Light-emitting diode package

- CreeLED, Inc.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a top perspective view of the light-emitting diode package;

FIG. 2 is a bottom perspective view of the light-emitting diode package of FIG. 1;

FIG. 3 is a top view of the light-emitting diode package of FIG. 1;

FIG. 4 is a bottom view of the light-emitting diode package of FIG. 1;

FIG. 5 is an end view of the light-emitting diode package of FIG. 1;

FIG. 6 is an opposing end view of the light-emitting diode package of FIG. 1;

FIG. 7 is a side view of the light-emitting diode package of FIG. 1; and,

FIG. 8 is an opposing side view of the light-emitting diode package of FIG. 1.

The broken lines shown in the drawings depict portions of the light-emitting diode package that form no part of the claimed design.

Claims

The ornamental design for a light-emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D521948 May 30, 2006 Inoue
D573554 July 22, 2008 Kobayakawa
D574336 August 5, 2008 Okada
D575244 August 19, 2008 Lee
D576574 September 9, 2008 Kobayakawa
D596592 July 21, 2009 Yong et al.
D602451 October 20, 2009 Gielen
D615504 May 11, 2010 Keller et al.
D615505 May 11, 2010 Butterworth
D623151 September 7, 2010 Hwang
D623152 September 7, 2010 Hwang et al.
D642142 July 26, 2011 Kuwaharada et al.
D649943 December 6, 2011 Kuwaharada
D650342 December 13, 2011 Kuwaharada et al.
D650343 December 13, 2011 Andrews et al.
D660257 May 22, 2012 Andrews et al.
D667802 September 25, 2012 Otaki et al.
D672731 December 18, 2012 Bergmann
D673126 December 25, 2012 Donofrio et al.
D673127 December 25, 2012 Cho et al.
D674758 January 22, 2013 Wu et al.
D675169 January 29, 2013 Chou
D691973 October 22, 2013 Donofrio et al.
D697642 January 14, 2014 Amari et al.
D704154 May 6, 2014 Andrews et al.
D705957 May 27, 2014 Lin
D711841 August 26, 2014 Britt et al.
D712849 September 9, 2014 Britt et al.
D713804 September 23, 2014 Britt et al.
D718258 November 25, 2014 Lowes et al.
9006763 April 14, 2015 Ueno et al.
9070850 June 30, 2015 Keller et al.
D738832 September 15, 2015 Hussell
D741821 October 27, 2015 Song
D749051 February 9, 2016 Clark et al.
9349929 May 24, 2016 Clark et al.
D762183 July 26, 2016 Kim et al.
D762184 July 26, 2016 Kiridoshi
D763472 August 9, 2016 Watson-Levack
D763473 August 9, 2016 Watson-Levack
9461024 October 4, 2016 Hussell et al.
9515055 December 6, 2016 Britt et al.
D777122 January 24, 2017 Bergmann et al.
9627361 April 18, 2017 Andrews et al.
D790486 June 27, 2017 Reiherzer et al.
D800679 October 24, 2017 Omori
9887327 February 6, 2018 Reiherzer et al.
D833989 November 20, 2018 Tamura
D844576 April 2, 2019 Miura
10388838 August 20, 2019 Hung et al.
10439112 October 8, 2019 Clark et al.
10516081 December 24, 2019 Xin et al.
10522722 December 31, 2019 Damborsky et al.
10854780 December 1, 2020 Hung et al.
D915308 April 6, 2021 Maruyama
D915309 April 6, 2021 Maruyama
D926714 August 3, 2021 Wilcox et al.
11552229 January 10, 2023 Damborsky et al.
D996377 August 22, 2023 Celano et al.
D996378 August 22, 2023 Trinkle
D100040 October 2023 Wilcox et al.
D1000400 October 3, 2023 Wilcox
D1036711 July 23, 2024 Celano
20050173721 August 11, 2005 Isoda
20070253209 November 1, 2007 Loh et al.
20080054280 March 6, 2008 Reginelli et al.
20100140633 June 10, 2010 Emerson
20100140634 June 10, 2010 van de Ven et al.
20100252851 October 7, 2010 Emerson et al.
20110062482 March 17, 2011 Solomensky et al.
20110210358 September 1, 2011 Kim et al.
20110220920 September 15, 2011 Collins et al.
20120086024 April 12, 2012 Andrews et al.
20120087108 April 12, 2012 Ke et al.
20120112661 May 10, 2012 van de Ven et al.
20130092960 April 18, 2013 Wilcox et al.
20130105835 May 2, 2013 Wu et al.
20130141920 June 6, 2013 Emerson
20130322068 December 5, 2013 Clark et al.
20130322070 December 5, 2013 Clark et al.
20130322088 December 5, 2013 Huang et al.
20140131748 May 15, 2014 Song
20140291715 October 2, 2014 Reiherzer et al.
20150179903 June 25, 2015 Pun et al.
20150221839 August 6, 2015 Park
20160079478 March 17, 2016 Kong
20170069606 March 9, 2017 Gould
20170069806 March 9, 2017 Kim
20170084587 March 23, 2017 Hung et al.
20170179352 June 22, 2017 Song
20180151790 May 31, 2018 Kim
20190198709 June 27, 2019 Wildeson et al.
20190355886 November 21, 2019 Hussell et al.
20200335673 October 22, 2020 Kim
20210083153 March 18, 2021 Kayama et al.
20220005987 January 6, 2022 Wilcox et al.
20220165923 May 26, 2022 Kamp et al.
20230140302 May 4, 2023 Miller et al.
20230260972 August 17, 2023 Celano et al.
20230261154 August 17, 2023 Trinkle et al.
Foreign Patent Documents
D1353072 March 2009 JP
D1655194 March 2020 JP
D140189 April 2011 TW
D141208 June 2011 TW
D149503 October 2012 TW
D157837 December 2013 TW
D170851 October 2015 TW
D188043 January 2018 TW
2010035206 April 2010 WO
2018088671 May 2018 WO
2021023532 February 2021 WO
Other references
  • Office Action for Chinese Patent Application No. 202230530277.0, mailed Jul. 21, 2023, 8 pages.
  • Examination Report for Taiwanese Patent Application No. 112303066, mailed Oct. 19, 2023, 9 pages.
  • Examination Report for Taiwanese Patent Application No. 111303915, mailed Mar. 24, 2023, 4 pages.
  • Notice of Allowance for U.S. Appl. No. 29/829,994, mailed Mar. 15, 2023, 8 pages.
  • Notice of Allowance for U.S. Appl. No. 29/827,155, mailed Mar. 15, 2023, 9 pages.
  • International Search Report and Written Opinion for International Patent Application No. PCT/US2023/062635, mailed May 22, 2023, 13 pages.
  • International Search Report and Written Opinion for International Patent Application No. PCT/US2023/018595, mailed Jul. 31, 2023, 13 pages.
  • Notification to Grant for Chinese Patent Application No. 202230530277.0, mailed Feb. 22, 2024, 4 pages.
  • Office Action for Taiwanese Patent Application No. 112112910, mailed Feb. 22, 2024, 17 pages.
  • Notice of Allowance for Taiwanese Patent Application No. 112303066, mailed Feb. 19, 2024, 3 pages.
  • Notice of Allowance for U.S. Appl. No. 29/877,887, mailed Mar. 6, 2024, 8 pages.
  • Notice of Allowance for Taiwanese Patent Application No. 111303915, mailed Sep. 1, 2023, 5 pages.
  • Preliminary Examination Report for Taiwanese Patent Application No. 112103007, mailed Sep. 20, 2023, 17 pages.
  • MG Chemicals, “Epoxy Potting Compunds,” Technical Data Sheet, Sep. 27, 2021, MG Chemicals, web. archive/org/web/20210927001739/https://mgchemicals.com/products/potting-compounds/epoxy-potting/high- temperature-epoxy/, 3 pages.
  • MG Chemicals, “832HT: High Temperature Epoxy, Encapsulating and Potting Compound,” Technical Data Sheet, Nov. 21, 2019, MG Chemicals, web.archive.org/web/20201028085732/https://mgchemicals.com/downloads/tds/ tds-832ht-2parts.pdf, 2 pages.
  • Non-Final Office Action for U.S. Appl. No. 17/674,430, mailed Jul. 30, 2024, 22 pages.
  • Non-Final Office Action for U.S. Appl. No. 17/726,072, mailed Oct. 10, 2024, 7 pages.
Patent History
Patent number: D1060278
Type: Grant
Filed: Jun 13, 2023
Date of Patent: Feb 4, 2025
Assignee: CreeLED, Inc. (Durham, NC)
Inventors: Sarah Trinkle (Broadway, NC), Alexis Rile (Durham, NC), Robert Wilcox (Rolesville, NC), Colin Blakely (Raleigh, NC)
Primary Examiner: Selina Sikder
Application Number: 29/877,879
Classifications