Abstract: The present invention allows a user or community of users to rate content across a variety of web sites and display contextual sensitive reviews. Rather than the rating information being controlled by the web site owner, the rating information may be owned and controlled by a third party. Users have the ability to rate a web site, review ratings from a web site, or operate a web site rating system.

Abstract: A method for monitoring a clot dissolution treatment in a patient's vasculature comprises positioning a catheter at a treatment site in the patient's vasculature. The method further comprises performing a clot dissolution treatment at the treatment site. The clot dissolution treatment comprises delivering ultrasonic energy and a therapeutic compound from the catheter to the treatment site such that a clot located at the treatment site at least partially dissolves. The method further comprises delivering a thermal measurement signal from a first portion of the catheter to the treatment site during the clot dissolution treatment. The method further comprises receiving the thermal measurement signal at a second portion of the catheter. The method further comprises comparing the delivered thermal measurement signal with the received thermal measurement signal to evaluate a blood flow rate at the treatment site.

Abstract: An network management system (NMS) architecture is disclosed that takes advantage of intelligence capable network devices for network monitoring and control. NMS functions may be distributed where possible to intelligent devices where local storage and processing may be performed. Local collection and processing of monitoring information may reduce NMS-related network traffic, permit continuing local control and operation during times of network communication disruption with the central NMS, and permit greater reliability in data collection and execution of network functions such as the enforcement of security policy at the respective intelligent devices.

Abstract: A method for treating an occlusion comprises positioning a catheter at a treatment site in a patient's vasculature. A blockage is located at the treatment site. The method further comprises performing a medical treatment at the treatment site. The medical treatment is configured to reduce the blockage. The method further comprises making a plurality of measurements at the treatment site.

Abstract: An ultrasound catheter is configured to be positioned at a treatment site within a patient's vasculature. The catheter comprises an elongate tubular body forming a utility lumen. The catheter further comprises an ultrasound assembly configured to be movably positioned within the utility lumen. The ultrasound assembly includes a plurality of ultrasound radiating members. The catheter further comprises a plurality of fluid delivery lumens formed within the elongate tubular body. Each fluid delivery lumen includes one or more fluid delivery ports configured to allow a fluid to flow from within the fluid delivery lumen to the treatment site. A first fluid delivery lumen includes one or more fluid delivery ports over a first region of the tubular body. A second fluid delivery lumen includes one or more fluid delivery ports over a second region of the tubular body. The first region of the tubular body and the second region of the tubular body have different lengths.

Abstract: A catheter system for delivering ultrasonic energy and a therapeutic compound to a treatment site within a patient's vasculature comprises a tubular body having an energy delivery section. The catheter system further comprises a fluid delivery lumen extending at least partially through the tubular body. The catheter system further comprises a semi-permeable membrane positioned along a portion of the fluid delivery lumen. The membrane has an increased porosity when exposed to ultrasonic energy. The catheter system further comprises an inner core configured for insertion into the tubular body. The inner core comprises an elongate electrical conductor having a plurality of flattened regions. Each flattened region has a first flat side and a second flat side opposite the first flat side. The inner core further comprises a plurality of ultrasound radiating members mounted in pairs to the flattened regions of the elongate electrical conductor.

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Abstract: Apparatus and methods for image scanning of variable sized documents having variable orientations are disclosed. Apparatus for scanning a slip includes a slip editor that provides a user interface via which slip definition parameters that define a slip to be scanned can be entered. The slip editor receives the slip definition parameters via the user interface, and stores the received slip definition parameters in a slip definition parameter file.

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chip assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chip assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Abstract: A technique for testing/stressing integrated circuit devices, especially wafers, having a plurality of contacts on one face thereof arranged in a predetermined pattern is provided. An interposer having a dielectric substrate and a device contact face and a tester contact face is provided. A first plurality of releasable connectors on the device contact are face arranged in the same predetermined pattern, and a second plurality of releasable connectors are arranged in the same predetermined pattern on the tester contact face. The releasable connections are formed of dendrites. Conducting vias connect the corresponding connectors of the first and second releasable connectors respectively. A test head is provided having a plurality of contact pads also arranged in the same predetermined pattern. Circuitry is provided on the test head to connect each of the contact pads thereon with external leads extending to provide signal contact to each of the contact pads on the test head.

Abstract: A technique for testing/stressing integrated circuit devices, especially wafers, having a plurality of contacts on one face thereof arranged in a predetermined pattern is provided. An interposer having a dielectric substrate and a device contact face and a tester contact face is provided. A first plurality of releasable connectors on the device contact are face arranged in the same predetermined pattern, and a second plurality of releasable connectors are arranged in the same predetermined pattern on the tester contact face. The releasable connections are formed of dendrites. Conducting vias connect the corresponding connectors of the first and second releasable connectors respectively. A test head is provided having a plurality of contact pads also arranged in the same predetermined pattern. Circuitry is provided on the test head to connect each of the contact pads thereon with external leads extending to provide signal contact to each of the contact pads on the test head.

Abstract: A composite cable has a reinforcing layer with conductors disposed on opposed planar surfaces. Dielectric film layers electrically separate the conductors on the planar reinforcing layer from respective layers of additional conductors. The flexible cable is manufactured by laminating a layer of dielectric film and a layer of electrically conductive material onto both sides of a double clad core which provides a strain relief reinforcement for the cable.

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chip assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Abstract: A technique for testing/stressing integrated circuit devices, especially wafers, having a plurality of contacts on one face thereof arranged in a predetermined pattern is provided. An interposer having a dielectric substrate and a device contact face and a tester contact face is provided. A first plurality of releasable connectors on the device contact are face arranged in the same predetermined pattern, and a second plurality of releasable connectors are arranged in the same predetermined pattern on the tester contact face. The releasable connections are formed of dendrites. Conducting vias connect the corresponding connectors of the first and second releasable connectors respectively. A test head is provided having a plurality of contact pads also arranged in the same predetermined pattern. Circuitry is provided on the test head to connect each of the contact pads thereon with external leads extending to provide signal contact to each of the contact pads on the test head.

Abstract: A fuel oil treatment unit and associated method for removing undesirable contaminants from a fuel oil, such as diesel oil, being delivered to an associated engine, such as a vehicle diesel engine. The invention includes, inter alia, a unit for treating contaminant-containing fuel oil, comprising means for heating the fuel oil to a temperature sufficient to volatilize at least some of the contaminants and, also, means for filtering the so-heated fuel oil, to remove therefrom at least some of the remaining, unvolatilized contaminants. Optionally, the previously-heated and filtered fuel oil is passed to a temperature control means for maintaining or returning the temperature of the fuel oil to a desired level.