Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.

Abstract: An orthopedic implant system can be used to fixate two vertebral bones relative to each other during a surgical procedure. In some configurations, the implant system includes a staple having at least two legs separated by a bridge. The staple can include at least two couplings on either side of the bridge accessible through a top surface of the staple connectable to two corresponding coupling shafts. The coupling shafts can attach through the top surface of the staple without extending below an underside of the staple. The coupling shafts can be used to bias the at least two legs of the staple away from each other for insertion into holes formed into two bones. By attaching the coupling shafts through the top of the staple, the staple can be inserted flush with the two bones before releasing the shafts.

Abstract: An orthopedic implant system can be used to fixate two bones (e.g., to portions of a single bone) relative to each other during a surgical procedure. In some configurations, the implant system includes a staple having at least two legs separated by a bridge. The staple can include at least two couplings on either side of the bridge accessible through a top surface of the staple connectable to two corresponding coupling shafts. The coupling shafts can attach through the top surface of the staple without extending below an underside of the staple. The coupling shafts can be used to bias the at least two legs of the staple away from each other for insertion into holes formed into two bones. By attaching the coupling shafts through the top of the staple, the staple can be inserted flush with the two bones before releasing the shafts.

Abstract: An orthopedic implant system can be used to fixate two bones (e.g., to portions of a single bone) relative to each other during a surgical procedure. In some configurations, the implant system includes a staple having at least two legs separated by a bridge. The staple can include at least two couplings on either side of the bridge accessible through a top surface of the staple connectable to two corresponding coupling shafts. The coupling shafts can attach through the top surface of the staple without extending below an underside of the staple. The coupling shafts can be used to bias the at least two legs of the staple away from each other for insertion into holes formed into two bones. By attaching the coupling shafts through the top of the staple, the staple can be inserted flush with the two bones before releasing the shafts.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly sealing structures for LED packages are disclosed. Sealing structures include multiple seals within an LED package that provide a multiple barrier structure for enhanced protection from elemental ingress from a surrounding environment. Certain seals may be provided as bonding materials between cover structures and submounts of LED packages, thereby enclosing LED chips. Additional seals may be provided as coatings on surfaces of LED chips and/or submounts that are between cover structures and LED chips. Sealing structures may include multiple levels of hermetic seals with LED packages.

Abstract: A light emitting device includes a LED having a light emitting first surface and a light emitting second surface that define a corner. A support layer is disposed to receive light emitted by the light emitting second surface and is disposed adjacent the corner. A luminophoric medium layer at least partially covers the light emitting first surface and the light emitting second surface where the luminophoric medium layer is at least partially supported by the support layer to prevent a narrowing of the luminophoric medium layer.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and lens arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips on a submount with a lens positioned on the submount to form a cavity. The one or more LED chips may reside in the cavity without direct encapsulation materials that would otherwise contact the one or more LED chips and any corresponding wirebonds. In this manner, the one or more LED chips may be driven with higher drive currents while reducing degradation and mechanical strain effects related to differences in coefficients of thermal expansion with typical encapsulant materials. LED packages may also be configured with one or more apertures that allow air flow between an interior volume of a cavity and an ambient environment outside the LED package to promote heat dissipation at higher drive currents.

Abstract: A data analytics for recovery, using granular and large-scale failure data from the distribution grid. A key characteristic of the data analytics is its generalizability. The data analysis applies to a large number (169) of failure events rather than one disruption. Further, a data driven recovery scaling law characterizes how recovery speed scales with respect to the severity of weather-induced failures from moderate to extreme. The data analysis also demonstrates the promise of mitigating fundamental limitations of typical recovery through smart grid infrastructure. The data analytics generalizes from one service region in New York to another in Massachusetts. As data used are commonly available to most distribution system operators, the analytics is potentially applicable across the US and parts of the world.

Abstract: Light-emitting diode (LED) packages and more particularly thermal pad structures for LED packages with reduced sizes are disclosed. LED packages include an LED chip on a submount with an anode mounting pad, a cathode mounting pad, and a thermal pad on an opposite side of the submount to the LED chip. Structures of thermal pads and corresponding anode and cathode mounting pads include arrangements that provide shortest distances values between the thermal pads and the anode and cathode mounting pads that provide increased surface area for heat dissipation while also reducing electrical shorting, particularly for submounts with compact sizes.

Abstract: Methods and related systems for transfer of semiconductor die and more particularly for mass transfer of semiconductor die, such as light-emitting diodes, using transfer elements are disclosed. Certain aspects relate to methods of continuous mass transfer using roller feed loops. Two carrier bars move in opposite directions, one with die and one with a substrate. The die stick to a roller and transfer from a die carrier to the substrate on a substrate carrier. In certain aspects, transfer elements may include rollers, flexible rollers, or expandable rollers. Transfer elements may further include alignment features, such as alignment pockets, that provide enhanced die alignment. In certain aspects, transfer elements may include one or more planar surfaces that rotate positions relative to the die carrier and the substrate carrier.

Abstract: A light emitting device comprises a light emitting diode (LED) chip having a dominant wavelength in a range from about 390 nm to about 560 nm, an encapsulant in optical communication with the LED chip, and coated phosphor particles dispersed in the encapsulant. Each of the coated phosphor particles comprises (a) a luminescent particle having a first refractive index at the dominant wavelength, and (b) an optical coating on the luminescent particle, where the optical coating has a second refractive index at the dominant wavelength. The second refractive index is between the first refractive index and a refractive index of the encapsulant at the dominant wavelength.

Abstract: A collet assembly including an actuator and a collet connected to the actuator. The collet assembly is adapted to be installed on a welding electrode holder having an electrode. The collet is moveable by the actuator from an advanced position, in which the collet is adapted to grip a fastener such as a welding rivet, and a retracted position, in which at least a portion of the collet is retracted into the actuator to enable the electrode to engage the fastener for welding to a work piece, and the collet is adapted to release the fastener.

Abstract: Light-emitting diode (LED) packages and more particularly emission height arrangements in LED packages and related devices and methods are disclosed. LED packages, LED chips, and related device arrangements are disclosed that include various combinations of LED chip types, lumiphoric materials, and/or cover structures that are arranged together while also providing a substantially uniform emission height for corresponding light-emitting surfaces. LED chips may be configured with different heights or thicknesses that compensate for variations in lumiphoric materials and/or cover structures utilized to provide different emission colors. Corresponding LED packages and/or LED chips with different emission colors may be assembled near one another with improved emission height uniformity.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly support structures for LED packages are disclosed. Support structure arrangements are provided for LED packages with increased reflectivity. Support structures may include patterned electrically conductive materials that provide electrical connections and bonding surfaces for LED chips within the package, and bonding surfaces for cover structures in certain arrangements. Depending on the wavelengths of light emitted by the LED package, light reflectivity tradeoffs can exist for conductive materials that provide suitable electrical connections and bonding surfaces. Additional patterned layers with increased reflectivity may be provided on underlying patterned electrically conductive materials.

Abstract: The present disclosure describes a network switch design that includes a vertical switch circuit board that is mounted parallel to the front panel of the network switch. The vertical circuit board supports switch chip(s) to process and forward packets and pluggable module connectors to receive pluggable optics modules that provide connections to other network switches. The pluggable module connectors are horizontally oriented to facilitate routing of electrical signal traces. The arrangement of the circuit board, switch chip(s) and pluggable module connectors achieves reduced lengths for the electrical signal traces that connect the switch chip(s) to the pluggable module connectors. The design improves cooling by providing separate airflow regions between the switch chip heatsink(s) and the optics modules.

Abstract: Light-emitting diode (LED) packages and more particularly LED packages with selectively placed light-altering materials and related methods are disclosed. Selectively placed light-altering materials are provided that are arranged along peripheral edges of LED chips and along portions of underlying submounts. By covering peripheral edges of LED chips without covering entire submount surfaces, light-altering materials may be provided in reduced amounts while still redirecting laterally propagating light from the LED chips. Methods of selectively placing light-altering materials include selectively dispensing one or more droplets on submount portions that are proximate LED chip edges and allowing the one or more droplets to wick about the LED chip edges and portions of the submount before curing in place.

Abstract: Light-emitting diode (LED) packages, and more particularly arrangements of multiple LED chips in LED packages are disclosed. Arrangements include different types, different dimensions, and/or different orientations of LED chips within LED packages and corresponding electrical connections. Further arrangements include individual cover structures having different dimensions for various LED chips to accommodate thickness variations of LED chips and/or thickness variations attributed to different elements of individual cover structures. Different cover structure elements may include lumiphoric materials, antireflective layers, filter layers, and polarization layers. By accounting for dimensional variations between LED chips and/or between cover structures within multiple-chip LED packages, aggregate light-emitting surfaces may be provided with improved emission uniformity.