Abstract: A computer system for selecting image products includes a display for displaying digital images, and for displaying representations of image products. Digital images are composited into the displayed representations to form digitally composited image product views. Programming controls displaying the composited image product views separately from the unselected representations. One or more of the displayed composited image product views are selected and assembled or fabricated.

Abstract: A micro-transfer printing system comprises a source substrate having a substrate surface and components disposed in an array on, over, or in the substrate surface Each component has a component extent in a plane parallel to the substrate surface. A stamp comprises a stamp body and stamp posts extending away from the stamp body disposed in an array over the stamp body. Each of the stamp posts has (i) a post location corresponding to a component location of one of the components when the stamp is disposed in alignment with the source substrate, and (ii) a post surface extent on a distal end of the stamp post. The post surface extent is greater than the component extent.

Abstract: An embedded component stack includes a first metal layer, a first dielectric layer disposed on the first metal layer, a second metal layer disposed on the first dielectric layer, a first component disposed and embedded entirely within the first dielectric layer and entirely between the first metal layer and the second metal layer, a second dielectric layer disposed on the second metal layer, and a second component disposed on or embedded entirely within the second dielectric layer. The first and second components can be bare, unpackaged dies disposed over the metal layers by micro-transfer printing. The metal layers can be patterned and can be electrically connected to the components. The first component can be rotated with respect to the second component. Multiple components can be embedded in one or more of the dielectric layers.

Abstract: A monolithic multi-FET transistor comprises an epitaxial layer disposed on a dielectric layer. The epitaxial layer comprises a crystalline semiconductor material and a multi-FET area. An isolation structure surrounds the multi-FET area and divides the multi-FET area into separate FET portions. A gate disposed on a gate dielectric extends over each FET portion. A source and a drain are each disposed on opposite sides of the gate on the epitaxial layer within each FET portion. Each gate, source, and drain comprise a separate electrical conductor and the gate, source, drain, and epitaxial layer within each FET portion form a field-effect transistor. Gate, source, and drain contacts electrically connect the gates, sources, and drains of the separate FET portions, respectively. At least the sources or drains of two neighboring FET portions are disposed in common over at least a portion of the isolation structure dividing the two neighboring FET portions.

Abstract: A multi-color LED display comprises pixels, each comprising a first sub-pixel, a second sub-pixel, and a third sub-pixel. The first sub-pixel comprises a first light-emitting diode (LED) that emits a first color of light, the second sub-pixel comprises second LEDs that emit a second color of light different from the first color of light, and the third sub-pixel comprises third LEDs that emit a third color of light different from the first color of light and different from the second color of light. The second LEDs are electrically connected in parallel and the third LEDs are electrically connected in series.

Abstract: A pixel with a color-agnostic repair site includes a pixel controller, a first site for a first light emitter electrically connected to the pixel controller with a first wire, a second site for a second light emitter electrically connected to the pixel controller with a second wire different from the first wire, and a repair site for a repair light emitter. A repair wire can independently electrically connect the repair site to the pixel controller. A repair wire can electrically connect the repair site to the first wire or to the second wire with a jumper. The repair site can electrically connect to the first wire or to the second wire. A first repair wire can electrically connect the repair site to the first wire, a second repair wire can electrically connect the repair site to the second wire, and one of these wires can be cut.

Abstract: A display with integrated touch screen includes pixels distributed in an array of rows or pixels connected by row wires and columns of pixels connected by column wires defining a display area on a display substrate. The pixels can comprise mutually exclusive subarrays of pixels forming clusters. Each cluster can be independently controlled and can comprise a touch controller for sensing touches. Each pixel can include one or more micro-iLEDs. A first row wire can be driven with a display signal at the same time the touch controller senses one or more second row wires different from the first row wire. The touch controller can sense multiple row wires at a time or can receive a control signal at a frequency of no less than one MHz on a row wire. In some embodiments, the touch controller comprises a capacitance circuit in an integrated circuit separate from the display substrate.

Abstract: A device source wafer includes a wafer substrate, devices formed on or in the wafer substrate at a location on the wafer substrate, and test structures disposed on the wafer substrate connected to some but not all of the devices. The devices include a first device disposed at a first location and a second device disposed at a second different location on the wafer substrate. The test structures include at least a first test structure connected to the first device and a second test structure connected to the second device. The first test structure is adapted to measuring a characteristic of the first device and the second test structure is adapted to measuring the characteristic of the second device. An estimated characteristic of unmeasured devices is derived from the first and second device locations and measured characteristics and the device is selected based on the estimated characteristic.

Abstract: A stamp includes a rigid support and an array of posts disposed in combination with the rigid support. Each of the posts in the array of posts extends in a direction away from the rigid support. The distal end of each of the posts in the array of posts has a structured three-dimensional surface including a first micro-post that extends a first distance away from the rigid support and a second micro-post that extends a second distance away from the rigid support. The second distance is less than the first distance.

Abstract: A selective-update display includes clusters of pixels. Each of the clusters has a cluster memory and a cluster controller and each of the pixels includes one or more light emitters. The cluster controller includes circuits operable to (i) receive a cluster packet comprising packet data, (ii) store the packet data in the cluster memory, and (iii) control the one or more light emitters in each of the pixels to emit light corresponding to the stored packet data. A display controller is connected to one or more of the clusters and is operable to transmit cluster packets to some but not all of the clusters in any order to selectively update the display. Each cluster can have a cluster address and cluster packets can include packet addresses matched to cluster addresses.

Abstract: A micro-component comprises a component substrate having a first side and an opposing second side. Fenders project from the first and second sides of the component substrate and include first-side fenders extending from the first side and a second-side fender extending from the second side of the component substrate. At least two of the first-side fenders have a non-conductive surface and are disposed closer to a corner of the component substrate than to a center of the component substrate.

Abstract: A method of making a secure integrated-circuit system comprises providing a first integrated circuit in a first die having a first die size and providing a second integrated circuit in a second die. The second die size is smaller than the first die size. The second die is transfer printed onto the first die and connected to the first integrated circuit, forming a compound die. The compound die is packaged. The second integrated circuit is operable to monitor the operation of the first integrated circuit and provides a monitor signal responsive to the operation of the first integrated circuit. The first integrated circuit can be constructed in an insecure facility and the second integrated circuit can be constructed in a secure facility.

Abstract: A multi-component transistor structure includes components each comprising an individual, discrete, and separate component substrate and a component transistor. The component transistor includes a transistor element having a transistor element resistance. A component connection is disposed external to the transistor element and has a connection resistance. The component connection electrically connects the transistor elements in the components in parallel. The connection resistance is less than the transistor element resistance of at least one corresponding transistor element, less than an average of the transistor element resistances of all of the corresponding transistor elements, or less than the sum of all of the transistor element resistances of all of the corresponding transistor elements. The component transistors are functionally similar and at least one of the components is disposed on another different one of the components in a component stack.

Abstract: A multi-LED structure comprises a first LED and a separate second LED disposed on a common multi-LED native substrate. The LEDs each comprise a common first layer having a cantilever portion and a base portion and a common second layer having a light-emitting emission portion disposed only over the base portion. An LED electrode electrically connects the first LED to the second LED. The cantilever portion extends in a direction different from the base portion or a length of the cantilever portion is less than a distance between the emission portions of the first and second LEDs.

Abstract: A current-selectable light-emitting-diode (LED) display includes pixels distributed in an array of rows and columns. The pixels are grouped in mutually exclusive clusters and cluster controllers are connected to each pixel in a cluster of pixels to control the pixels in the cluster to emit light. Each cluster controller comprises a selectable current source. Each of the selectable current sources can include cluster current sources that are responsive to a current-select signal to enable one or more of the cluster current sources. The pixels can include micro-LEDs and the cluster controller can be disposed between the micro-LEDs. The display can be disposed on a display substrate with signal wires. The signal wires can include separate wire segments that are electrically connected through regeneration circuits that regenerate the signals. The display can be an information display or a backlight.

Abstract: A micro-transfer printing system comprises a source substrate having a substrate surface and components disposed in an array on, over, or in the substrate surface Each component has a component extent in a plane parallel to the substrate surface. A stamp comprises a stamp body and stamp posts extending away from the stamp body disposed in an array over the stamp body. Each of the stamp posts has (i) a post location corresponding to a component location of one of the components when the stamp is disposed in alignment with the source substrate, and (ii) a post surface extent on a distal end of the stamp post. The post surface extent is greater than the component extent.

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

Abstract: An interpolated flat-panel display comprises a display substrate, pixel controllers disposed in a controller array over the display substrate, and pixels disposed in a pixel array over the display substrate. Each pixel controller is connected to one or more control lines and is operable to output pixel information. Each pixel is operable to emit light in response to pixel information received from a pixel controller. The pixel array is larger than the controller array, each pixel is connected to at least one pixel controller, and at least some pixels are interpolated pixels connected to at least two pixel controllers and are operable to emit light in response to pixel information received from the at least two pixel controllers.

Abstract: A printed structure includes a substrate comprising a substrate surface, a substrate circuit disposed in or on in a circuit area of the substrate surface, a substrate post protruding from the substrate surface exterior to the circuit area, and a component having a component top side and a component bottom side opposite the component top side. The component bottom side can be disposed on the substrate post and adhered to the substrate surface forming an air gap between the component bottom side and the substrate circuit. The substrate post can comprise a substrate post material that is a cured adhesive. Some embodiments comprise a substrate electrode and the component comprises an electrically conductive connection post extending from the component bottom side toward the substrate in electrical contact with the substrate electrode.

Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.