Abstract: A device for protecting an electronic circuit comprising a support to which are attached at least two circuit portions, each comprising at least one integrated circuit chip. The device comprises a wafer of a semiconductor material covered with a conductive layer arranged parallel to the support, the wafer being connected to the support by conductive pillars distributed around each circuit portion and in contact with the conductive layer.

Abstract: A stackable semiconductor package includes a board having first electrical connections, an integrated circuit chip fixed on a front face of the board, second electrical connections which connect the chip to the first electrical connections of the board and front electrical contact terminals arranged beyond at least one edge of the chip on the front face of this board. An encapsulation block of a coating material is formed on the front face of the board and encapsulates the chip, its electrical connections and the front terminals. The block has at least one opening which at least partially uncovers the front terminals with a view to receiving electrical connection beads of a stacked second package. This one opening is preferably in the form of a groove.

Abstract: An electronic device protected against electromagnetic disturbances comprising: a support structure having a first and second electronic component, wherein the support structure includes a conductive means surrounding each of the first and second electronic components; a first and second insulating block formed overlying the first and second electronic components on the support structure; and a metal layer overlying the first and second insulating blocks that are formed over the first and second electronic components, wherein the metal layer is electrically connected to the support structure through the conductive means to protect the first and second electronic components from the electromagnetic disturbances irradiating from each of the first and second electronic components.

Abstract: A device for protecting an electronic circuit comprising a support to which are attached at least two circuit portions, each comprising at least one integrated circuit chip. The device comprises a wafer of a semiconductor material covered with a conductive layer arranged parallel to the support, the wafer being connected to the support by conductive pillars distributed around each circuit portion and in contact with the conductive layer.