Patents by Inventor Ronald S. Cok

Ronald S. Cok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190157532
    Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electrical component over the substrate surface to electrically contact the connection post to the notch conductor.
    Type: Application
    Filed: November 9, 2018
    Publication date: May 23, 2019
    Inventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, JR.
  • Publication number: 20190157563
    Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.
    Type: Application
    Filed: January 23, 2019
    Publication date: May 23, 2019
    Applicant: X-Celeprint Limited
    Inventors: Christopher Bower, Matthew Meitl, Ronald S. Cok
  • Patent number: 10297585
    Abstract: A compound micro-assembled device comprises a device substrate. A first component having a first native resolution and a second component having a second native resolution different from the first native resolution are both disposed on the device substrate. The device substrate can comprise a device circuit having a native resolution different from or less than the first and second native resolutions. One or more device interconnections electrically connect the first component to the second component or to the device circuit. In certain embodiments, the first component or the second component can be micro-transfer printed onto the device substrate. In certain embodiments, the compound micro-assembled device can be micro-transfer printed onto a destination substrate or the compound micro-assembled device can comprise a destination substrate onto which the device substrate is micro-transfer printed.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: May 21, 2019
    Assignee: X-Celeprint Limited
    Inventors: Christopher Andrew Bower, Matthew Meitl, Ronald S. Cok
  • Patent number: 10297502
    Abstract: A semiconductor structure suitable for micro-transfer printing includes a semiconductor substrate and a patterned insulation layer disposed on or over the semiconductor substrate. The insulation layer pattern forms one or more etch vias in contact with the semiconductor substrate. Each etch via is exposed. A semiconductor device is disposed on the patterned insulation layer and is surrounded by an isolation material in one or more isolation vias that are adjacent to the etch via. The etch via can be at least partially filled with a semiconductor material that is etchable with a common etchant as the semiconductor substrate. Alternatively, the etch via is empty and the semiconductor substrate is patterned to form a gap that separates at least a part of the semiconductor device from the semiconductor substrate and forms a tether physically connecting the semiconductor device to an anchor portion of the semiconductor substrate or the patterned insulation layer.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: May 21, 2019
    Assignees: X-Celeprint Limited, X-FAB Semiconductor Foundries AG
    Inventors: Christopher Andrew Bower, Ronald S. Cok, William Andrew Nevin, Gabriel Kittler
  • Publication number: 20190148604
    Abstract: A micro-transfer color-filter device comprises a color filter, an electrical conductor disposed in contact with the color filter, and at least a portion of a color-filter tether attached to the color filter or structures formed in contact with the color filter. In certain embodiments, a color filter is a variable color filter electrically controlled through one or more electrodes and can be responsive to heat, electrical current, or an electrical field to modify its optical properties, such as color, transparency, absorption, or reflection. In certain embodiments, A color-filter device includes connection posts and can be provided in or on a source wafer suitable for micro-transfer printing. In some embodiments, a color-filter device is disposed on a device substrate and can include a control circuit for controlling the color filter. An array of micro-transfer color-filter devices can be disposed on a display substrate in order to form a display.
    Type: Application
    Filed: December 20, 2018
    Publication date: May 16, 2019
    Inventors: Ronald S. Cok, Christopher Andrew Bower, Robert R. Rotzoll, Mark Willner
  • Publication number: 20190143737
    Abstract: A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.
    Type: Application
    Filed: November 9, 2018
    Publication date: May 16, 2019
    Inventors: Mark Willner, Ronald S. Cok, Robert R. Rotzoll, Christopher Andrew Bower
  • Patent number: 10289252
    Abstract: An inorganic light-emitting diode display with integrated electrodes includes a display surface having a display area and a plurality of spatially separated light-emitting diodes (such as inorganic light-emitting diodes) disposed in rows on the display surface in the display area. The inorganic light-emitting diodes in each row of inorganic light-emitting diodes are electrically connected by one or more electrical conductors. One or more row touch electrodes are disposed in rows over the display surface in the display area between the rows of inorganic light-emitting diodes and are disposed on the display surface and have a width that is larger than a length and width of the light-emitting diodes. A display with an integrated touch screen includes one or more sensing elements disposed in a common plane with the light emitters or on a side of the light emitters opposite the display surface.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: May 14, 2019
    Assignee: X-Celeprint Limited
    Inventor: Ronald S. Cok
  • Publication number: 20190130626
    Abstract: A computer system for selecting image products includes a display for displaying digital images, and for displaying representations of image products. Digital images are composited into the displayed representations to form digitally composited image product views. Programming controls displaying the composited image product views separately from the unselected representations. One or more of the displayed composited image product views are selected and assembled or fabricated.
    Type: Application
    Filed: November 9, 2018
    Publication date: May 2, 2019
    Applicant: KODAK ALARIS, INC.
    Inventors: Kathleen A. Mahoney, Ronald S. Cok
  • Publication number: 20190123719
    Abstract: A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.
    Type: Application
    Filed: December 20, 2018
    Publication date: April 25, 2019
    Inventors: Christopher Bower, Matthew Meitl, Ronald S. Cok
  • Patent number: 10270972
    Abstract: A method and device for adapting a display image on a hand-held portable wireless display and digital capture device. The device includes a camera for capturing a digital video and/or still image of a user, means for adjusting the captured digital image in response to poor image capture angle of said image capture device so as to create a modified captured digital image; and means for transmitting said modified captured digital image over a wireless communication network to a second hand-held portable wireless display and digital capture device.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: April 23, 2019
    Assignee: Monument Peak Ventures, LLC
    Inventors: John N. Border, Ronald S. Cok, Amy D. Enge, Andrew F. Kurtz, Joseph A. Manico, Lynn Schilling-Benz, Peter O. Stubler, Frances C. Williams
  • Patent number: 10270847
    Abstract: A plurality of server computers connected to computer network processes tasks that are unequally distributed among the server computers. A server sends a task-available message over the computer network to the remaining server computers to request assistance. The received task-available message is processed by some of the servers while others of the servers do not process the message because they are too busy. The servers that process the message respond by requesting a task from the message sending server.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: April 23, 2019
    Assignee: KODAK ALARIS INC.
    Inventors: Ron Barzel, Felix S. Hsu, Ronald S. Cok
  • Patent number: 10262567
    Abstract: A two-terminal store-and-control circuit includes a power circuit for receiving a modulated first signal, for receiving a second signal, for providing a power signal, and for providing a V? signal. A voltage comparator receives the modulated first signal and the V+ signal and provides a data signal that is extracted from the modulated first signal and the power signal. A data storage circuit receives and stores the data signal and provides a stored data signal. The circuit can be provided in a two-terminal store-and-control surface-mount device and employed to make a display.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: April 16, 2019
    Assignee: X-Celeprint Limited
    Inventors: Ronald S. Cok, Robert R. Rotzoll
  • Patent number: 10255834
    Abstract: A parallel redundant integrated-circuit system includes an input connection, an output connection and first and second active circuits. The first active circuit includes one or more first integrated circuits and has an input connected to the input connection and an output connected to the output connection. The second active circuit includes one or more second integrated circuits and is redundant to the first active circuit, has an input connected to the input connection, and has an output connected to the output connection. The second integrated circuits are separate and distinct from the first integrated circuits.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: April 9, 2019
    Assignee: X-Celeprint Limited
    Inventors: Ronald S. Cok, Robert R. Rotzoll, Christopher Bower, Matthew Meitl
  • Publication number: 20190088526
    Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.
    Type: Application
    Filed: November 15, 2018
    Publication date: March 21, 2019
    Inventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
  • Publication number: 20190088630
    Abstract: A micro-transfer printable electronic component includes one or more electronic components, such as integrated circuits or LEDs. Each electronic component has device electrical contacts for providing electrical power to the electronic component and a post side. A plurality of electrical conductors includes at least one electrical conductor electrically connected to each of the device electrical contacts. One or more electrically conductive connection posts protrude beyond the post side. Each connection post is electrically connected to at least one of the electrical conductors. Additional connection posts can form electrical jumpers that electrically connect electrical conductors on a destination substrate to which the printable electronic component is micro-transfer printed. The printable electronic component can be a full-color pixel in a display.
    Type: Application
    Filed: November 5, 2018
    Publication date: March 21, 2019
    Inventors: Ronald S. Cok, Christopher Bower, Matthew Meitl, Carl Prevatte, JR.
  • Publication number: 20190077182
    Abstract: A hybrid currency banknote includes a banknote having visible markings. One or more light-controlling elements and a controller are embedded in or on the banknote. The controller is electrically connected to the one or more light-controlling elements to control the one or more light-controlling elements. A power input connection is electrically connected to the controller, or one or more light-controlling elements, or both. A power source can be connected to the power input connection, for example a piezoelectric or photovoltaic power source. In response to applied power, the controller causes the one or more light-controlling elements to emit light. A value can be stored in a memory in the controller and displayed by the light-controlling elements. The value can be assigned or varied by a hybrid currency teller machine.
    Type: Application
    Filed: November 5, 2018
    Publication date: March 14, 2019
    Inventors: Ronald S. Cok, Robert R. Rotzoll, Christopher Bower, Mark Willner
  • Patent number: 10230048
    Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: March 12, 2019
    Assignee: X-Celeprint Limited
    Inventors: Christopher Bower, Matthew Meitl, Ronald S. Cok
  • Patent number: 10223962
    Abstract: A display having fused light-emitting diodes (LEDs) includes a display substrate and an array of pixel components disposed on the display substrate. Each pixel component comprises a light-emitting diode and an electrical fuse electrically connected in series with the light-emitting diode. The micro-transfer printable pixel components include an LED having first and second LED electrical contacts for providing power to the LED to cause the LED to emit light, a fuse having first and second fuse electrical contacts, the first fuse electrical contact electrically connected in series with the first LED electrical contact, a first electrode connected to the second fuse electrical contact, and a second electrode connected to the second LED electrical contact.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: March 5, 2019
    Assignee: X-Celeprint Limited
    Inventors: Matthew Meitl, Ronald S. Cok
  • Patent number: 10224231
    Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: March 5, 2019
    Assignee: X-Celeprint Limited
    Inventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
  • Patent number: 10217308
    Abstract: A hybrid high-security document includes a document and one or more independent light-emitting modules disposed on or embedded in the document. Each module comprises an antenna with multiple turns, an electronic circuit, and a light emitter mounted and electrically connected on a substrate separate from the document. The electronic circuit is responsive to electrical power provided from the antenna to control the light emitter to emit light. The electronic circuit can include a memory storing information relevant to the hybrid high-security document or its use. The information can be accessed by external readers providing electromagnetic energy to the hybrid high-security document. The hybrid high-security document can be a hybrid banknote.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: February 26, 2019
    Assignee: X-Celeprint Limited
    Inventors: Robert R. Rotzoll, Christopher Bower, Ronald S. Cok