Abstract: A network reachability solving algorithm based on formal verification, which abstractly models the network reachability problem, concretely models and refines it through semantic equivalence, and implements the network reachability solving algorithm through logical equivalence transformation. With the help of formal verification tools, the present disclosure ensures the correctness and logical completeness of the reachability solving algorithm through mathematical reasoning. Compared with traditional testing-based schemes, the present disclosure guarantees the correctness and effectiveness of the network reachability algorithm based on formal method.

Abstract: Onboard a machine adapted to move on one predetermined path, a database stores definition data of landmark objects along the path and associated to its 3D geographical coordinates and a capture block provides images of the scene in front of the machine. The capture block includes a teledetection block adapted to create an image from received echos and to calculate from the echoes, direction and distance, relative to the machine, of the echoing object.

Abstract: This application relates to the field of WLAN technologies, and in particular, to a null data physical layer protocol data unit transmitting method and an apparatus, and may be used in a wireless communication system that supports the 802.11be standard or the EHT standard. In the method, a first device transmits a sensing NDPA frame, where the sensing NDPA frame indicates to transmit an NDP; and then, the first device transmits the NDP, where the NDP is a first NDP or a second NDP. A physical layer version of the first NDP is different from a physical layer version of the second NDP. Correspondingly, a second device receives the sensing NDPA frame and the NDP from the first device.

Abstract: Embodiments of this application provide a measurement method, an apparatus, and a device. The embodiments may be applied to wireless local area network systems of the 802.11 series protocols such as 802.11be, Wi-Fi 7, EHT, Wi-Fi 8, 802.11bf, and sensing. The embodiments provide an approach of generating, by a first device, a sensing measurement setup request frame that includes first ranging indication information used to request a second device to perform ranging measurement in a sensing measurement process. The approach then sends, by the first device, the sensing measurement setup request frame to the second device.

Abstract: An antenna module includes: a first insulation medium substrate, including a first section provided with a first groove and a second section, where an integrated circuit is disposed in the first groove; a flexible substrate including a conductive structure, where the flexible substrate is stacked on the first insulation medium substrate, and a part that is of the flexible substrate and that is located between the first section and the second section is bendable; and an antenna structure, including a first metal structure that is disposed on the first section and that is connected to the conductive structure and the integrated circuit, and a second metal structure that is disposed on the second section and that is connected to the conductive structure. This avoids a warping problem caused by different thermal expansion coefficients of a plastic packaging material and a substrate, and reduces a risk of product failure.

Abstract: An operation method of electronic device, comprising providing a first panel, wherein the first panel comprises first substrate, first medium layer disposed on the first substrate, a first electrode layer disposed between the first substrate and the first medium layer, and a second electrode layer disposed between the first electrode layer and the first medium layer; providing a second panel overlapped with the first panel, providing an adhesive layer, wherein the first panel is attached to the second panel through the adhesive layer, and the first panel and the second panel present a mirror-symmetrical structure with the adhesive layer as the axis of symmetry; applying a first voltage to the first electrode layer; applying a second voltage to the second electrode layer; applying a third voltage to the first electrode layer.

Abstract: The present disclosure provides an electronic device including a first sensing unit, a first transistor coupled to the first sensing unit, a second transistor coupled to the first transistor, a second sensing unit, a third transistor coupled to the second sensing unit, a fourth transistor coupled to the third transistor, a first signal line coupled to the second transistor and the fourth transistor, and a power line coupled to the first transistor and the third transistor, in which the power line is disposed between the first sensing unit and the second sensing unit.

Abstract: A near-field communication (NFC) apparatus includes a clock extractor configured to perform clock recovery based on a first carrier signal sent by an NFC card reader to obtain a field clock signal; a digital phase-locked loop configured to perform frequency tracking on the field clock signal to output a first clock signal; a digital baseband chip configured to perform load modulation based on the first clock signal to generate a second carrier signal; and a controller configured to detect a frequency or a phase of the field clock signal, and selectively perform open-loop control on the digital phase-locked loop based on a detection result.

Abstract: The embodiments of the present disclosure provide a method for positioning a target object. The method may include: determining an identification result by processing an image based on an identification model, wherein the identification result includes a first position of each of at least one target object in a first coordinate system; determining, from the image, a target image of each of the at least one target object based on the first position of each of the at least one target object in the first coordinate system; and determining, based on a first reference image and the target image of each of the at least one target object, a second position of each of the at least one target object in a second coordinate system, wherein the second position is configured to determine operation parameters of an operating device.

Abstract: The present disclosure provides an electronic device including a first sensing circuit, a second sensing circuit and a power line. The first sensing circuit includes a first sensing unit and a first transistor, and a first end of the first sensing unit is coupled to a control end of the first transistor. The second sensing circuit includes a second sensing unit and a second transistor, and a first end of the second sensing unit is coupled to a control end of the second transistor. A first end of the first transistor and a first end of the second transistor are coupled to the power line.

Abstract: The present disclosure relates to the field of communication technologies, and provide a near-field communication (NFC) chip, a phase synchronization method, and an electronic device, to quickly synchronize a transmitted signal of an NFC card device with a carrier of an NFC card reader. The NFC chip includes a processing circuit configured to: determine a first carrier frequency offset between a local clock signal and a carrier clock signal, and generate a first frequency control word based on the first carrier frequency offset. The carrier clock signal is determined based on a received signal received by the NFC chip. The NFC chip further includes a phase-locked loop configured to generate a first clock signal based on the local clock signal and the first frequency control word.

Abstract: An electronic device including a first panel and a second panel overlapped with the first panel is provided. The first panel includes a substrate, a first medium layer, a first electrode layer and a second electrode layer. The first medium layer is disposed on the substrate. The first electrode layer is disposed between the substrate and the first medium layer. The second electrode layer is disposed between the first electrode layer and the first medium layer. A first voltage is applied to the first electrode layer, a second voltage is applied to the second electrode layer, and the first voltage is different from the second voltage.

Abstract: An antenna module includes: a first insulation medium substrate, including a first section provided with a first groove and a second section, where an integrated circuit is disposed in the first groove; a flexible substrate including a conductive structure, where the flexible substrate is stacked on the first insulation medium substrate, and a part that is of the flexible substrate and that is located between the first section and the second section is bendable; and an antenna structure, including a first metal structure that is disposed on the first section and that is connected to the conductive structure and the integrated circuit, and a second metal structure that is disposed on the second section and that is connected to the conductive structure. This avoids a warping problem caused by different thermal expansion coefficients of a plastic packaging material and a substrate, and reduces a risk of product failure.

Abstract: A support device includes a support structure, a carrier assembly, and an elastic assembly. The carrier assembly is configured to support a display device. The carrier assembly ascends and descends relative to the support structure. The elastic assembly is connected to the support structure and the carrier assembly and provides different support forces to the carrier assembly to support display devices of different weights.

Abstract: The present disclosure provides an electronic device including a first sensing circuit, a second sensing circuit and a power line. The first sensing circuit includes a first sensing unit and a first transistor, and a first end of the first sensing unit is coupled to a control end of the first transistor. The second sensing circuit includes a second sensing unit and a second transistor, and a first end of the second sensing unit is coupled to a control end of the second transistor. A first end of the first transistor and a first end of the second transistor are coupled to the power line.

Abstract: The present disclosure provides an antenna packaging module and the making method. The antenna packaging module comprises a redistribution layer, an antenna structure, a semiconductor chip, a third packaging layer, and a packaging antenna connector to an external circuit board. The antenna structure includes a connector opening and at least a first antenna structure and a second antenna structure stacked on one surface of the redistribution layer. The packaging antenna connector is designed in the connector opening and is electrically connected to the redistribution layer. Electrical terminals are provided through the packaging antenna connector disposed in the connector opening, thus reducing the antenna signal loss. The antenna packaging module requires neither any metal wire ends electrically connected to redistribution layer, nor a flip-chip process.

Abstract: An electronic device includes a substrate including an active area and a peripheral area adjacent to the active area; a plurality of spacers disposed in the active area and including a first spacer and a second spacer; a plurality of signal lines disposed on the substrate and extending along a first direction; a plurality of gate lines disposed on the substrate and extending along a second direction; and a gate driving unit disposed in the active area and including a receiving switch element and a buffer switch element, wherein the receiving switch element is disposed corresponding to the first spacer and receives an input signal through one of the signal lines, and the buffer switch element is disposed corresponding to the second spacer and is electrically connected to the receiving switch element, wherein the buffer switch element outputs a scan signal to one of the gate lines.

Abstract: The application describes an antenna packaging module for a semiconductor chip and a method for making it. The antenna packaging module comprises a redistribution layer, an antenna structure, a semiconductor chip, a metal bump, a third packaging layer and a packaging antenna connector. The antenna structure comprises a connector opening, a first antenna structure and a second antenna structure stacked on the second surface of the redistribution layer. The packaging antenna connector is disposed in the connector opening, and is electrically connected to the redistribution layer. Electrical interconnection of packaging an antenna connector in a connector opening in the packaging layer, the antenna signal loss is reduced, and the overall e advantage of WLP AiP is further improved.

Abstract: The present invention proposes an O-band silicon-based high-speed semiconductor laser diode for optical communication and its manufacturing method, by using different buffer layers to form the growth surface of InP material with low dislocation density; N—InAlGaAs is used instead of conventional N—InAlAs electron-blocking layer in the epi-structure to reduce the barrier for electrons to enter the quantum wells from N-type and lower the threshold; a superlattice structure quantum barrier is used instead of a single layer barrier structure to improve the transport of heavy holes in the quantum wells; and the material structure is adjusted to achieve a reliable O-band high direct modulation speed semiconductor laser diode for optical communication on silicon substrate.