed message to the workflow queue, wherein the processed message includes the file and a first result, to evaluate, by the policy workflow worker, the processed message against the pre-defined workflow and, based on the evaluation, to forward the processed message, by the policy workflow worker, to a second workflow process worker or an output queue.

Abstract: Filtering device (20) to draw water from an aquarium and the like and make water circulate inside, including a container (30) comprising a first housing portion (32) having a first inlet (174) and a second inlet (176) for the entry of water taken from the aquarium into the first housing portion (32) which is able to contain at least one filter for filtering water, further including a flow control device (50) having an entry (60) for taking water from the aquarium and it has two operating positions, a first operating position or filtering position wherein the entry (60) is in communication with the first inlet (174), so that water taken from the aquarium is put into the first housing portion (32), passes through the first inlet (174), is filtered and then is put back into the aquarium, and a second operating position or cleaning position or backwash position, wherein the entry (60) is in communication with the second inlet (176), water taken from the aquarium enters into the first housing portion (32) through

Abstract: An integrated circuit has a thermal routing structure above a top interconnect level. The top interconnect level includes interconnects connected to lower interconnect levels, and does not include bond pads, probe pads, input/output pads, or a redistribution layer to bump bond pads. The thermal routing structure extends over a portion, but not all, of a plane of the integrated circuit containing the top interconnect level. The thermal routing structure includes a layer of nanoparticles in which adjacent nanoparticles are attached to each other. The layer of nanoparticles is free of an organic binder material. The thermal routing structure has a thermal conductivity higher than the metal in the top interconnect level. The layer of nanoparticles is formed by an additive process.

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Abstract: Examples described herein include receiving text of an email, determining a header of an email message in the email, and determining a body of the email message. Examples also include modifying the text of the email to indicate a beginning boundary and an ending boundary of the header, modifying the text of the email to indicate a beginning boundary and an ending boundary of the body, generating a hash of the header, generating a hash of the body, and tracing the email based on the hash of the header.

Abstract: Chip scale package such as a chip scale package having a chip integrated therein to provide an integrated chip scale package.

Abstract: An integrated circuit has a substrate and an interconnect region disposed on the substrate. The interconnect region includes a plurality of interconnect levels. Each interconnect level includes interconnects in dielectric material. The integrated circuit includes a graphitic via in the interconnect region. The graphitic via vertically connects a first interconnect in a first interconnect level to a second interconnect in a second, higher, interconnect level. The graphitic via includes a cohered nanoparticle film of nanoparticles in which adjacent nanoparticles cohere to each other, and a layer of graphitic material disposed on the cohered nanoparticle film. The nanoparticles include one or more metals suitable for catalysis of the graphitic material. The cohered nanoparticle film is formed by a method which includes an additive process. The graphitic via is electrically coupled to an active component of the integrated circuit.

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Abstract: Chip scale package such as a chip scale package having a chip integrated therein to provide an integrated chip scale package.

Abstract: Chip scale package such as a chip scale package having a chip integrated therein to provide an integrated chip scale package.

Abstract: The present invention provides modular trays having cutout features that are configured to engage with a mounting feature of one or more removable rails. The removable rails may be removably secured to a tray body in a plurality of positions to allow a user to install or uninstall rails to support different sized fiber optic modules. For example, a tray may support a twenty-four optical fiber module, two twelve optical fiber modules, or three eight optical fiber modules. Fiber optic enclosures housing the trays can be affixed to the outside of a fiber optic enclosure and allow for easy stacking and unstacking.

Abstract: A system for gathering and displaying data related to a wearer's performance and satisfaction in performing a job includes a wearable device to be worn by the wearer while performing the job. The wearable device includes sensors and is configured to collect and store data elements with values pertaining to one or more conditions associated with the ambient environment and/or the wearer. The wearable device also includes input and output devices to collect feedback data element regarding the wearer's job satisfaction. A server stores and analyzes the data elements to determine a job satisfaction score for the wearer and a correlation score that indicates a correlation between the job satisfaction values and one or more data elements pertaining to the ambient environment and/or the wearer. A reporting interface reports the job satisfaction and the correlation scores. A control interface allows an administrator to control settings related to operation of the system.

Abstract: An integrated circuit has a substrate and an interconnect region disposed on the substrate. The interconnect region includes a plurality of interconnect levels. Each interconnect level includes interconnects in dielectric material. The integrated circuit includes a graphitic via in the interconnect region. The graphitic via vertically connects a first interconnect in a first interconnect level to a second interconnect in a second, higher, interconnect level. The graphitic via includes a cohered nanoparticle film of nanoparticles in which adjacent nanoparticles cohere to each other, and a layer of graphitic material disposed on the cohered nanoparticle film. The nanoparticles include one or more metals suitable for catalysis of the graphitic material. The cohered nanoparticle film is formed by a method which includes an additive process. The graphitic via is electrically coupled to an active component of the integrated circuit.

Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

Abstract: The present invention provides modular trays having cutout features that are configured to engage with a mounting feature of one or more removable rails. The removable rails may be removeably secured to a tray body in a plurality of positions to allow a user to install or uninstall rails to support different sized fiber optic modules. For example, a tray may support a twenty-four optical fiber module, two twelve optical fiber modules, or three eight optical fiber modules. Fiber optic enclosures housing the trays can be affixed to the outside of a fiber optic enclosure and allow for easy stacking and unstacking.

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Abstract: A microelectronic device includes an electrical conductor which includes a graphene heterolayer. The graphene heterolayer includes a plurality of alternating layers of graphene and barrier material. Each layer of the graphene has one to two atomic layers of graphene. Each layer of the barrier material has one to three layers of hexagonal boron nitride, cubic boron nitride, and/or aluminum nitride. The layers of graphene and the layers of barrier material may be continuous, or may be disposed in nanoparticles of a nanoparticle film.