Abstract: Various embodiments of the present invention provide systems and methods for selecting data encoding. As an example, some embodiments of the present invention provide methods that include receiving a data set to be written to a plurality of multi-bit memory cells that are each operable to hold at least two bits. In addition, the methods include determining a characteristic of the data set, and encoding the data set. The level of encoding is selected based at least in part on the characteristic of the data set. In some instances of the aforementioned embodiments, the characteristic of the data set indicates an expected frequency of access of the data set from the plurality of multi-bit memory cells.

Abstract: Various embodiments of the present invention provide systems, methods and circuits for memories and utilization thereof. As one example, a memory system is disclosed that includes a flash memory device and a flash access circuit. The flash access circuit is operable to perform an error code encoding algorithm on a data set to yield an error code, to write the data set to the flash memory device at a first location, and to write the error code to the flash memory device at a second location.

Abstract: Various embodiments of the present invention provide systems, methods and circuits for memory utilization. As one example, a memory system is disclosed that includes a memory bank and a memory access controller circuit. The memory bank includes a number of default memory cells and a number of redundant memory cells. The memory access controller circuit is operable to access a usable memory space including both the combined default memory cells and the redundant memory cells.

Abstract: circuits for memories and utilization thereof. As one example, memory devices are disclosed that include a plurality of non-volatile memory blocks, and a memory write circuit. The memory write circuit is operable to write subsets of the plurality of non-volatile memory blocks at locations identified by a pointer, and to update the pointer to implement a circular buffer in the plurality of non-volatile memory blocks. In some cases, the non-volatile memory blocks are flash memory blocks.

Abstract: Various embodiments of the present invention provide systems, methods and circuits for use of a memory system. As one example, an electronics system is disclosed that includes a memory bank, a memory access controller circuit, and an encoding circuit. The memory bank includes a plurality of multi-bit memory cells that each is operable to hold at least two bits. The memory access controller circuit is operable to determine a use frequency of a data set maintained in the memory bank. The encoding circuit is operable to encode the data set to yield an encoded output for writing to the memory bank. The encoding level for the data set is selected based at least in part on the use frequency of the data set.

Abstract: Various embodiments of the present invention provide systems, methods and circuits for power management and/or EMI reduction. As one example, a method for memory system access is disclosed that includes providing a first bank of memory; providing a second bank of memory; receiving a memory access request that includes assertion of a reference memory clock; accessing the first bank of memory using a first sub memory clock asserted relative to the reference memory clock; delaying a phase offset; and accessing the second bank of memory using a second sub memory clock asserted the phase offset after assertion of the first sub memory clock.

Abstract: Various embodiments of the present invention provide systems, methods and circuits for memories and utilization thereof. As one example, a memory system is disclosed that includes a flash memory device and a flash access circuit. The flash access circuit is operable to perform an error code encoding algorithm on a data set to yield an error code, to write the data set to the flash memory device at a first location, and to write the error code to the flash memory device at a second location.

Abstract: Adequate heat dissipation is essential for semiconductor devices. When a device exceeds a specified junction temperature, the device can be damaged, not perform correctly, or can have a reduced operating life. Semiconductor packages must dissipate heat from the chip to the external environment (i.e. to the PCB, air, etc) to keep the semiconductor device below a certain temperature threshold. For most devices, the most efficient way to dissipate the heat is through the package external I/O connections and into the PCB that it is mounted to. For Ball Grid Array (BGA) packages, the external I/Os are solder balls. Variable pitch packages pose advantages in heat dissipation without introducing significant costs.

Abstract: Various embodiments of the present invention provide systems and methods for managing solid state drives. As an example, a storage system is described that include at least a first flash memory block and a second flash memory block, and a control circuit. The first flash memory block and the second flash memory block are addressable in the storage system. The control circuit is operable to identify the first flash memory block as partially failed, receive a write request directed to the first flash memory block; and direct the write request to the second flash memory block.

Abstract: Various embodiments of the present invention provide systems and methods for data storage. As an example, storage devices are disclosed that include a plurality of memory blocks, an unreliable block identification circuit, and a partial failure indication circuit. Each of the plurality of memory blocks includes a plurality of memory cells that decrease in reliability over time as they are accessed. The unreliable block identification circuit is operable to determine that one or more of the plurality of memory blocks is unreliable, and the partial failure indication circuit is operable to disallow write access to the plurality of memory blocks upon determination that an insufficient number of the plurality of memory blocks remain reliable.

Abstract: Various embodiments of the present invention provide systems and methods for efficient image data transfer and/or storage. As an example, some embodiments of the present invention provide data storage systems that include an image capture device, a storage medium and a processor. The image capture device generates a first still image and a second still image. The processor is communicably coupled to the storage medium, and generates a first compressed image and a second compressed image. The first compressed image and the second compressed image are generated by: receiving the first still image and the second still image; selecting an image portion of the first still image; identifying a similarity between the image portion of the first still image and an image portion of the second still image; indicating the similarity; and eliminating the image portion of the second still image. The processor stores the first compressed image and a second compressed image to the storage medium.

Abstract: A barrier layer can be attached in a semiconductor package to one or more sensitive devices. The barrier layer can be used to obstruct tampering by a malicious agent attempting to access sensitive information on the sensitive device. The barrier layer can cause the sensitive device to become inoperable if physically tampered. Additional other aspects of the protective packaging provide protection against x-ray and thermal probing as well as chemical and electrical tampering attempts.

Abstract: Various systems and methods for implementing operational environments are disclosed. For example, some embodiments of the present invention provide hands free operational environments that include a routing device, an audio transmission device, an audio output device, and an audio input device. The routing device communicably couples the audio transmission device to one or more of the audio input device and the audio output device. The audio input device is operable to receive an audible command. The audible command is operable to cause an operation on at least one of the routing device, the audio output device, and the audio transmission device.

Abstract: Various systems and methods for distributing rights managed content objects arc disclosed. For example, some embodiments of the present invention provide methods for distribution that include providing a mobile storage device that includes a wireless interface and a storage component maintaining a rights managed content object. A first request to provide the rights managed content object to a first mobile application device via the wireless interface is received, and a second request to provide the rights managed content object to a second mobile application device via the wireless interface is received. The rights managed content object is accessed from the storage component, and a digital rights management tool associated with the accessed content object is accessed. The rights managed content object is decrypted using the digital rights management tool, and streamed to both the first mobile application device and the second mobile application device via the wireless interface.

Abstract: According to one exemplary embodiment, a method for forming a wafer level package includes fabricating an active device on a substrate in a semiconductor wafer, forming polymer walls around the active device, and applying a blanket film over the semiconductor wafer and the polymer walls to house the active device in a substantially enclosed cavity formed by the polymer walls and the blanket film. By way of examples and without limitation, the active device can be a microelectromechanical systems (“MEMS”) device, a bulk acoustic wave (“BAW”) filter, or a surface acoustic wave (“SAW”) filter. According to one embodiment, solder bumps can be applied to interconnect traces of the active device, and the semiconductor wafer can then be diced to form an individual die. According to another embodiment, the semiconductor wafer can be diced to form an individual die, then the individual die is wire bonded to a circuit board.

Abstract: According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.

Abstract: A method and system for interleaving storage of data streams on a rotating storage medium of a data storage device comprise dividing the storage medium into a plurality of logical zones. Each logical zone of the plurality of logical zones extends radially from an inner diameter of the storage medium to an outer diameter of the storage medium. Data from a first stream of data is written to a first logical zone of the plurality of logical zones for up to an amount of time corresponding to the rotational speed of the storage medium and the size of the first logical zone.

Abstract: Single-die or multi-die packaged modules that incorporate three-dimensional integration of active devices with discrete passive devices to create a package structure that allows active devices (such as, silicon or gallium-arsenide devices) to share the same footprint area as an array of passive surface mount components. In one example, a module includes at least one active device stacked on top of an array of passive surface mount components on a substrate. A conductive or non-conductive adhesive can be used to adhere the active device to the array of passive devices.

Abstract: In a semiconductor chip, a thermal adhesive is used to bond an internal heat spreader to an active functional die. In an alternative embodiment a dummy die is place directly on top of the active functional die and a thermal adhesive is used to bond an internal heat spreader to the dummy die. This provides a direct and relatively low thermal conductivity path from the heat source, i.e., the functional device to the top of the package, that is, the internal metal heat spreader which is also exposed to the air.

Abstract: According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.