Abstract: Various embodiments of the present invention provide systems and methods for reducing power consumption in a device including a memory system. As one example, a system may include a memory system with a hard disk drive and a flash memory. The flash memory maintains a menu file that includes a list of content objects available on the hard disk drive. In addition, the system includes a processor that executes software maintained on the memory system to update the menu file when a previously unavailable content object becomes available on the hard disk drive. Further, in some cases, the processor executes software that is operable to update the menu file when a previously available content object becomes unavailable on the hard disk drive.

Abstract: Various data acquisition, storage and/or distribution systems and devices are described herein. As one example, a mobile data acquisition and distribution device is described. The device includes a non-volatile storage medium, a wireless interface, and a processor. The non-volatile storage medium includes instructions executable by the processor to: receive a user data set, and to store the user data set to the non-volatile storage medium. The instructions are further executable by the processor to receive a request initiated through a remote user interface via the wireless interface. Where the request is to provide the user data set to a recipient device, the instructions are further executable by the processor to provide the user data set to the recipient device via the wireless interface.

Abstract: Method and apparatus for transferring data. The apparatus preferably includes a first volatile memory block, a second volatile memory block coupled to a non-volatile circular buffer, and a controller configured to direct first data to the first volatile memory block for subsequent transfer to a downstream block, such as a data storage array. The controller is further configured to direct second data to the second volatile memory block for subsequent transfer to the non-volatile circular buffer. Preferably, the second volatile memory block forms a portion of a non-volatile random access memory (NVRAM) and the circular buffer is formed from a flash memory device. An intelligence block preferably controls said subsequent transfer of the second data from the second volatile memory block to the circular buffer. The second data are preferably transferred from the circular buffer to the downstream block in conjunction with the transfer of the first data.

Abstract: A substrate pad in a semiconductor package having a geometry and structure that facilitates providing a solder joint to the pad that has enhanced structural integrity and resistance to mechanical impact. The pad may include a plated metal stud that anchors the solder to the pad interface, providing a more compliant solder joint, even when lead-free solder is used.

Abstract: According to one exemplary embodiment, a method for forming a wafer level package includes fabricating an active device on a substrate in a semiconductor wafer, forming polymer walls around the active device, and applying a blanket film over the semiconductor wafer and the polymer walls to house the active device in a substantially enclosed cavity formed by the polymer walls and the blanket film. By way of examples and without limitation, the active device can be a microelectromechanical systems (“MEMS”) device, a bulk acoustic wave (“BAW”) filter, or a surface acoustic wave (“SAW”) filter. According to one embodiment, solder bumps can be applied to interconnect traces of the active device, and the semiconductor wafer can then be diced to form an individual die. According to another embodiment, the semiconductor wafer can be diced to form an individual die, then the individual die is wire bonded to a circuit board.

Abstract: Various systems and methods for distributing multiple Bluetooth data streams are discussed herein. As one example, a method for communicably coupling a single point Bluetooth device to multiple Bluetooth devices is taught. The method includes providing a multiport Bluetooth distributor that includes two or more Bluetooth protocol interfaces and a multiport processor. The multiport processor is operable to communicably couple one of the Bluetooth protocol interfaces to another Bluetooth protocol interface. The method further includes identifying at least two Bluetooth devices within range of the multiport Bluetooth distributor, and assembling a service offering based on the identified Bluetooth devices. The service offering includes a plurality of service types including at least a first service type and a second service type.

Abstract: Various systems and methods for allowing multi-user access to a wireless storage device are disclosed. For example, some embodiments of the present invention provide methods for sharing content objects that include providing a wireless storage device that is operable to communicably couple to a master device and a sharing device. The wireless storage device includes a memory on which one or more content objects are stored. The methods further include receiving a request to share that identifies the sharing device; and authorizing the request to share. Through authorizing the request to share, the sharing device is authorized to receive the content object.

Abstract: An apparatus and method are provided for testing integrated circuits. An integrated circuit arrangement is provided having first and second dice. Each die has circuitry for diagnostic testing in response to a diagnostic test signal. The circuitry further defines an input for receiving the diagnostic test signal and an output for transmitting results of the diagnostic testing for each of the dice. Interconnecting circuitry between the dice transmits the diagnostic test signal transmitted to the first die to the second die before the diagnostic testing is completed in the first die.

Abstract: According to one exemplary embodiment, an overmolded package comprises a semiconductor die situated on a substrate. The overmolded package further comprises an overmold situated over the semiconductor die and the substrate, where the overmold has a top surface. The overmolded package further comprises a conductive layer situated on the top surface of the overmold, where the conductive layer comprises a conductive polymer, and where the conductive layer forms an EMI and RFI shield. According to this exemplary embodiment, the overmolded package can further comprise a post situated over the substrate, where the post is connected to the conductive layer. The overmolded package can further comprise a hole situated in the overmold, where the hole is situated over the post, where the hole is filled with the conductive polymer, and where the conductive polymer is in contact with the post.

Abstract: A signal processing system includes a receiver for receiving an analog signal. The system also includes an analog-to-digital converter (ADC) coupled to the receiver. At each of a series of time intervals, the ADC outputs sequential digital codes. Each digital code corresponds to a sampled analog value of the received analog signal at each sample interval. The system further includes a memory in which the sequential digital codes may be stored, and a processing circuit for converting the digital codes into a series of binary data bits. The conversion may be performed in a different sequence than the sequence in which the digital codes are stored in the memory.

Abstract: Method and apparatus for transferring data to and from a data storage medium, such as a rotatable disc in a data storage device. The medium includes a data sector field with a physical length sufficient to store a first data block at a first write frequency. A compression engine compresses the first data block to provide a reduced size, compressed data block. The compressed data block is then written to the data sector field at a second write frequency less than the first write frequency so that the written compressed data block occupies substantially the physical length of said data sector field. This achieves a decreased linear bit density and tends to increase communication channel signal to noise (SNR) ratios and reduce error rates. Data slipping is further advantageously employed so that the first data block further stores at least a portion of a second compressed data block.

Abstract: The present invention compensates for variations in the angular velocity of the drive's spindle motor by periodically dropping clocks to a counter based upon the previous servo wedge-to-wedge timing. This enables a substantially constant count to be maintained between servo wedges and allows a more predictable generation of the data sector pulses. A more predictable generation of the data sector pulses enables the size of the guard band preceding each data sector to be decreased and the capacity of the disk to be correspondingly increased.

Abstract: A procedure for reading data stored on a data storage disc in a disc drive is disclosed. The procedure involves reading data from one or more sectors on the data storage disc after an error occurred while initially reading the sector(s) pursuant to a read command issued by a host computer. During the initial read, the procedure logs information pertaining to the sector(s) on the disc where an error occurred. The logged information is then used during the procedure to retrieve data from the sector(s) in a single revolution of the disc. The procedure uses a skip mask, a vector buffer management list and a data throttling mechanism to administer a transfer of data from a disc to a host computer via a data buffer.

Abstract: A disk drive provides head position information as position status variables to a host. The position status variables are derived from information formatted on a disk and processed by a media controller for storage in a position register set. The position information includes both radial and circumferential position references. The disk drive is connected to the host over a host interface which enables the position information to be stored automatically in a host memory so that the host can scan the position information to determine an optimum order of data transfer commands to be sent to the disk drive. A method for selecting a next command to transmit to a disk drive employs the position variables to optimize the command selection. In an alternative method, a host selects a command to be executed by one of an array of disk drives and then determines the disk drive to receive the command based on position information variables which have been stored and updated by the disk drives in the array.

Abstract: A grid array interconnect structure and method for interconnecting and removing a high density multichip interconnect decal, or grid array package, to and from a printed wiring board. The interconnect structure comprises conductive epoxy interconnects and nonconductive transfer tape that has adhesive disposed on both sides thereof. The transfer tape is applied to the back of the high density multichip interconnect decal or package. Conductive epoxy is disposed in pre-formed holes of the two-sided transfer tape and is partially cured to a semi-rigid condition to form the conductive epoxy interconnects. A mylar film may be applied to the exposed surface of the transfer tape. With the mylar film removed from the surface of the transfer tape, the decal or package is secured to the printed wiring board and a slight force is applied. This assembly is then cured.

Abstract: A read error recovery procedure is disclosed that administers subsequent accesses of a track of a disc drive following an initial access of the track wherein multiple errors were encountered as data stored on the sectors was retrieved by a read/write head. During the initial access, the procedure logs information pertaining to the sectors on the disc where an error occurred. The logged information is then used during the read error recovery procedure to retrieve data from the sectors in a single revolution of the disc. The read error recovery procedure uses a skip mask, a vector buffer management list and a data throttling mechanism to administer a transfer of data from a disc to a host computer via a data buffer.

Abstract: A processing method that encapsulates the top of a chip-on-board module in a manner that permits rework of the module or removal of integrated circuits used therein. The method comprises the steps of providing a chip-on-board module having a substrate and an integrated circuit disposed thereon, applying a first encapsulant material to a top surface of the a chip-on-board module to cover the integrated circuit except for wire bond spans and wire bonds on the substrate, and applying a second encapsulant material to the wire bond spans and wire bonds on the substrate. The first encapsulant material may be epoxy or polyimide, while the second encapsulant material comprises may be parylene or silicon nitride, for example. The second encapsulant material may be readily removed by cleaning the module with oxygen plasma etching, for example, which does not affect the underlying first encapsulant material, and is removed without damaging the integrated circuit or circuits of the module.

Abstract: A three-dimensional circuit structure that interconnects an integrated circuit chip, along with additional active devices and passive components to a substrate by way of a high density multichip interconnect decal disposed on the integrated circuit chip. The three-dimensional circuit structure thus comprises the substrate, an integrated circuit attached to the top of the substrate, and the high density multichip interconnect decal attached to the integrated circuit. One or more passive components and relatively small active devices are attached to the top of the high density multichip interconnect decal. A plurality of three-bond, daisy-chained wedge bonds are used to interconnect the active devices and passive components to the substrate by way of the HDMI decal. Each wedge bond comprises a wire that initiates at an HDMI decal bond pad, an intermediate stitch bond at an integrated circuit bond pad, and terminates at a substrate bond pad.

Abstract: A start-up controller is programmed to reduce current to a motor during a coast phase of an alignment state of the motor. The alignment state is divided into a plurality of phases based on time elapsed from the start of the alignment phase and the controller reduces the current when the elapsed time is substantially between a start and end time that define the coast phase. Because reduced current is provided to the motor during the coast phase, the total power and thus the thermal load on control components for the motor is decreased while the time the motor requires to "settle" into alignment is only slightly increased.