Abstract: Various embodiments of the present invention provide systems and methods for selecting data encoding. As an example, some embodiments of the present invention provide methods that include receiving a data set to be written to a plurality of multi-bit memory cells that are each operable to hold at least two bits. In addition, the methods include determining a characteristic of the data set, and encoding the data set. The level of encoding is selected based at least in part on the characteristic of the data set. In some instances of the aforementioned embodiments, the characteristic of the data set indicates an expected frequency of access of the data set from the plurality of multi-bit memory cells.

Abstract: A barrier layer can be attached in a semiconductor package to one or more sensitive devices. The barrier layer can be used to obstruct tampering by a malicious agent attempting to access sensitive information on the sensitive device. The barrier layer can cause the sensitive device to become inoperable if physically tampered. Additional other aspects of the protective packaging provide protection against x-ray and thermal probing as well as chemical and electrical tampering attempts.

Abstract: There is provided a system and method for a copper stud bump wafer level package. There is provided a semiconductor package comprising a semiconductor die having a plurality of bond pads on an top surface thereof, a plurality of metallic stud bumps mechanically and electrically coupled to said plurality of bond pads, and a plurality of solder balls mechanically and electrically coupled to said plurality of metallic stud bumps. Advantageously, the metallic stud bumps may be provided using standard wirebonding equipment, avoiding the conventional wafer level package requirement for photolithography and deposition steps to provide a multi-layer metallic routing structure. As a result, reduced cycle times, lower cost, and reduced complexity may be provided. Alternative fabrication processes utilizing metallic stud bumps may also support multi-die packages with dies from different wafers and packages with die perimeter pads wirebonded to substrates.

Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

Abstract: There is provided a system and method for a spot plated leadframe and an IC bond pad via array design for copper wire. There is provided a semiconductor package comprising a leadframe having a pre-plated finish and a spot plating on said pre-plated finish, a semiconductor die including a bond pad on a top surface thereof, and a copper wire bonded to said spot plating and to said bond pad. Optionally, a novel corner via array design may be provided under the bond pad for improved package performance while maintaining the integrity of the copper wire bond. The semiconductor package may provide several advantages including high MSL ratings, simplified assembly cycles, avoidance of tin whisker issues, and low cost compared to conventional packages using gold wire bonds.

Abstract: Various embodiments of the present invention provide systems, methods and circuits for memories and utilization thereof. As one example, a memory system is disclosed that includes a flash memory device and a flash access circuit. The flash access circuit is operable to perform an error code encoding algorithm on a data set to yield an error code, to write the data set to the flash memory device at a first location, and to write the error code to the flash memory device at a second location.

Abstract: There is provided a system and method for a shielded connector module with a molded hood and an LED light pipe. There is provided a shielded connector module comprising a system-in-package (SiP) device having a surface mounted light emitting diode (LED), a metallic shield surrounding the SiP device, a molded hood surrounding the metallic shield, and an LED light pipe in a proximity with the surface mounted LED, the LED light pipe being directed through the metallic shield and the molded hood. By designing the LED light pipe with a concave surface for surrounding the surface mounted LED and by using various techniques to reduce a gap between the LED and the light pipe, light capture and transmission may be optimized for easily viewable high intensity light. A fresnel lens may be optionally attached to the light pipe for wider viewing angles.

Abstract: There is provided a system and method for an externally wire bondable chip scale package in a system-in-package module. There is provided a system-in-package module comprising a substrate including a first contact pad disposed thereon, a packaged device attached to the substrate, wherein an electrode of the packaged device is wirebonded to the first contact pad, and an unpackaged device, wherein an electrode of the unpackaged device is coupled to the substrate. By flipping the packaged device within the module and utilizing wire bondable finishes on the packaged device, an externally wire bondable chip scale package may be provided. The structure of the disclosed system-in-package module provides several advantages over conventional designs including increased yields, a single assembly line, facilitated die substitution, reduced heat stress, higher package density, and a simplified single package structure for reduced fabrication time and cost.

Abstract: Wafer level packaging (WLP) packages semiconductor dies onto a wafer structure. After the wafer level package is complete, individual packages are obtained by singulating the wafer level package. The resulting package has a small form factor suitable for miniaturization. Unfortunately conventional WLP have poor heat dissipation. An interposer with a thermal pad can be attached to the semiconductor die to facilitate improved heat dissipation. In one embodiment, the interposer can also provide a wafer substrate for the wafer level package. Furthermore, the interposer can be constructed using well established and inexpensive processes. The thermal pad attached to the interposer can be coupled to the ground plane of a system where heat drawn from the semiconductor die can be dissipated.

Abstract: Various data acquisition, storage and/or distribution systems and devices are described herein. As one example, a mobile data acquisition and distribution device is described. The device includes a non-volatile storage medium, a wireless interface, and a processor. The non-volatile storage medium includes instructions executable by the processor to: receive a user data set, and to store the user data set to the non-volatile storage medium. The instructions are further executable by the processor to receive a request initiated through a remote user interface via the wireless interface. Where the request is to provide the user data set to a recipient device, the instructions are further executable by the processor to provide the user data set to the recipient device via the wireless interface.

Abstract: Various embodiments of the present invention provide for extended life operation of multi-bit memory cells. As an example, some embodiments of the present invention provide electronic systems that include a plurality of multi-bit memory cells, an encoding circuit and a decoding circuit. Each of the plurality of multi-bit memory cells is operable to hold at least two bits. The encoding circuit is operable to receive a data input including at least two data bits, and to encode the two data bits as an encoded output to the plurality of multi-bit memory cells. The encoded output may be selected to be either a single two bit output representing the two bits, or a series of two two bit outputs representing the two bits. The decoding circuit is operable to reverse the encoding applied by the encoding circuit.

Abstract: A power management circuit is provided for a data storage device that is adapted for communicating with a host via an interface circuit. The power management circuit is responsive to a utilization of a control circuit of the data storage device, determined independently of the communication between the data storage device and the host, in providing a supply power to the data storage device. A method is provided comprising connecting a data storage device with a host via an interface circuit; sending data transfer commands from the host to the interface circuit; and monitoring the utilization of a control circuit of the data storage device in terms of the rate at which commands are processed by the control circuit for use in selectively providing a supply power to the data storage device.

Abstract: An apparatus comprising an arbiter circuit, a protocol engine circuit and a channel router circuit. The arbiter circuit may be configured to determine a winning channel from a plurality of channel requests based on a first criteria. Each of the plurality of channel requests may represent a burst of data having a fixed length aligned to an address boundary of a memory. The protocol engine circuit may be configured to receive a signal from the arbiter circuit indicating the winning channel. The protocol engine circuit may also be configured to perform a memory protocol at a granularity equal to the burst of data. The channel router circuit may be configured to present the plurality of channel requests to the arbiter circuit and the protocol engine circuit.

Abstract: There is provided a system and method for unpackaged and packaged IC stacked in a system-in-package module. There is provided a system-in-package module comprising a substrate including a first contact pad and a second contact pad disposed thereon, a packaged device disposed on the substrate, and an unpackaged device stacked atop the packaged device, wherein a first electrode of the packaged device is electrically and mechanically coupled to the first contact pad, and wherein a second electrode of the unpackaged device is electrically coupled to the second contact pad. The structure of the disclosed system-in-package module provides several advantages over conventional designs including increased yields, facilitated die substitution, enhanced thermal and grounding performance through direct connect vias, stacking of wider devices without a spacer, and a simplified single package structure for reduced fabrication time and cost.

Abstract: Various embodiments of the present invention provide systems, methods and circuits for memory utilization. As one example, a memory system is disclosed that includes a memory bank and a memory access controller circuit. The memory bank includes a number of default memory cells and a number of redundant memory cells. The memory access controller circuit is operable to access a usable memory space including both the combined default memory cells and the redundant memory cells.

Abstract: Various embodiments of the present invention provide systems, methods and circuits for power management and/or EMI reduction. As one example, a method for memory system access is disclosed that includes providing a first bank of memory; providing a second bank of memory; receiving a memory access request that includes assertion of a reference memory clock; accessing the first bank of memory using a first sub memory clock asserted relative to the reference memory clock; delaying a phase offset; and accessing the second bank of memory using a second sub memory clock asserted the phase offset after assertion of the first sub memory clock.

Abstract: There is provided a system-in-package (SiP) module that comprises a substrate, a semiconductor die attached to the substrate, a mold compound which encapsulates the semiconductor die, and an LED (light emitting diode) component attached to the substrate, where the LED component is at least partially located within the SiP module, such that the LED component can emit lights to outside of the SiP module.

Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

Abstract: An example semiconductor package with reduced solder voiding is described, which has a leadframe having an I/O pad and a thermal pad, a fabricated semiconductor die having a bond pad, where the fabricated semiconductor die is attached to a top surface of the thermal pad, and a wire bond connecting the bond pad to the I/O pad, where a bottom surface of the thermal pad has channels.