Abstract: The present disclosure provides a portable power tool. The power tool includes a tool body, a tool assembly and a gas pressure detection assembly. The tool assembly includes a tool bit furnished detachably in an end of the tool body. The gas pressure detection assembly is furnished detachably in another end of the tool body. The gas pressure detection assembly is communicatively coupled to the tool body.

Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.

Abstract: A multi-layer circuit structure includes a differential transmission line pair and at least one conductive pattern. The differential transmission line pair includes first and second transmission lines disposed side by side. Each of the first and second transmission lines includes first and second segments connected to each other. An spacing between the two first segments is non-fixed, and an spacing between the two second segments is fixed. A first zone is located between the two first segments, a second zone is opposite to the first zone and located outside the first segment of the first transmission line, and a third zone is opposite to the first zone and located outside the first segment of the second transmission line. The conductive pattern is coplanar with the differential transmission line pair and disposed on at least one of the first, second and third zones.

Abstract: The present disclosure provides a light-emitting device, comprising: a light-emitting stack; a first semiconductor layer on the light-emitting stack; a first electrode formed on the first semiconductor layer and comprising an inner segment, an outer segment, and a plurality of extending segments electrically connecting the inner segment with the outer segment.

Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.

Abstract: A device includes a spacer, which includes a recess extending from a top surface of the spacer into the spacer, and a conductive feature including a first portion and a second portion continuously connected to the first portion. The first portion extends into the recess. The second portion is on the top surface of the spacer. A die is attached to the spacer, and a lower portion of the first die extends into the recess.

Abstract: A detachable aerial photographic apparatus includes a carrier, an aircraft, a take-off delaying device and a trigger. The aircraft includes a main body disposed on the carrier, at least one propeller is pivotally furnished in the main body and a camera disposed on the main body. The take-off delaying device includes a movable member disposed on the carrier and at least one stopper connected to the movable member. The stopper is detachably connected to the aircraft for prevent the aircraft from taking off. The movable member is for detaching the stopper from the aircraft for releasing the aircraft. The trigger is electrically connected to the aircraft and the take-off delaying device. The trigger is for triggering the propeller and the movable member. A first time point when the propeller is triggered by the trigger is earlier than a second time point when the stopper is detached from the aircraft.

Abstract: A multi-layer substrate structure to achieve multiple arrangements of power/ground domains is disclosed. The multi-layer substrate structure comprises a first layer for disposing an integrated circuit thereon and a second layer coupled to the first layer, wherein a connection structure is electrically connected to a plurality of power/ground domains on the second layer. With different combinations of the sawing lines and keep-out regions on the multi-layer substrate structure for cutting off some portions of the connection structure, the invention can achieve multiple arrangements of power/ground domains without impacting the customer's PCB or system board design so as to cut short the cycle time for engineering development phase.

Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.

Abstract: The present disclosure provides a light-emitting device, comprising: a light-emitting stack; a first semiconductor layer on the light-emitting stack; a first electrode formed on the first semiconductor layer and comprising an inner segment, an outer segment, and a plurality of extending segments electrically connecting the inner segment with the outer segment.

Abstract: A multi-layer circuit structure includes a differential transmission line pair and at least one conductive pattern. The differential transmission line pair includes first and second transmission lines disposed side by side. Each of the first and second transmission lines includes first and second segments connected to each other. An spacing between the two first segments is non-fixed, and an spacing between the two second segments is fixed. A first zone is located between the two first segments, a second zone is opposite to the first zone and located outside the first segment of the first transmission line, and a third zone is opposite to the first zone and located outside the first segment of the second transmission line. The conductive pattern is coplanar with the differential transmission line pair and disposed on at least one of the first, second and third zones.

Abstract: The present disclosure provides a light-emitting device, comprising: a light-emitting stack comprising an active layer, wherein the active layer is configured to emit light; a first semiconductor layer on the light-emitting stack; a first electrode formed on the first semiconductor layer and comprising an inner segment, an outer segment, and a plurality of extending segments electrically connecting the inner segment with the outer segment; and a light-absorbing layer having a first portion surrounding the first semiconductor layer in a top view.

Abstract: The present invention provides a method for evaluating oral health, in particularly for evaluating a risk for suffering from periodontal disease, comprising: (1) providing an oral sample of a subject; (2) detecting at least two indicator microbes in the oral sample; and (3) analyzing amounts of the at least two indicator microbes; wherein when each of the amounts of the at least two indicator microbes is higher than a standard value for an amount of a corresponding indicator microbe, it indicates that the subject has a high risk for suffering from periodontal disease.

Abstract: Aspects relate to systems and methods for dispensing paint uniformly on pliable items. The system comprises at least one paint application device having at least one nozzle, at least one infrared heating unit, and a conveyance mechanism. Other aspects of the system will also comprise a mask exchanger, a mask cleaner, and/or at least one base jig. The base jig retains a masked pliable item having exposed and covered portions. The base jig moves on a conveyance mechanism through a series of paint application devices and infrared heating units. Each paint application device dispenses a thin layer of paint on the exposed portions of the masked pliable item and each infrared heating unit heats the thin layer of paint to create a solid base for a next layer of paint.

Abstract: The present disclosure provides a light-emitting device, comprising: a light-emitting stack comprising an active layer, wherein the active layer is configured to emit light; a first semiconductor layer on the light-emitting stack; a first electrode formed on the first semiconductor layer and comprising an inner segment, an outer segment, and a plurality of extending segments electrically connecting the inner segment with the outer segment; and a light-absorbing layer having a first portion surrounding the first semiconductor layer in a top view.

Abstract: A detachable aerial photographic apparatus includes a carrier, an aircraft, a take-off delaying device and a trigger. The aircraft includes a main body disposed on the carrier, at least one propeller is pivotally furnished in the main body and a camera disposed on the main body. The take-off delaying device includes a movable member disposed on the carrier and at least one stopper connected to the movable member. The stopper is detachably connected to the aircraft for prevent the aircraft from taking off. The movable member is for detaching the stopper from the aircraft for releasing the aircraft. The trigger is electrically connected to the aircraft and the take-off delaying device. The trigger is for triggering the propeller and the movable member. A first time point when the propeller is triggered by the trigger is earlier than a second time point when the stopper is detached from the aircraft.

Abstract: The present disclosure provides a portable power tool. The power tool includes a tool body, a tool assembly and a gas pressure detection assembly. The tool assembly is furnished detachably in an end of the tool body. The gas pressure detection assembly is furnished detachably in another end of the tool body. The gas pressure is electrical coupled to the tool body.

Abstract: A light-emitting device is provided. The light-emitting device comprises: a light-emitting stack having an active layer; an electrode structure on the light-emitting stack and comprising a first electrode and an extension electrode protruding from the first electrode toward an edge of the light-emitting device in a first extending direction; a transparent insulating layer between the light-emitting stack and the electrode structure, wherein the transparent insulating layer comprises a first part and an extension part protruding from the first part toward the edge of the light-emitting device in a second extending direction; wherein a surface area of a surface of the first electrode distal from the transparent insulating layer is smaller than a surface area of a surface of the transparent insulating layer distal from the light-emitting stack, the first electrode is right above the first part, and a part of the extension electrode is right above the extension part.

Abstract: A light-emitting element includes a light-emitting structure, a plurality of first contact portions disposed separately on the light-emitting structure, and a plurality of reflective portions disposed separately among the first contact portions.

Abstract: A chip packaging structure including a substrate, at least one chip, a plurality of conductive bumps, and an electrically insulating and thermally conductive material is introduced. The chip is disposed on a chip carrier, and the chip carrier is disposed on the substrate. The conductive bumps are disposed between the substrate and the chip carrier to electrically connect the substrate and the chip. The electrically insulating and thermally conductive material is disposed around and between the conductive bumps and covers the conductive bumps. Additionally, a manufacturing method of the chip packaging structure is also provided.