Patents by Inventor Ru Chang

Ru Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230041147
    Abstract: A debugging management platform and an operating method for the same are provided. In the operating method, the debugging management platform operates a debugging agent service for establishing a debugging channel between a software development platform and a test platform. When receiving debugging packets are issued by the software development platform or the test platform, the debugging agent service analyzes the debugging packets and checks if the debugging packets meet an information security standard. The debugging packets are forwarded to the test platform or the software development platform if the debugging packets meet the information security standard. If the debugging packets do not meet the information security standard, the debugging packets are not forwarded, so as to ensure information security of the debugging packets that are forwarded between different environments.
    Type: Application
    Filed: April 18, 2022
    Publication date: February 9, 2023
    Inventors: SHUN-YEN LU, CHING-TUNG WU, JUN-RU CHANG
  • Publication number: 20220207368
    Abstract: A method of training a neural network model for predicting a click-through rate (CTR) of a user in an electronic device includes normalizing an embedding vector on the basis of a feature-wise linear transformation parameter, and inputting the normalized embedding vector into a neural network layer, wherein the feature-wise linear transformation parameter is defined such that the same value is applied to all elements of the embedding vector.
    Type: Application
    Filed: December 29, 2021
    Publication date: June 30, 2022
    Applicant: Hyperconnect, Inc.
    Inventors: Sang Il Ahn, Joon Young Yi, Beom Su Kim, Bu Ru Chang
  • Publication number: 20220102582
    Abstract: A semiconductor structure includes a carrier, a bonding structure, a semiconductor stack, a supporting element and a bridge layer. The bonding structure is on the carrier and has an upper surface. The semiconductor stack is on the bonding structure. The supporting element is on the bonding structure and has a side wall. The bridge layer has a first portion directly connected to the supporting element, a second portion connected to the first portion and a third portion connected to the second portion. The second portion and the third portion of the bridge layer are suspended above the upper surface of the bonding structure. The first portion of the bridge layer directly contacts the side wall of the supporting element.
    Type: Application
    Filed: December 14, 2021
    Publication date: March 31, 2022
    Inventors: Yung-Fu CHANG, Fan-Lei WU, Shih-Chang LEE, Wen-Luh LIAO, Hung-Ta CHENG, Chih-Chaing YANG, Yao-Ru CHANG, Yi HSIAO, Hsiang CHANG
  • Patent number: 11227978
    Abstract: A semiconductor device and a package structure are provided. The semiconductor device includes a substrate, a light-emitting structure, a first semiconductor layer, a second semiconductor layer and a first electrode. The light-emitting structure is on the substrate. The first semiconductor layer is on the light-emitting structure. The second semiconductor layer is between the first semiconductor layer and the light-emitting structure. The first electrode is on the second semiconductor layer. At least a portion of the first electrode is separated from the first semiconductor layer.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: January 18, 2022
    Assignee: Epistar Corporation
    Inventors: Wen-Luh Liao, Cheng-Long Yeh, Ko-Yin Lai, Yao-Ru Chang, Yung-Fu Chang, Yi Hsiao, Shih-Chang Lee
  • Patent number: 11227975
    Abstract: A semiconductor structure includes a carrier having a surface, a supporting element, a semiconductor stack and a bridge layer. The supporting element is on the surface. The semiconductor stack is on the surface and has a side surface. The bridge layer includes a first portion connecting to the supporting element, a second portion, and a third portion connecting to the semiconductor stack. The second portion is extended from the third portion toward the first portion and is protruded from the side surface.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: January 18, 2022
    Assignee: Epistar Corporation
    Inventors: Yung-Fu Chang, Fan-Lei Wu, Shih-Chang Lee, Wen-Luh Liao, Hung-Ta Cheng, Chih-Chaing Yang, Yao-Ru Chang, Yi Hsiao, Hsiang Chang
  • Publication number: 20210372880
    Abstract: A camera-testing box for testing optical properties of an image-capturing device includes a box body, a light source, a photographic film, a mask, and a base. The light source is disposed inside the light-free box body. The photographic film is disposed on a side of the light source inside the box body. The mask is disposed on a side of the photographic film away from or facing the light source, and the mask includes a transparent area and a shielding area to reduce flare-causing light reflected by screws and other extraneous objects in the camera-testing box. The base is disposed inside the box body, and on a side of the mask away from the light source. The base supports the to-be-tested image-capturing device.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 2, 2021
    Inventors: XIN-RU CHANG, YU-TSANG TU
  • Patent number: 11121285
    Abstract: A semiconductor device includes a conductive layer, a semiconductor stack, a first contact structure, an intermediate structure, a second contact structure, a first electrode and a second electrode. The semiconductor stack is disposed on the conductive layer. The first contact structure is disposed on the semiconductor stack. The intermediate structure encloses the first contact structure. The second contact structure is between the conductive layer and the semiconductor stack. The first electrode is on the conductive layer and separated from the semiconductor stack. The second electrode is on the intermediate structure.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: September 14, 2021
    Assignee: Epistar Corporation
    Inventors: Yung-Fu Chang, Hui-Fang Kao, Yi-Tang Lai, Shih-Chang Lee, Wen-Luh Liao, Mei Chun Liu, Yao-Ru Chang, Yi Hisao
  • Publication number: 20210202047
    Abstract: The present disclosure provides a new drug candidate material output apparatus, including: a communication module; a memory in which a new drug candidate material output program is stored; and a processor executing the new drug candidate material output program. The new drug candidate material output program provides a drug learning model in which an embedding vector for a chemical structure of a chemical compound and an embedding vector for change information on an amount of a transcriptome induced by each chemical compound are located in a same vector space, outputs a result of the change information on the amount of the transcriptome that matches the embedding vector for the chemical structure of the new material input to the drug learning model, or outputs information on one or more drugs that match the change information on the amount of the transcriptome that is a target input to the drug learning model.
    Type: Application
    Filed: December 31, 2020
    Publication date: July 1, 2021
    Applicant: Korea University Research and Business Foundation
    Inventors: Jaewoo KANG, Min Ji JEON, Bu Ru CHANG, Jung Soo PARK, Sung Joon PARK, Sun Kyu KIM
  • Publication number: 20200365769
    Abstract: A semiconductor device is provided, which includes a base, a semiconductor structure and a conductive reflective structure. The base has a first surface and a second surface opposite to the first surface. The semiconductor structure is located on the first surface. The conductive reflective structure is located on the second surface and includes a metal oxide structure and a metal structure. The metal oxide structure is located between the metal structure and the base. The metal oxide structure physically contacts the second surface.
    Type: Application
    Filed: May 15, 2020
    Publication date: November 19, 2020
    Inventors: Yao-Ru CHANG, Wen-Luh LIAO, Yung-Fu CHANG, Hsiang CHANG, Meng-Yang CHEN, Yun-Hsin PANG, Yi HSIAO
  • Patent number: 10741721
    Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: August 11, 2020
    Assignee: EPISTAR Corporation
    Inventors: Cheng-Feng Yu, Ching-Yuan Tsai, Yao-Ru Chang, Hsin-Chan Chung, Shih-Chang Lee, Wen-Luh Liao, Cheng-Hsing Chiang, Kuo-Feng Huang, Hsu-Hsuan Teng, Hung-Ta Cheng, Yung-Fu Chang
  • Patent number: 10700240
    Abstract: The present disclosure provides a light-emitting device. The light-emitting device includes a light emitting area and an electrode area. The light-emitting area includes a first semiconductor structure having a first active layer and a second semiconductor structure having a second active layer. The electrode area includes an external electrode structure surrounding the second semiconductor structure in a top view. The light-emitting area has a shape of circle or polygon in the top view. When the first semiconductor structure is driven by a first current, the first active layer can emit a first light with a first main wavelength. When the second semiconductor structure is driven by a second current, the active layer of the second semiconductor structure can emit a second light with a second main wavelength.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: June 30, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Yao-Ru Chang, Wen-Luh Liao, Chun-Yu Lin, Hsin-Chan Chung, Hung-Ta Cheng
  • Publication number: 20200152831
    Abstract: A semiconductor device includes a conductive layer, a semiconductor stack, a first contact structure, an intermediate structure, a second contact structure, a first electrode and a second electrode. The semiconductor stack is disposed on the conductive layer. The first contact structure is disposed on the semiconductor stack. The intermediate structure encloses the first contact structure. The second contact structure is between the conductive layer and the semiconductor stack. The first electrode is on the conductive layer and separated from the semiconductor stack. The second electrode is on the intermediate structure.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 14, 2020
    Inventors: Yung-Fu CHANG, Hui-Fang KAO, Yi-Tang LAI, Shih-Chang LEE, Wen-Luh LIAO, Mei Chun LIU, Yao-Ru CHANG, Yi HISAO
  • Publication number: 20200152836
    Abstract: A semiconductor device and a package structure are provided. The semiconductor device includes a substrate, a light-emitting structure, a first semiconductor layer, a second semiconductor layer and a first electrode. The light-emitting structure is on the substrate. The first semiconductor layer is on the light-emitting structure. The second semiconductor layer is between the first semiconductor layer and the light-emitting structure. The first electrode is on the second semiconductor layer. At least a portion of the first electrode is separated from the first semiconductor layer.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 14, 2020
    Inventors: Wen-Luh LIAO, Cheng-Long YEH, Ko-Yin LAI, Yao-Ru CHANG, Yung-Fu CHANG, Yi HSIAO, Shih-Chang LEE
  • Publication number: 20200105975
    Abstract: The present disclosure provides a light-emitting device. The light-emitting device includes a light emitting area and an electrode area. The light-emitting area includes a first semiconductor structure having a first active layer and a second semiconductor structure having a second active layer. The electrode area includes an external electrode structure surrounding the second semiconductor structure in a top view. The light-emitting area has a shape of circle or polygon in the top view. When the first semiconductor structure is driven by a first current, the first active layer can emit a first light with a first main wavelength. When the second semiconductor structure is driven by a second current, the active layer of the second semiconductor structure can emit a second light with a second main wavelength.
    Type: Application
    Filed: December 2, 2019
    Publication date: April 2, 2020
    Inventors: Yao-Ru CHANG, Wen-Luh LIAO, Chun-Yu LIN, Hsin-Chan CHUNG, Hung-Ta CHENG
  • Publication number: 20200075807
    Abstract: A semiconductor structure includes a carrier having a surface, a supporting element, a semiconductor stack and a bridge layer. The supporting element is on the surface. The semiconductor stack is on the surface and has a side surface. The bridge layer includes a first portion connecting to the supporting element, a second portion, and a third portion connecting to the semiconductor stack. The second portion is extended from the third portion toward the first portion and is protruded from the side surface.
    Type: Application
    Filed: August 23, 2019
    Publication date: March 5, 2020
    Inventors: Yung-Fu CHANG, Fan-Lei WU, Shih-Chang LEE, Wen-Luh LIAO, Hung-Ta CHENG, Chih-Chaing YANG, Yao-Ru CHANG, Yi HSIAO, Hsiang CHANG
  • Patent number: 10529896
    Abstract: The present disclosure provides a light-emitting device, comprising: a light-emitting stack; a first semiconductor layer on the light-emitting stack; a first electrode formed on the first semiconductor layer and comprising an inner segment, an outer segment, and a plurality of extending segments electrically connecting the inner segment with the outer segment.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: January 7, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Yao-Ru Chang, Wen-Luh Liao, Chun-Yu Lin, Hsin-Chan Chung, Hung-Ta Cheng
  • Patent number: 10504133
    Abstract: Administering reward schemes. A first reward scheme is predefined by a computer system, the first reward scheme defining a first reward event. A second reward scheme is obtained externally by the computer system, the second reward scheme defining a second reward event. In response to an action by a user, the computer system determines whether the first reward event or the second reward event has been triggered. If the first reward event has been triggered, the computer system calculates a first reward for the user according the first reward scheme and if the second reward event has been triggered, the computer system calculates a second reward for the user according the second reward scheme. The second reward scheme may be obtained by, and shared to, the computer system as an inheritance of rules within an organization.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: December 10, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Chia-Ru Chang, Vincent Y. Deng, Pao-Chuan Liao, June-Ray Lin
  • Publication number: 20190229233
    Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.
    Type: Application
    Filed: April 3, 2019
    Publication date: July 25, 2019
    Inventors: Cheng-Feng YU, Ching-Yuan TSAI, Yao-Ru CHANG, Hsin-Chan CHUNG, Shih-Chang LEE, Wen-Luh LIAO, Cheng-Hsing CHIANG, Kuo-Feng HUANG, Hsu-Hsuan TENG, Hung-Ta CHENG, Yung-Fu CHANG
  • Patent number: 10312407
    Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: June 4, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Feng Yu, Ching-Yuan Tsai, Yao-Ru Chang, Hsin-Chan Chung, Shih-Chang Lee, Wen-Luh Liao, Cheng-Hsing Chiang, Kuo-Feng Huang, Hsu-Hsuan Teng, Hung-Ta Cheng, Yung-Fu Chang
  • Publication number: 20190019920
    Abstract: The present disclosure provides a light-emitting device, comprising: a light-emitting stack; a first semiconductor layer on the light-emitting stack; a first electrode formed on the first semiconductor layer and comprising an inner segment, an outer segment, and a plurality of extending segments electrically connecting the inner segment with the outer segment.
    Type: Application
    Filed: September 19, 2018
    Publication date: January 17, 2019
    Inventors: Yao-Ru CHANG, Wen-Luh LIAO, Chun-Yu LIN, Hsin-Chan CHUNG, Hung-Ta CHENG