Abstract: Structures and methods are provided for fabricating a ring oscillator including a plurality of stages. An example multi-layer structure includes a first device layer, a second device layer, and an inter-level connection structure. The first device layer includes a first transistor structure associated with a first stage of a ring oscillator. The second device layer is formed on the first device layer and includes a second transistor structure associated with a second stage of the ring oscillator. Further, the first inter-level connection structure includes one or more first conductive materials and is configured to electrically connect to the first transistor structure and the second transistor structure.

Abstract: A die stack comprises a first integrated circuit (IC) die having at least a first device comprising a first source, a first drain and a first gate electrode above a first channel region between the first source and the first drain. A second IC die has at least a second device comprising a second source, a second drain and a second gate electrode above a second channel region between the second source and the second drain. The second gate electrode is connected to the first gate electrode by a path including a first through substrate via (TSV), the second drain connected to the first source by a path including a second TSV.

Abstract: A die stack comprises a first integrated circuit (IC) die having at least a first device comprising a first source, a first drain and a first gate electrode above a first channel region between the first source and the first drain. A second IC die has at least a second device comprising a second source, a second drain and a second gate electrode above a second channel region between the second source and the second drain. The second gate electrode is connected to the first gate electrode by a path including a first through substrate via (TSV), the second drain connected to the first source by a path including a second TSV.

Abstract: A die stack comprises a first integrated circuit (IC) die having at least a first device comprising a first source, a first drain and a first gate electrode above a first channel region between the first source and the first drain. A second IC die has at least a second device comprising a second source, a second drain and a second gate electrode above a second channel region between the second source and the second drain. The second gate electrode is connected to the first gate electrode by a path including a first through substrate via (TSV), the second drain connected to the first source by a path including a second TSV.

Abstract: Structures and methods are provided for fabricating a ring oscillator including a plurality of stages. An example multi-layer structure includes a first device layer, a second device layer, and an inter-level connection structure. The first device layer includes a first transistor structure associated with a first stage of a ring oscillator. The second device layer is formed on the first device layer and includes a second transistor structure associated with a second stage of the ring oscillator. Further, the first inter-level connection structure includes one or more first conductive materials and is configured to electrically connect to the first transistor structure and the second transistor structure.

Abstract: A strobe calibration component for a memory control device includes a tri-state detection receiver, an edge detection component, and an extension gate generation component. The tri-state detection receiver is configured to identify states of an input signal. One of the states includes a high impedance state. The edge detection component is configured to identify valid edges from a sequence of states provided from the tri-state detection receiver. The extension gate generation component is configured to generate a calibrated gate signal according to the valid edges from the edge detection component.

Abstract: A system and method is disclosed for adaptively adjusting a driving strength of a signal between a first and second chip in a 3D architecture/stack. This may be used to adaptively calibrate a chip in a 3D architecture/stack. The system may include a transmission circuit on one chip and a receiver circuit on another chip. Alternatively, the system may include a transmission and receiver circuit on just one chip.

Abstract: A system and method is disclosed for adaptively adjusting a driving strength of a signal between a first and second chip in a 3D architecture/stack. This may be used to adaptively calibrate a chip in a 3D architecture/stack. The system may include a transmission circuit on one chip and a receiver circuit on another chip. Alternatively, the system may include a transmission and receiver circuit on just one chip.

Abstract: A level shifter for converting between voltages of a core voltage range to voltages within a larger I/O voltage range. The level shifter has interconnected transistors implemented as core devices operable within the core voltage range. The level shifter is connected to first and second power connections at the I/O voltage range. A voltage clamping element implemented as a core device has a threshold voltage greater than or equal to the difference between the I/O voltage range and the core voltage range and configured to prevent overstressing the transistors with voltages beyond the core voltage range. The input to the level shifter is within the core voltage range. The level shifter output signal has a high level at the high voltage of the I/O voltage range and a low level at approximately one threshold voltage above the low voltage level of the core voltage range.

Abstract: A built-in self-test (BIST) circuit for a liquid crystal display (LCD) source driver includes at least one digital-to-analog converter (DAC) and at least one buffer coupled to the respective DAC, wherein the buffer is reconfigurable as a comparator. A first input signal and a second input signal are coupled to the comparator. The first input signal is a predetermined reference voltage level. The second input signal is a test offset voltage in a test range.

Abstract: A post driver implemented using core device transistors to drive an output connection between the high and low voltage levels of an I/O voltage range. The post driver is made from a plurality of core devices operable within a core voltage range that is less than the I/O voltage range. The plurality of core devices is cascaded between upper and lower power connections set to the full I/O voltage range. The post driver has a voltage clamping element, such as a diode, having a predefined threshold voltage and connected to the core devices so as to maintain the voltage difference across the terminals thereof within the core voltage range.

Abstract: A strobe calibration component for a memory control device includes a tri-state detection receiver, an edge detection component, and an extension gate generation component. The tri-state detection receiver is configured to identify states of an input signal. One of the states includes a high impedance state. The edge detection component is configured to identify valid edges from a sequence of states provided from the tri-state detection receiver. The extension gate generation component is configured to generate a calibrated gate signal according to the valid edges from the edge detection component.

Abstract: Systems and methods are disclosed for aligning multiple data bits by adjusting the timing of input lines for those data bits. Embodiments include a hierarchical structure for comparing the timing of multiple sets of bits. Other embodiments include aligning data bits from multiple chips in a 3D die stacking architecture.

Abstract: A system and method is disclosed for adaptively adjusting a driving strength of a signal between a first and second chip in a 3D architecture/stack. This may be used to adaptively calibrate a chip in a 3D architecture/stack. The system may include a transmission circuit on one chip and a receiver circuit on another chip. Alternatively, the system may include a transmission and receiver circuit on just one chip.

Abstract: A circuit for reducing phase distortion of a first signal and a second signal is provided, wherein the first and the second signals are complementary. The circuit includes a detecting circuit for detecting a first edge of the first signal and a second edge of the second signal, wherein the second edge immediately follows the first edge and is in a same direction as the first edge; an output node; and a signal regenerator connected to the detecting circuit and the output node. The signal regenerator is configured to generate an output signal having an additional first edge and an additional second edge. The additional first edge and the additional second edge are opposite edges substantially aligned to the first edge and the second edge, respectively. The additional first edge and the additional second edge are immediate neighboring edges.

Abstract: A system and method for reducing density mismatch is disclosed. An embodiment comprises determining a conductor density and an active area density in a high density area and a low density area of a semiconductor device. Dummy material may be added to the low density area in order to raise the conductor density and the active area density, thereby reducing the internal density mismatches between the high density area and the low density area. Additionally, a similar process may be used to reduce external mismatches between different regions on the semiconductor substrate. Once these mismatches have been reduced, empty regions surrounding the different regions may additionally be filled in order to reduce the conductor density mismatch and the active area density mismatches.

Abstract: A built-in self-test (BIST) circuit for a liquid crystal display (LCD) source driver includes at least one digital-to-analog converter (DAC) and at least one buffer coupled to the respective DAC, wherein the buffer is reconfigurable as a comparator. A first input signal and a second input signal are coupled to the comparator. The first input signal is a predetermined reference voltage level. The second input signal is a test offset voltage in a test range.

Abstract: A circuit for reducing phase distortion of a first signal and a second signal is provided, wherein the first and the second signals are complementary. The circuit includes a detecting circuit for detecting a first edge of the first signal and a second edge of the second signal, wherein the second edge immediately follows the first edge and is in a same direction as the first edge; an output node; and a signal regenerator connected to the detecting circuit and the output node. The signal regenerator is configured to generate an output signal having an additional first edge and an additional second edge. The additional first edge and the additional second edge are opposite edges substantially aligned to the first edge and the second edge, respectively. The additional first edge and the additional second edge are immediate neighboring edges.

Abstract: An on-die calibration system includes an external reference component, a first and a second on-die adjustable components, and a calibration module coupled to the reference component, the first and second components, wherein the calibration module calibrates the first component according to the reference component and calibrates the second component according to the calibrated first component.

Abstract: Methods of clock and data recovery (CDR) are provided. An exemplary method comprises extending the eye of the data stream by examining transitions of adjacent samples, detecting whether an island sample exists in each symbol according to the separation of the transitions, and altering the value of the neighboring samples near the island sample to be equal to the island sample.