Patents by Inventor Rui Yu

Rui Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12706636
    Abstract: A near-field communication (NFC) chip, a phase synchronization method, and an electronic device related to the field of communication technologies are provided, to quickly synchronize a transmitted signal of an NFC card device with a carrier of an NFC card reader. The NFC chip includes a processing circuit configured to: determine a first carrier frequency offset between a local clock signal and a carrier clock signal, and generate a first frequency control word based on the first carrier frequency offset. The NFC chip further includes a phase-locked loop configured to generate a first clock signal based on the local clock signal and the first frequency control word. The NFC chip also includes a phase alignment circuit configured to perform phase selection on the first clock signal based on the carrier clock signal to obtain a second clock signal, and send the second clock signal to a transmitter circuit.
    Type: Grant
    Filed: December 8, 2023
    Date of Patent: August 11, 2026
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Rui Yu, Xuesong Chen, Supeng Liu, Lei Wang, Zhan Yu, Theng Tee Yeo
  • Patent number: 12670649
    Abstract: Methods, systems, mobile devices, and non-transitory computer-readable mediums for determining a scale of an object with a mobile device. The mobile device includes at least one object-facing camera (e.g., a monocular camera) and an away-facing stereo camera system. Information captured using the away-facing stereo camera system is used to estimate relative pose information for determining the scale of the object in images captured by the object-facing camera. The proposed system leverages the scene images surrounding the mobile device to resolve scale ambiguity and calculate the absolute scale.
    Type: Grant
    Filed: January 24, 2024
    Date of Patent: June 30, 2026
    Inventors: Gurunandan Krishnan Gorumkonda, Rui Yu, Yicheng Wu, Jian Wang, Sizhuo Ma
  • Publication number: 20250238994
    Abstract: Methods, systems, mobile devices, and non-transitory computer-readable mediums for determining a scale of an object with a mobile device. The mobile device includes at least one object-facing camera (e.g., a monocular camera) and an away-facing stereo camera system. Information captured using the away-facing stereo camera system is used to estimate relative pose information for determining the scale of the object in images captured by the object-facing camera. The proposed system leverages the scene images surrounding the mobile device to resolve scale ambiguity and calculate the absolute scale.
    Type: Application
    Filed: January 24, 2024
    Publication date: July 24, 2025
    Inventors: Gurunandan Krishnan Gorumkonda, Rui Yu, Yicheng Wu, Jian Wang, Sizhuo Ma
  • Publication number: 20250235410
    Abstract: A preparation method of water-soluble cannabidiol microcapsules and an application thereof are provided, belong to the field of biotechnology. The preparation method includes: adding galactose into an aqueous solution of whey protein isolate, adjusting a pH value, reacting, and cooling to obtain Maillard Reaction Products (MRPs) solution of whey protein isolate-galactose; adding an emulsifier into the MRPs solution, adjusting a pH value, high-speed shearing and stirring in the oil solution with cannabidiol (CBD) to obtain crude emulsion, and homogenizing the crude emulsion to obtain a Maillard Reaction Products-cannabidiol (MRPs-CBD) emulsion; and pre-freezing and vacuum freeze-drying the MRPs-CBD emulsion in turn to obtain the water-soluble cannabidiol microcapsules.
    Type: Application
    Filed: June 12, 2023
    Publication date: July 24, 2025
    Inventors: Zhanmei JIANG, Juncai HOU, Rui YU, Jiage MA, Hongyu LI
  • Patent number: 12324357
    Abstract: A voltage-controlled three-terminal magnon transistor is provided, including a ferroelectric layer, a magnetic layer, a generation terminal, a control terminal, a detection terminal, and a bottom electrode. After a current is inputted into the generation terminal, a magnon is generated in the magnetic layer. The detection terminal is made of a heavy metal material, which can convert the magnon in the magnetic layer into a charge flow. When a voltage pulse applied between the control terminal and the bottom electrode exceeds a critical value, non-volatile polarization and non-volatile strain states of the ferroelectric layer change, which in turn affects a transmission capability of the magnon in the magnetic layer based on a magnetoelectric coupling effect between the ferroelectric layer and the magnetic layer. In addition, a voltage signal of the detection terminal exhibits a regular loop change behavior with a change of the voltage pulse.
    Type: Grant
    Filed: November 7, 2023
    Date of Patent: June 3, 2025
    Assignee: Nanjing University
    Inventors: Haifeng Ding, Bingfeng Miao, Jun Cheng, Rui Yu, Liang Sun
  • Patent number: 12317437
    Abstract: A support device includes a support structure, a carrier assembly, and an elastic assembly. The carrier assembly is configured to support a display device. The carrier assembly ascends and descends relative to the support structure. The elastic assembly is connected to the support structure and the carrier assembly and provides different support forces to the carrier assembly to support display devices of different weights.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: May 27, 2025
    Assignee: LENOVO (BEIJING) LIMITED
    Inventors: Rui Yu, Baolin Liu
  • Publication number: 20250127062
    Abstract: A voltage-controlled three-terminal magnon transistor is provided, including a ferroelectric layer, a magnetic layer, a generation terminal, a control terminal, a detection terminal, and a bottom electrode. After a current is inputted into the generation terminal, a magnon is generated in the magnetic layer. The detection terminal is made of a heavy metal material, which can convert the magnon in the magnetic layer into a charge flow. When a voltage pulse applied between the control terminal and the bottom electrode exceeds a critical value, non-volatile polarization and non-volatile strain states of the ferroelectric layer change, which in turn affects a transmission capability of the magnon in the magnetic layer based on a magnetoelectric coupling effect between the ferroelectric layer and the magnetic layer. In addition, a voltage signal of the detection terminal exhibits a regular loop change behavior with a change of the voltage pulse.
    Type: Application
    Filed: November 7, 2023
    Publication date: April 17, 2025
    Applicant: Nanjing University
    Inventors: Haifeng DING, Bingfeng MIAO, Jun CHENG, Rui YU, Liang SUN
  • Patent number: 12132249
    Abstract: An antenna module includes: a first insulation medium substrate, including a first section provided with a first groove and a second section, where an integrated circuit is disposed in the first groove; a flexible substrate including a conductive structure, where the flexible substrate is stacked on the first insulation medium substrate, and a part that is of the flexible substrate and that is located between the first section and the second section is bendable; and an antenna structure, including a first metal structure that is disposed on the first section and that is connected to the conductive structure and the integrated circuit, and a second metal structure that is disposed on the second section and that is connected to the conductive structure. This avoids a warping problem caused by different thermal expansion coefficients of a plastic packaging material and a substrate, and reduces a risk of product failure.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: October 29, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Rui Yu, Hsiang Hui Chang, Wenping Jia
  • Publication number: 20240195454
    Abstract: A near-field communication (NFC) apparatus includes a clock extractor configured to perform clock recovery based on a first carrier signal sent by an NFC card reader to obtain a field clock signal; a digital phase-locked loop configured to perform frequency tracking on the field clock signal to output a first clock signal; a digital baseband chip configured to perform load modulation based on the first clock signal to generate a second carrier signal; and a controller configured to detect a frequency or a phase of the field clock signal, and selectively perform open-loop control on the digital phase-locked loop based on a detection result.
    Type: Application
    Filed: January 22, 2024
    Publication date: June 13, 2024
    Inventors: Rui Yu, Xuesong Chen, Supeng Liu, Lei Wang, Zhan Yu, Thengtee Yeo
  • Publication number: 20240153138
    Abstract: The embodiments of the present disclosure provide a method for positioning a target object. The method may include: determining an identification result by processing an image based on an identification model, wherein the identification result includes a first position of each of at least one target object in a first coordinate system; determining, from the image, a target image of each of the at least one target object based on the first position of each of the at least one target object in the first coordinate system; and determining, based on a first reference image and the target image of each of the at least one target object, a second position of each of the at least one target object in a second coordinate system, wherein the second position is configured to determine operation parameters of an operating device.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Applicant: ZHEJIANG HUARAY TECHNOLOGY CO., LTD.
    Inventors: Jing LI, Rui YU, Lu ZHOU
  • Publication number: 20240106497
    Abstract: The present disclosure relates to the field of communication technologies, and provide a near-field communication (NFC) chip, a phase synchronization method, and an electronic device, to quickly synchronize a transmitted signal of an NFC card device with a carrier of an NFC card reader. The NFC chip includes a processing circuit configured to: determine a first carrier frequency offset between a local clock signal and a carrier clock signal, and generate a first frequency control word based on the first carrier frequency offset. The carrier clock signal is determined based on a received signal received by the NFC chip. The NFC chip further includes a phase-locked loop configured to generate a first clock signal based on the local clock signal and the first frequency control word.
    Type: Application
    Filed: December 8, 2023
    Publication date: March 28, 2024
    Inventors: Rui YU, Xuesong CHEN, Supeng LIU, Lei WANG, Zhan YU, Theng Tee YEO
  • Publication number: 20230170602
    Abstract: An antenna module includes: a first insulation medium substrate, including a first section provided with a first groove and a second section, where an integrated circuit is disposed in the first groove; a flexible substrate including a conductive structure, where the flexible substrate is stacked on the first insulation medium substrate, and a part that is of the flexible substrate and that is located between the first section and the second section is bendable; and an antenna structure, including a first metal structure that is disposed on the first section and that is connected to the conductive structure and the integrated circuit, and a second metal structure that is disposed on the second section and that is connected to the conductive structure. This avoids a warping problem caused by different thermal expansion coefficients of a plastic packaging material and a substrate, and reduces a risk of product failure.
    Type: Application
    Filed: March 3, 2021
    Publication date: June 1, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Rui Yu, Hsiang Hui CHANG, Wenping Jia
  • Publication number: 20230171906
    Abstract: A support device includes a support structure, a carrier assembly, and an elastic assembly. The carrier assembly is configured to support a display device. The carrier assembly ascends and descends relative to the support structure. The elastic assembly is connected to the support structure and the carrier assembly and provides different support forces to the carrier assembly to support display devices of different weights.
    Type: Application
    Filed: November 30, 2022
    Publication date: June 1, 2023
    Inventors: Rui YU, Baolin LIU
  • Patent number: 11626657
    Abstract: The present disclosure provides an antenna packaging module and the making method. The antenna packaging module comprises a redistribution layer, an antenna structure, a semiconductor chip, a third packaging layer, and a packaging antenna connector to an external circuit board. The antenna structure includes a connector opening and at least a first antenna structure and a second antenna structure stacked on one surface of the redistribution layer. The packaging antenna connector is designed in the connector opening and is electrically connected to the redistribution layer. Electrical terminals are provided through the packaging antenna connector disposed in the connector opening, thus reducing the antenna signal loss. The antenna packaging module requires neither any metal wire ends electrically connected to redistribution layer, nor a flip-chip process.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: April 11, 2023
    Assignee: HAUWEI DEVICE CO., LTD
    Inventors: Chengtar Wu, Rui Yu, Chengchung Lin, Xianghui Zhang
  • Patent number: 11228089
    Abstract: The application describes an antenna packaging module for a semiconductor chip and a method for making it. The antenna packaging module comprises a redistribution layer, an antenna structure, a semiconductor chip, a metal bump, a third packaging layer and a packaging antenna connector. The antenna structure comprises a connector opening, a first antenna structure and a second antenna structure stacked on the second surface of the redistribution layer. The packaging antenna connector is disposed in the connector opening, and is electrically connected to the redistribution layer. Electrical interconnection of packaging an antenna connector in a connector opening in the packaging layer, the antenna signal loss is reduced, and the overall e advantage of WLP AiP is further improved.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: January 18, 2022
    Assignees: SJ Semiconductor (Jiangyin) Corporation, Hauwei Device Co., Ltd.
    Inventors: Chengtar Wu, Rui Yu, Chengchung Lin, Xianghui Zhang
  • Patent number: 11042126
    Abstract: A time-to-digital converter (TDC) is disclosed, which comprises a ring oscillator module and a digital error correction module. The ring oscillator module is configured to receive a sampling signal, an addressing signal, and a preset signal, and includes: a ring oscillator arranged with a plurality of inverters; a phase sampler configured to sample phase signals generated by the inverters for generating a first output signal; a counter clock generator configured to generate first and second clock signals; first and second counters configured to respectively generate first and second counter output signals; and a data sampler configured to sample the first and second counter output signals to respectively generate second and third output signals. The digital error correction module is arranged to process the first, second and third output signals for generating a digital signal.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: June 22, 2021
    Assignee: Huawei International Pte. Ltd.
    Inventors: Chao Yuan, Rui Yu, Xuesong Chen, Supeng Liu, Theng Tee Yeo
  • Publication number: 20210066784
    Abstract: The present disclosure provides an antenna packaging module and the making method. The antenna packaging module comprises a redistribution layer, an antenna structure, a semiconductor chip, a third packaging layer, and a packaging antenna connector to an external circuit board. The antenna structure includes a connector opening and at least a first antenna structure and a second antenna structure stacked on one surface of the redistribution layer. The packaging antenna connector is designed in the connector opening and is electrically connected to the redistribution layer. Electrical terminals are provided through the packaging antenna connector disposed in the connector opening, thus reducing the antenna signal loss. The antenna packaging module requires neither any metal wire ends electrically connected to redistribution layer, nor a flip-chip process.
    Type: Application
    Filed: July 22, 2020
    Publication date: March 4, 2021
    Inventors: Chengtar WU, Rui YU, Chengchung LIN, Xianghui ZHANG
  • Publication number: 20210066783
    Abstract: The application describes an antenna packaging module for a semiconductor chip and a method for making it. The antenna packaging module comprises a redistribution layer, an antenna structure, a semiconductor chip, a metal bump, a third packaging layer and a packaging antenna connector. The antenna structure comprises a connector opening, a first antenna structure and a second antenna structure stacked on the second surface of the redistribution layer. The packaging antenna connector is disposed in the connector opening, and is electrically connected to the redistribution layer. Electrical interconnection of packaging an antenna connector in a connector opening in the packaging layer, the antenna signal loss is reduced, and the overall e advantage of WLP AiP is further improved.
    Type: Application
    Filed: July 22, 2020
    Publication date: March 4, 2021
    Inventors: Chengtar WU, Rui YU, Chengchung LIN, Xianghui ZHANG
  • Patent number: 10911054
    Abstract: A digital-to-time converter (DTC) assisted all digital phase locked loop (ADPLL) circuit is disclosed, which comprises: a DTC error compensator arranged to receive a phase offset signal being a processed output from a time-to-digital converter (TDC) circuit, the phase offset signal includes a DTC error corresponding to a phase difference between a reference clock signal processed by a DTC circuit and a feedback clock signal derived from an output signal of the ADPLL circuit. The compensator is arranged to process the phase offset signal for generating a digital signal representative of the DTC error, which is provided as an output signal. Also, the output signal is arranged to be subtracted from the phase offset signal to obtain a phase rectified signal of the phase offset signal.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: February 2, 2021
    Assignee: Huawei International Pte. Ltd.
    Inventors: Theng Tee Yeo, Xuesong Chen, Rui Yu, Liu Supeng, Chao Yuan
  • Patent number: D961255
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: August 23, 2022
    Assignee: Dongguan Grand Dragon Sports Co., Ltd.
    Inventor: Rui Yu