Patents by Inventor Robert Wilcox

Robert Wilcox has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230263540
    Abstract: An orthopedic cutting instrument can be used to cut and release soft tissue to mobilize a bone for subsequent realignment of the bone. In some examples, the cutting instrument is configured with a handle and a cutting head. The cutting head has multiple cutting surfaces, such as a lead cutting surface and side cutting surfaces extending angularly away from the lead cutting surface. A mirror set of cutting surfaces may be provided on the opposite side of the cutting head. The cutting surfaces may be arranged to allow controlling cutting of soft tissue while limiting inadvertent deep penetration of the cutting instrument. In addition, the cutting surfaces may be arranged to allow back-and-forth cutting movement of the cutting head, which can be useful when working in a tight joint space.
    Type: Application
    Filed: February 23, 2023
    Publication date: August 24, 2023
    Inventors: Paul Dayton, William T. DeCarbo, Jody McAleer, Robert D. Santrock, Mark Erik Easley, Adriaan Kuyler, Bryan Wilcox
  • Publication number: 20230263543
    Abstract: Instruments and techniques can be used to release a first metatarsal for realignment. In some implementations, a techniques involves surgically accessing a sesamoidal ligament in a foot of a patient and advancing a guiding projection of a cutting instrument under the sesamoidal ligament. This can capture the sesamoidal ligament between the guiding projection of the cutting instrument and a cutting surface of the cutting instrument that is recessed relative to a distal end of the guiding projection. The techniques further involves cutting the sesamoidal ligament with the cutting surface of the cutting instrument.
    Type: Application
    Filed: February 23, 2023
    Publication date: August 24, 2023
    Inventors: Paul Dayton, William T. DeCarbo, Daniel J. Hatch, Jody McAleer, Robert D. Santrock, W. Bret Smith, Mark Erik Easley, Bryan Wilcox
  • Publication number: 20230260972
    Abstract: Light-emitting diode (LED) packages, and more particularly arrangements of multiple LED chips in LED packages are disclosed. Arrangements include different types, different dimensions, and/or different orientations of LED chips within LED packages and corresponding electrical connections. Further arrangements include individual cover structures having different dimensions for various LED chips to accommodate thickness variations of LED chips and/or thickness variations attributed to different elements of individual cover structures. Different cover structure elements may include lumiphoric materials, antireflective layers, filter layers, and polarization layers. By accounting for dimensional variations between LED chips and/or between cover structures within multiple-chip LED packages, aggregate light-emitting surfaces may be provided with improved emission uniformity.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 17, 2023
    Inventors: Thomas Celano, Alexis Rile, Derek Miller, David Suich, Colin Blakely, Sarah Trinkle, Robert Wilcox
  • Publication number: 20230258878
    Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 17, 2023
    Inventors: Thierry Luc Alain Dannoux, Robert Bruce Elkins, II, Joel Christopher Rosson, Dayne Wilcox, Michael Wimmer, Shane C. Woody, Zhiye Zhang
  • Publication number: 20230261154
    Abstract: Light-emitting diode (LED) packages and more particularly LED packages with selectively placed light-altering materials and related methods are disclosed. Selectively placed light-altering materials are provided that are arranged along peripheral edges of LED chips and along portions of underlying submounts. By covering peripheral edges of LED chips without covering entire submount surfaces, light-altering materials may be provided in reduced amounts while still redirecting laterally propagating light from the LED chips. Methods of selectively placing light-altering materials include selectively dispensing one or more droplets on submount portions that are proximate LED chip edges and allowing the one or more droplets to wick about the LED chip edges and portions of the submount before curing in place.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 17, 2023
    Inventors: Sarah Trinkle, Alexis Rile, Robert Wilcox, Colin Blakely
  • Publication number: 20230223111
    Abstract: Described herein are methods such as multi-omic methods for assessing a disease such as cancer. The multi-omic methods may integrate proteomic, transcriptomic, genomic, lipidomic, or metabolomic data. The method screening diseases or disease states. Also described herein are methods for screening for diseases or disease states from biological samples. The methods may include assessing whether a nodule, mass, or cyst is cancerous.
    Type: Application
    Filed: February 3, 2023
    Publication date: July 13, 2023
    Inventors: Philip Ma, Bruce Wilcox, Francois Collin, Chinmay Belthangady, Mi Yang, Manoj Khadka, Manway Liu, John Blume, Robert S. Langer, JR., Ehdieh Khaledian
  • Publication number: 20230187028
    Abstract: Described herein are methods such as multi-omic methods for assessing a disease such as cancer. The multi-omic methods may integrate proteomic, transcriptomic, genomic, lipidomic, or metabolomic data. The method screening diseases or disease states. Also described herein are methods for screening for diseases or disease states from biological samples. The methods may include assessing whether a nodule, mass, or cyst is cancerous.
    Type: Application
    Filed: January 5, 2023
    Publication date: June 15, 2023
    Inventors: Philip Ma, Bruce Wilcox, Francois Collin, Chinmay Belthangady, Mi Yang, Manoj Khadka, Manway Liu, John Blume, Robert S. Langer, JR., Ehdieh Khaledian
  • Patent number: 11656414
    Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: May 23, 2023
    Assignee: Corning Research & Development Corporation
    Inventors: Thierry Luc Alain Dannoux, Robert Bruce Elkins, II, Joel Christopher Rosson, Dayne Wilcox, Michael Wimmer, Shane C. Woody, Zhiye Zhang
  • Patent number: 11601734
    Abstract: In some implementations, a network device includes a housing and a set of switch cards within the housing and including a first set of connectors. A set of line cards within the housing includes a second set of connectors. The set of line cards are oriented orthogonally to the set of switch cards. A first set of power supplies and a second set of power supplies are in the housing. A midplane includes a plurality of circuit board assemblies arranged within the housing between the set of line cards and the first and second sets of power supplies to allow air to flow through the set of line cards to the set of switch cards, first set of power supplies, and second set of power supplies.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: March 7, 2023
    Assignee: Arista Networks, Inc.
    Inventors: Alex Rose, Daniel Kim, Robert Wilcox, Richard Hibbs
  • Patent number: 11552229
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LEDs and packaged LED devices with spacer layer arrangements are disclosed. An LED package may include one or more LED chips on a submount with a light-altering material arranged to redirect light in a desired emission direction with increased efficiency. A spacer layer is arranged in the LED package to cover rough surfaces and any gaps that may be formed between adjacent LED chips. When the light-altering material is applied to the LED package, the spacer layer provides a surface that reduces unintended propagation of the light-altering material toward areas of the LED package that would interfere with desired light emissions, for example over LED chips and between LED chips. In various arrangements, the spacer layer may cover one or more surfaces of a lumiphoric material, one or more LED chip surfaces, and portions of an underlying submount.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: January 10, 2023
    Assignee: CreeLED, Inc.
    Inventors: Kyle Damborsky, Ayush Tripathi, Robert Wilcox, Sarah Trinkle, Colin Blakely
  • Patent number: 11510294
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: November 22, 2022
    Assignee: CreeLED, Inc.
    Inventors: Aaron Francis, Kyle Damborsky, Robert Wilcox, Jasper Cabalu, Colin Blakely
  • Publication number: 20220262989
    Abstract: A light emitting device includes a LED having a light emitting first surface and a light emitting second surface that define a corner. A support layer is disposed to receive light emitted by the light emitting second surface and is disposed adjacent the corner. A luminophoric medium layer at least partially covers the light emitting first surface and the light emitting second surface where the luminophoric medium layer is at least partially supported by the support layer to prevent a narrowing of the luminophoric medium layer.
    Type: Application
    Filed: February 18, 2021
    Publication date: August 18, 2022
    Inventors: Robert Wilcox, Sarah Trinkle, Derek Miller, Peter Andrews, Colin Blakely
  • Publication number: 20220190208
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly support structures for LED packages are disclosed. Support structure arrangements are provided for LED packages with increased reflectivity. Support structures may include patterned electrically conductive materials that provide electrical connections and bonding surfaces for LED chips within the package, and bonding surfaces for cover structures in certain arrangements. Depending on the wavelengths of light emitted by the LED package, light reflectivity tradeoffs can exist for conductive materials that provide suitable electrical connections and bonding surfaces. Additional patterned layers with increased reflectivity may be provided on underlying patterned electrically conductive materials.
    Type: Application
    Filed: December 16, 2020
    Publication date: June 16, 2022
    Inventors: Derek Miller, Robert Wilcox, Colin Blakely
  • Patent number: 11285591
    Abstract: In one embodiment a device for tightening and loosening a securing device is provided. The device includes a housing, a shaft, and a clutch assembly. In one embodiment, the clutch assembly includes a clutch activation member, a first friction member coupled to the clutch activation member, and a second friction member coupled to the shaft. When the clutch activation member is in a first position, the clutch activation member engages the first friction member with the second friction member for transmission of torque from the first friction member to the second friction member. When the clutch activation member is in the second position, the clutch activation member disengages the first friction member from the second friction member to prevent transmission of the torque from the first friction member to the second friction member.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: March 29, 2022
    Assignee: Arista Networks, Inc.
    Inventors: Youngbae Park, Robert Wilcox, Richard Hibbs, Daehwan Daniel Kim, Adam Hemp, Bruce Wang
  • Publication number: 20220085258
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LEDs and packaged LED devices with spacer layer arrangements are disclosed. An LED package may include one or more LED chips on a submount with a light-altering material arranged to redirect light in a desired emission direction with increased efficiency. A spacer layer is arranged in the LED package to cover rough surfaces and any gaps that may be formed between adjacent LED chips. When the light-altering material is applied to the LED package, the spacer layer provides a surface that reduces unintended propagation of the light-altering material toward areas of the LED package that would interfere with desired light emissions, for example over LED chips and between LED chips. In various arrangements, the spacer layer may cover one or more surfaces of a lumiphoric material, one or more LED chip surfaces, and portions of an underlying submount.
    Type: Application
    Filed: September 14, 2020
    Publication date: March 17, 2022
    Inventors: Kyle Damborsky, Ayush Tripathi, Robert Wilcox, Sarah Trinkle, Colin Blakely
  • Publication number: 20220005987
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and lens arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips on a submount with a lens positioned on the submount to form a cavity. The one or more LED chips may reside in the cavity without direct encapsulation materials that would otherwise contact the one or more LED chips and any corresponding wirebonds. In this manner, the one or more LED chips may be driven with higher drive currents while reducing degradation and mechanical strain effects related to differences in coefficients of thermal expansion with typical encapsulant materials. LED packages may also be configured with one or more apertures that allow air flow between an interior volume of a cavity and an ambient environment outside the LED package to promote heat dissipation at higher drive currents.
    Type: Application
    Filed: July 1, 2020
    Publication date: January 6, 2022
    Inventors: Robert Wilcox, Derek Miller, Kyle Damborsky, Aaron Francis, Colin Blakely
  • Publication number: 20220001519
    Abstract: In one embodiment a device for tightening and loosening a securing device is provided. The device includes a housing, a shaft, and a clutch assembly. In one embodiment, the clutch assembly includes a clutch activation member, a first friction member coupled to the clutch activation member, and a second friction member coupled to the shaft. When the clutch activation member is in a first position, the clutch activation member engages the first friction member with the second friction member for transmission of torque from the first friction member to the second friction member. When the clutch activation member is in the second position, the clutch activation member disengages the first friction member from the second friction member to prevent transmission of the torque from the first friction member to the second friction member.
    Type: Application
    Filed: July 2, 2020
    Publication date: January 6, 2022
    Inventors: Youngbae Park, Robert Wilcox, Richard Hibbs, Daehwan Daniel Kim, Adam Hemp, Bruce Wang
  • Publication number: 20210329758
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.
    Type: Application
    Filed: July 1, 2021
    Publication date: October 21, 2021
    Inventors: Aaron Francis, Kyle Damborsky, Robert Wilcox, Jasper Cabalu, Colin Blakely
  • Patent number: 11083059
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: August 3, 2021
    Assignee: CreeLED, Inc.
    Inventors: Aaron Francis, Kyle Damborsky, Robert Wilcox, Jasper Cabalu, Colin Blakely
  • Patent number: D926714
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: August 3, 2021
    Assignee: CreeLED, Inc.
    Inventors: Robert Wilcox, Colin Blakely