Abstract: This application relates to the field of wireless communications technologies, and discloses an encoding method and apparatus, to improve accuracy of reliability calculation and ordering for polarized channels. The method includes: obtaining a first sequence used to encode K to-be-encoded bits, where the first sequence includes sequence numbers of N polarized channels, the first sequence is same as a second sequence or a subset of the second sequence, the second sequence comprises sequence numbers of Nmax polarized channels, and the second sequence is the sequence shown in Sequence Q11 or Table Q11, K is a positive integer, N is a positive integer power of 2, n is equal to or greater than 5, K?N, Nmax=1024; selecting sequence numbers of K polarized channels from the first sequence; and performing polar code encoding on K the to-be-encoded bits based on the selected sequence numbers of the K polarized channels.

Abstract: In an embodiment, a package includes an encapsulant laterally surrounding a first integrated circuit device and a second integrated circuit device, wherein the first integrated circuit device includes a die and a heat dissipation structure over the die; a sealant disposed over the heat dissipation structure; an adhesive disposed over the second integrated circuit device; and a lid disposed over the sealant and the adhesive, wherein the lid includes a first cooling passage and a second cooling passage, the first cooling passage including an opening at a bottom of the lid and aligned to the heat dissipation structure, the second cooling passage including channels aligned to the second integrated circuit device and being distant from the bottom of the lid.

Abstract: Disclosed are a device and method for detecting defects of a high-voltage cable cross-bonded grounding system. The method comprises: selecting a protective grounding box of a cross-bonded grounding system, respectively connecting a signal excitation coupler to A-phase, B-phase and C-phase coaxial cables of the protective grounding box, selecting a stable signal with a frequency different from a power frequency or a field interference frequency, and testing effective current values and phases responded by the A-phase, B-phase and C-phase coaxial cables when the stable signal with the frequency F1 is injected into the A-phase, B-phase and C-phase coaxial cables of the protective grounding box in a coupled manner; and obtaining resistances and inductances of branch circuits of the cable cross-bonded grounding system by calculation according to measurement data, and determining if the cable cross-bonded grounding system has a connection defect.

Abstract: A temperature fuse assembly for a high-power DC circuit is provided. The temperature fuse assembly includes a case extending from a first case end to a second case end and an isolated lead projecting from the second case end. A bushing electrically isolates the isolated lead from the case. A high-gauge wire is electrically connected to the case at a first wire end and electrically connected to the isolated lead at a second wire end. A portion of the high-gauge wire is helically wound about an exterior of the bushing. When a temperature of the temperature fuse assembly exceeds a threshold temperature, the temperature fuse assembly is configured to conduct a DC current of the high-power DC circuit through the high-gauge wire. The high-gauge wire is configured to melt under a load of the DC current and interrupt the high-power DC circuit.

Abstract: Aspects of this disclosure are directed to a method and a terminal device, and a computer-readable storage medium. The terminal device includes processing circuitry that obtains n voice messages from at least one user account. n is a positive integer. The processing circuitry displays a voice message presentation interface. The voice message presentation interface is configured to display virtual characters corresponding to the n voice messages in a virtual world. Locations of the n voice messages in the virtual world are based on whether the n voice messages are unplayed. The virtual characters can be based on respective message attributes of the n voice messages.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: An enhancement mode high electron mobility transistor (HEMT) includes a group III-V semiconductor body, a group III-V barrier layer and a gate structure. The group III-V barrier layer is disposed on the group III-V semiconductor body, and the gate structure is a stacked structure disposed on the group III-V barrier layer. The gate structure includes a gate dielectric and a group III-V gate layer disposed on the gate dielectric, and the thickness of the gate dielectric is between 15 nm to 25 nm.

Abstract: A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.

Abstract: An electronic device includes a processor circuit, a frequency-domain-to-time-domain conversion circuit, a transmitter circuit, a hybrid circuit, a receiver circuit, and a time-domain-to-frequency-domain conversion circuit. The processor circuit generates a frequency-domain transmitting signal. The frequency-domain-to-time-domain conversion circuit converts the frequency-domain transmitting signal into a first time-domain transmitting signal. The transmitter circuit generates a second time-domain transmitting signal. The hybrid circuit includes an echo noise cancelling path and an echo noise path. When the echo noise cancelling path is turned off, the processor circuit receives a first frequency-domain receiving signal. When the echo noise cancelling path is turned on, the processor circuit receives a second frequency-domain receiving signal.

Abstract: A method for knowledge representation and deduction of service logic includes: generating, based on a knowledge representation model, a semantic graph corresponding to conceptual-layer service logic, where the semantic graph includes one or more types of nodes and edges for connecting the one or more types of nodes, and the nodes include at least a node of a variable type; generating, based on the semantic graph and a physical table to which a service object is mapped, an instance graph, where the instance graph includes the nodes and edges in the semantic graph; generating executable code based on a service logic relationship between the nodes in the instance graph; and determining, based on the executable code and a data instance corresponding to a node whose in-degree is 0 in the instance graph, a data instance corresponding to each node in the instance graph.

Abstract: Apparatus, systems and methods for irrigating lands are disclosed. In one example, an irrigation system is disclosed. The irrigation system includes a gate and a microcontroller unit (MCU). The gate is configured for adjusting a water flow for irrigating a piece of land. The MCU is configured for controlling the gate to adjust the water flow based on environmental information related to the piece of land.

Abstract: A semiconductor device includes a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, a MTJ on the MRAM region, a metal interconnection on the MTJ, and a blocking layer on the metal interconnection. Preferably, the blocking layer includes a stripe pattern according to a top view and the blocking layer could include metal or a dielectric layer.

Abstract: A method of engineering forecast and analysis is provided. The method includes: generating a forecasting model based on financial or business information obtained through a user interface, where the forecasting model expresses a logical determining and/or calculation rule based on a structure of a high-order directed graph and by using a plurality of nodes, attributes of the plurality of nodes, and a relationship between every two of the plurality of nodes, and the forecasting model expresses a forecasting path through a directed edge between the nodes; and configuring a common attribute of the forecasting model, an attribute of the forecasting path, and a personalized attribute of the node based on instantiation configuration information.

Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: Aspects of this disclosure are directed to a voice message display method and apparatus in an application, a computer device, and a computer-readable storage medium. The method can be performed by a terminal on which an application is installed and is capable of receiving a voice message. The method can include starting an application, and obtaining n voice messages published by at least one user account. The method can further include displaying a voice message presentation interface of the application, where the voice message presentation interface displays the voice message in a virtual world and the voice message are displayed by using a visible element in the virtual world as a carrier.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a first transistor over a substrate, wherein the first transistor comprises a first source/drain feature; depositing an interlayer dielectric layer around the first transistor; etching an opening in the interlayer dielectric layer to expose the first source/drain feature; conformably depositing a semimetal layer over the interlayer dielectric layer, wherein the semimetal layer has a first portion in the opening in the interlayer dielectric layer and a second portion over a top surface of the interlayer dielectric layer; and forming a source/drain contact in the opening in the interlayer dielectric layer.

Abstract: A method and a device for measuring a tangential reaction force of a resistance device on a flywheel, and the reaction force multiply the radius of the flywheel to obtain a torque, such that the torque multiply a gear ratio is the torque to overcome the resistance of flywheel on the drivetrain. The torque to overcome the resistance of flywheel on the drivetrain adding a torque to overcome the inertia of the flywheel and mechanical friction under the state of no resistance is the total torque presented on the drivetrain. Such that using the total torque to calculate power and energy consumption.

Abstract: The present disclosure discloses a device with a protective layer, including a substrate, a seed layer formed on the substrate, and a diamond-like carbon layer formed on the seed layer, where the seed layer is a silicon nitride layer, and a content of nitrogen in the silicon nitride layer is 9%-17%. The present disclosure further discloses a microwave-assisted magnetic recording (MAMR) head slider, a head gimbal assembly, and a disk drive unit. The device has good thermal stability, oxidation resistance and corrosion resistance, thereby improving reliability and prolonging service life of an MAMR head.

Abstract: A sub-circuit of a voltage regulator includes a load condition detection circuit and a controllable circuit. The load condition detection circuit is arranged to detect a load transient frequency of a load powered by the voltage regulator, and generate a control signal according to a detection result of the load transient frequency. The controllable circuit is arranged to receive the control signal, wherein an operational behavior of the controllable circuit dynamically changes in response to the control signal.