Heat dissipation device
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Description
FIG. 1 is a perspective view of a heat dissipation device of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a perspective view thereof being mounted to a VGA card which is shown in broken lines for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a heat dissipation device, as shown and described.
Referenced Cited
Patent History
Patent number: D509806
Type: Grant
Filed: Jul 16, 2004
Date of Patent: Sep 20, 2005
Assignee: Hon Hai Precision Industry Co., Ltd. (Taiwan)
Inventors: Hsieh-Kun Lee (Tu-Cheng), Xue-Wen Peng (Shenzhen), Rui-Hua Chen (Shenzhen)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Morris Manning & Martin
Application Number: 29/209,512
Type: Grant
Filed: Jul 16, 2004
Date of Patent: Sep 20, 2005
Assignee: Hon Hai Precision Industry Co., Ltd. (Taiwan)
Inventors: Hsieh-Kun Lee (Tu-Cheng), Xue-Wen Peng (Shenzhen), Rui-Hua Chen (Shenzhen)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Morris Manning & Martin
Application Number: 29/209,512
Classifications
Current U.S. Class:
Heat Sink (D13/179)