Heat dissipation device

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Description

FIG. 1 is a perspective view of a heat dissipation device of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view thereof being mounted to a VGA card which is shown in broken lines for illustrative purposes only and forms no part of the claimed design.

Claims

The ornamental design for a heat dissipation device, as shown and described.

Referenced Cited
U.S. Patent Documents
6373701 April 16, 2002 Lo
6411514 June 25, 2002 Hussaini
6547001 April 15, 2003 McCullough et al.
D484468 December 30, 2003 Lee et al.
D484854 January 6, 2004 Lee
D484855 January 6, 2004 Lee
D485241 January 13, 2004 Lee
Patent History
Patent number: D509806
Type: Grant
Filed: Jul 16, 2004
Date of Patent: Sep 20, 2005
Assignee: Hon Hai Precision Industry Co., Ltd. (Taiwan)
Inventors: Hsieh-Kun Lee (Tu-Cheng), Xue-Wen Peng (Shenzhen), Rui-Hua Chen (Shenzhen)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Morris Manning & Martin
Application Number: 29/209,512
Classifications
Current U.S. Class: Heat Sink (D13/179)