Abstract: Light-emitting devices, and more particularly, LED chips that have pillars or pillar-like structures for plugged substrates are disclosed. Pillars can be formed of metal that plug into hollow vias of a substrate, enabling the LED chip to have electrical contact with a submount on which the substrate is mounted. The pillars can facilitate easier mounting of the LED chips to the submount in a surface mount device (SMD) context. The pillars can also serve as alignment pins to improve the die attach process. The substrate can include back-side metal contacts to facilitate the electrical contact between the pillars and the submount. In other embodiments, the hollow vias can extend all the way through the substrate allowing the pillars to make direct electrical contact with the submount.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED packages for environmental indication are disclosed. LED packages include one or more LED chips and reactive materials that preferentially react with environmental ingress. After sufficient reactant exposure, the reactive materials may degrade and exhibit reduced electrical conductivity. Reactive material arrangements relative to electrical connections are provided so that the one or more LED chips either turn on, turn off, or lose brightness to provide visual indication of environmental reactants. Reactive materials may form electrical shorting paths that bypass one or more LED chips until sufficient reactant exposure when the shorting paths fail and the one or more LED chips are electrically activated.

Abstract: Light-emitting diode (LED) packages, and more particularly arrangements of multiple LED chips in LED packages are disclosed. Arrangements include different types, different dimensions, and/or different orientations of LED chips within LED packages and corresponding electrical connections. Further arrangements include individual cover structures having different dimensions for various LED chips to accommodate thickness variations of LED chips and/or thickness variations attributed to different elements of individual cover structures. Different cover structure elements may include lumiphoric materials, antireflective layers, filter layers, and polarization layers. By accounting for dimensional variations between LED chips and/or between cover structures within multiple-chip LED packages, aggregate light-emitting surfaces may be provided with improved emission uniformity.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly microparticle arrangements in LED packages are disclosed. Microparticles and corresponding microparticle layers are structured to internally recirculate light received from an LED chip and/or a recipient lumiphoric material layer to promote increased color mixing and color over angle uniformity. Microparticles are structured with particle sizes that exceed wavelengths of light provided by LED chips and/or lumiphoric materials to elicit internal recirculating of light. Arrangements and/or particle sizes of microparticles are disclosed that tailor light recycling and color mixing to various applications with targeted emission patterns. Related methods include forming microparticles and corresponding microparticle layers before encapsulants of LED packages.

Abstract: Light-emitting diode (LED) devices and more particularly LED chips with optically pumped quantum well structures are disclosed. LED chips include electrically pumped quantum well structures positioned proximate p-n junctions, and optically pumped quantum well structures positioned to receive photons of light generated by the electrically pumped quantum well structures and re-emit light having longer peak wavelengths. Aggregate emissions may include broader emission spectrums. Moreover, aggregate emissions may predominately be provided by light from the electrically pumped quantum well structures while light from the optically pumped quantum well structures may provide wavelengths that appear brighter to the human eye to increase luminous flux.

Abstract: Light-emitting diode (LED) devices and more particularly lens structures in multiple-chip LED packages are disclosed. Lens structures include separate lenses positioned to reduce optical decoupling from corresponding LED chips. Individual lenses for each individual LED chip provide flexibility in tailoring each lens to provide a portion of aggregate emissions with a targeted profile. Multiple lenses may be integrally formed from a common encapsulant material. Other lens structures include separate lenses provided on or through encapsulant materials. Combinations of different LED chip structures and different lens structures within a common LED package are disclosed.

Abstract: The present disclosure describes a network switch design that includes a vertical switch circuit board that is mounted parallel to the front panel of the network switch. The vertical circuit board supports switch chip(s) to process and forward packets and pluggable module connectors to receive pluggable optics modules that provide connections to other network switches. The pluggable module connectors are horizontally oriented to facilitate routing of electrical signal traces. The arrangement of the circuit board, switch chip(s) and pluggable module connectors achieves reduced lengths for the electrical signal traces that connect the switch chip(s) to the pluggable module connectors. The design improves cooling by providing separate airflow regions between the switch chip heatsink(s) and the optics modules.

Abstract: Light-emitting diode (LED) devices and more particularly lens structures for LED chips in LED packages are disclosed. Lens structures include complex shapes for achieving various emission patterns in LED packages. Complex lens shapes include arrangements of multiple lenses within a same LED package. A first lens is arranged on an LED chip with a self-forming shape, followed by a second lens that encapsulates the first lens. The self-forming shape of the first lens provides the ability to have lens widths that taper inward and depressions positioned relative to the underlying LED chip. Combinations of shapes for the first and second lenses may be configured to collectively provide tailored light emission profiles in corresponding LED packages.

Abstract: Light-emitting diode (LED) devices and more particularly lens structures in LED packages are disclosed. Lens structures include complex shapes for achieving various emission patterns in LED packages. Complex lens shapes include lens widths that are greater than corresponding widths of support elements, including lead frame structures or submount structures. Complex lens shapes further include inward depressions positioned relative to underlying LED chips for directing peak emission intensities off center relative to LED packages. Exemplary LED packages further include encapsulant layers positioned between lenses and underlying LED chips for providing one or more of improved surfaces for lens formation and improved adhesion.

Abstract: A light emitting device comprises a light emitting diode (LED) chip having a dominant wavelength in a range from about 390 nm to about 560 nm, an encapsulant in optical communication with the LED chip, and coated phosphor particles dispersed in the encapsulant. Each of the coated phosphor particles comprises (a) a luminescent particle having a first refractive index at the dominant wavelength, and (b) an optical coating on the luminescent particle, where the optical coating has a second refractive index at the dominant wavelength. The second refractive index is between the first refractive index and a refractive index of the encapsulant at the dominant wavelength.

Abstract: Methods and related systems for transfer of semiconductor die and more particularly for mass transfer of semiconductor die, such as light-emitting diodes, using transfer elements are disclosed. Certain aspects relate to methods of continuous mass transfer using roller feed loops. Two carrier bars move in opposite directions, one with die and one with a substrate. The die stick to a roller and transfer from a die carrier to the substrate on a substrate carrier. In certain aspects, transfer elements may include rollers, flexible rollers, or expandable rollers. Transfer elements may further include alignment features, such as alignment pockets, that provide enhanced die alignment. In certain aspects, transfer elements may include one or more planar surfaces that rotate positions relative to the die carrier and the substrate carrier.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly sealing structures for LED packages are disclosed. Sealing structures include multiple seals within an LED package that provide a multiple barrier structure for enhanced protection from elemental ingress from a surrounding environment. Certain seals may be provided as bonding materials between cover structures and submounts of LED packages, thereby enclosing LED chips. Additional seals may be provided as coatings on surfaces of LED chips and/or submounts that are between cover structures and LED chips. Sealing structures may include multiple levels of hermetic seals with LED packages.

Abstract: Light-emitting diode (LED) packages and more particularly emission height arrangements in LED packages and related devices and methods are disclosed. LED packages, LED chips, and related device arrangements are disclosed that include various combinations of LED chip types, lumiphoric materials, and/or cover structures that are arranged together while also providing a substantially uniform emission height for corresponding light-emitting surfaces. LED chips may be configured with different heights or thicknesses that compensate for variations in lumiphoric materials and/or cover structures utilized to provide different emission colors. Corresponding LED packages and/or LED chips with different emission colors may be assembled near one another with improved emission height uniformity.

Abstract: Solid-state lighting devices, and more particularly to a three-dimensional (3D) light-emitting diode (LED) device and a method of manufacture are disclosed. A submount of the LED can have several submount portions that are angled with respect to each other, and LED chips can be mounted on each submount portion, such that the LED chips of the device are angled at different angles with respect to each other. In an embodiment, the LED device can include a heatsink that is in contact with each of the submount portions to channel heat away from the LED chips. The LED chips can be mounted on the submount portions when all submount portions are laying flat, and then the submount portions can be pushed or punched into their respective angles.

Abstract: Light-emitting diode (LED) packages and more particularly emission height arrangements in LED packages and related devices and methods are disclosed. LED packages, LED chips, and related device arrangements are disclosed that include various combinations of LED chip types, lumiphoric materials, and/or cover structures that are arranged together while also providing a substantially uniform emission height for corresponding light-emitting surfaces. LED chips may be configured with different heights or thicknesses that compensate for variations in lumiphoric materials and/or cover structures utilized to provide different emission colors. Corresponding LED packages and/or LED chips with different emission colors may be assembled near one another with improved emission height uniformity.

Abstract: Light-emitting diodes (LEDs), and more particularly, lenses formed by additive manufacturing for LED packages are disclosed. Additive manufacturing is used to progressively cure precursor materials for lenses in directions away from corresponding submounts. Progressively curing precursor materials may be performed in a layer-by-layer manner or in a continuous manner. Such additive manufacturing allows complex lens shapes that form primary optics and encapsulation for LED chips of LED packages. Complex shapes include pockets of air or other materials embedded within lens materials, pockets formed about LED chips, progressively increasing lens widths, Fresnel shapes, and/or asymmetric shapes, among others.

Abstract: A spring fastener is provided. The spring fastener includes a spring and a flexible member having a shoulder, a first leg and a second leg. The first leg and the second leg are inserted through the spring along a longitudinal axis of the spring. The spring is retained to the flexible member by the shoulder and at least a portion of the first leg or the second leg. The first leg and the second leg have a retention feature to retain the spring fastener when the first leg and the second leg are inserted through an aperture in a component or a surface. A method of utilizing a spring fastener is also provided.