Abstract: A system may include a fan module and a louver. The fan module includes a first housing, adapted to include a fan in a first orientation. The fan is adapted to cause air to flow into the rear side of the first housing and out of the front side of the first housing. The fan module also includes a key receptacle that is adapted to mate with a first key. The louver includes a second housing that includes a set of slats adapted as a one way valve. The second housing also includes the first key which is adapted to only mate with the key receptacle. The second housing also includes the second key which is adapted to not mate with the key receptacle.

Abstract: An enclosure with electromagnetic interference (EMI) shielding door is provided. The enclosure includes an EMI shielding enclosure having an aperture dimensioned to receive an insertable and removable module. The enclosure includes an EMI shielding door attached by a hinge to the EMI shielding enclosure, to close and seal to the aperture with an EMI gasket when the module is removed, and open to receive the module through the aperture when the module is inserted.

Abstract: In some implementations, a network device is provided. The network device includes a housing and a set of switch cards, mounted within the housing. The set of switch cards includes a first set of connectors. The network device also includes a set of line cards having a second set of connectors. The set of line cards are oriented parallel to each other and oriented orthogonally to the set of switch cards. The second set of connectors is coupled to the first set of connectors to couple the set of switch cards to the set of line cards. The network device further includes a first set of power supplies disposed along a left side of the housing and a second set of power supplies disposed along a right side of the housing.

Abstract: An adjustable spacer is provided. The adjustable spacer includes a first body having a first retention member for securing or retaining the first body to a support member and a second body having a tapered cross-section. The second body is positionable along a surface of the first body to adjust a thickness across a combination of the first body and the second body, and the first body has a second retention member for retaining the second body to the first body.

Abstract: An adjustable spacer is provided. The adjustable spacer includes a first body having a first retention member for securing or retaining the first body to a support member and a second body having a tapered cross-section. The second body is positionable along a surface of the first body to adjust a thickness across a combination of the first body and the second body, and the first body has a second retention member for retaining the second body to the first body.

Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board (PCB). The apparatus also includes a first dual stacked octal small format pluggable (OSFP) module coupled to the PCB on a top surface of the PCB. The first dual stacked OSFP module comprises two OSFP modules that are vertically stacked. The apparatus further includes a second dual stacked OSFP module coupled to the PCB on a bottom surface of the PCB. The second dual stacked OSFP module comprises two OSFP modules that are vertically stacked. A first bottom of the first dual stacked OSFP module is flush against the top surface of the PCB. A second bottom of the second dual stacked OSFP is flush against the bottom surface of the PCB.

Abstract: The system includes power-over-ethernet (PoE) sockets that interface to dedicated power and signal printed circuit boards. More particularly, the system separates power transmission circuitry from signal transmission circuitry for PoE arrays of RJ-45 sockets. The sockets include pins of different length to accommodate a stacked configuration of the power board and signal board. The pins corresponding to higher-voltage powers are a different length than lower-voltage signal pins. More than one PoE connector array may be coupled to a stack printed circuit boards, with pins of varying length, configured to engage with respective boards of the stack. The boards of the stack may be electrically isolated from each other, although the boards may be structurally engaged with each other.

Abstract: In one embodiment, an apparatus is provided. The apparatus includes a latching component configured to secure a network component within a chassis of a network device when the apparatus is in a first configuration. The latching component is also configured to allow removal of the network component from the chassis of the network device when the apparatus is in a second configuration. The apparatus also includes a handle component coupled to the latching component. The handle component is accessible from a first face of the network component. The handle component is oriented away from the first face. The handle component is configured to facilitate the removal of the network component from the chassis when the apparatus is in the first configuration. The handle component is also configured to facilitate the insertion of the network component into the chassis when the apparatus is in the second configuration.

Abstract: A network device is provided. The device includes a housing and a switch card, mounted within the housing and having one or more connectors. A plurality of line cards are oriented parallel to each other and orthogonal to the switch card and assembled to the one or more connectors of the switch card. The switch card has a chip, with a plurality of switches or routing paths, and the switch card and the chip couple to the plurality of line cards through the one or more connectors.

Abstract: A collet assembly including an actuator and a collet connected to the actuator. The collet assembly is adapted to be installed on a welding electrode holder having an electrode. The collet is moveable by the actuator from an advanced position, in which the collet is adapted to grip a fastener such as a welding rivet, and a retracted position, in which at least a portion of the collet is retracted into the actuator to enable the electrode to engage the fastener for welding to a work piece, and the collet is adapted to release the fastener.

Abstract: A backing plate is provided. The backing plate is configurable to attach with at least one fastener to a heatsink with the heatsink on a first face of a printed circuit board and in thermal contact with a surface of a component mounted to the first face of the printed circuit board and the backing plate on a second, opposed face of the printed circuit board and in thermal contact with the second face of the printed circuit board. The backing plate has a plurality of fins and configurable to act as a further heatsink for the component and remove heat from the component through a solid portion of the printed circuit board.

Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board (PCB). The apparatus also includes a first dual stacked octal small format pluggable (OSFP) module coupled to the PCB on a top surface of the PCB. The first dual stacked OSFP module comprises two OSFP modules that are vertically stacked. The apparatus further includes a second dual stacked OSFP module coupled to the PCB on a bottom surface of the PCB. The second dual stacked OSFP module comprises two OSFP modules that are vertically stacked. A first bottom of the first dual stacked OSFP module is flush against the top surface of the PCB. A second bottom of the second dual stacked OSFP is flush against the bottom surface of the PCB.

Abstract: An apparatus and method for method for joining materials includes a rivet that may extend through a first sheet to be resistance welded to a second sheet. The head of the rivet has a cavity and vents allowing adhesive extruded from a pilot hole to be received in the cavity and vented in a direction parallel to the first sheet. The rivet is deformed to an hourglass shape that fills the pilot hole and displaces the first sheet into the cavity. Rivet dimension allow for holding with a robotic gripper that can be withdrawn before welding. Methods of monitoring joint quality include comparing welding parameter profiles and images of good and discrepant joints.

Abstract: In one embodiment, an apparatus is provided. The apparatus includes a latching component configured to secure a network component within a chassis of a network device when the apparatus is in a first configuration. The latching component is also configured to allow removal of the network component from the chassis of the network device when the apparatus is in a second configuration. The apparatus also includes a handle component coupled to the latching component. The handle component is accessible from a first face of the network component. The handle component is oriented away from the first face. The handle component is configured to facilitate the removal of the network component from the chassis when the apparatus is in the first configuration. The handle component is also configured to facilitate the insertion of the network component into the chassis when the apparatus is in the second configuration.

Abstract: A power supply includes a power supply unit. The power supply unit includes a first housing configured to interface with one or more of housings of one or more fan modules. The power supply unit also includes a power generation unit disposed within the housing. The power generation unit may be configured to generate power for an electrical device. The power supply further includes a first connector configured to provide power to the one or more fan modules. The power may be used to operate one or more fan units of the one or more fan modules. The power supply also includes a fan module. The fan module includes a second housing configured to interface with the first housing. The fan module also includes a fan unit disposed within the second housing. The fan unit may be configured to generate an airflow through the first housing. The fan module further includes a first attachment member configured to interface with the first connector.

Abstract: A spring fastener is provided. The spring fastener includes a spring and a flexible member having a shoulder, a first leg and a second leg. The first leg and the second leg are inserted through the spring along a longitudinal axis of the spring. The spring is retained to the flexible member by the shoulder and at least a portion of the first leg or the second leg. The first leg and the second leg have a retention feature to retain the spring fastener when the first leg and the second leg are inserted through an aperture in a component or a surface. A method of utilizing a spring fastener is also provided.

Abstract: A fastener feed apparatus includes a mounting portion and a feed portion attached movably thereto. The feed portion includes a feed body having first and second ends and an internal track extending therethrough. The internal track is sized and shaped to convey a fastener through the feed body. The feed portion also includes a feeding block attached to the second end of the feed body and including a body and a pair of feed fingers, each of which includes a first end attached to the body and a second end. A track is formed between the feed fingers, is sized and shaped to convey the fastener from its first end to its second end, and is contiguous with the internal track of the feed body. The second end of the track includes a retention point. The feed fingers are sized and shaped to retain the fastener at the retention point.

Abstract: An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.

Abstract: An electromagnetic interference absorber for an integrated circuit is provided. The absorber includes a geometric ring of electromagnetic energy absorbing material, dimensioned to fit over a ball grid array (BGA) integrated circuit package assembled to a substrate. The geometric ring has at least one projection arranged to fit into a gap between the substrate and a body of the BGA integrated circuit package so as to retain the geometric ring to the BGA integrated circuit package. Methods to contain electromagnetic interference and to manufacture an electromagnetic interference absorber are also provided.

Abstract: A busbar and connector assembly is provided. The busbar and connector assembly includes a printed circuit board having an attached connector arranged to couple to a first busbar and a second busbar coupled to the connector. The busbar and connector assembly includes the connector arranged to distribute a first portion of current from the first busbar to the printed circuit board and distribute a second portion of the current from the first busbar to the second busbar.