Patents by Inventor Ryoichi Suzuki

Ryoichi Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10304752
    Abstract: An imaging unit comprising an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside. An imaging apparatus comprises an imaging unit that includes an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: May 28, 2019
    Assignee: NIKON CORPORATION
    Inventors: Hirofumi Arima, Ryoichi Suganuma, Takuya Sato, Satoru Suzuki
  • Publication number: 20190145914
    Abstract: An x-ray inspection device includes an x-ray irradiation unit that irradiates an object for inspection with an x-ray; a sensor that detects an electric signal corresponding to a back-scattered x-ray reflected off the object for inspection; a measurement unit that measures the object for inspection with reference to the electric signal output by the sensor; and a heavy metal plate having a pinhole that allows the back-scattered x-ray to pass therethrough, the pinhole forming an image of the back-scattered x-ray on the sensor.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 16, 2019
    Inventors: Hiroaki Miyoshi, Takeshi Fujiwara, Hidetoshi Kato, Ryoichi Suzuki
  • Patent number: 10249558
    Abstract: An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: April 2, 2019
    Assignee: NSK LTD.
    Inventors: Shigeru Shimakawa, Takashi Sunaga, Takaaki Sekine, Teruyoshi Kogure, Ryoichi Suzuki
  • Publication number: 20190092382
    Abstract: A motor control unit that is connected to a motor release switch which includes FETs and is disposed between an inverter and a motor, including: a control section to detect an assist state of the inverter, to turn-ON or turn-OFF a control of the inverter based on a detection result and to detect whether abnormality is existed or not; a motor rotational speed detecting section to detect a motor rotational speed; an energy calculating section to calculate an energy based on the motor rotational speed; a judging section to turn-OFF all of the FETs of the motor release switch when the energy is within an area of safety operation; and a state detecting section to detect whether abnormality is existed or not based on information from an abnormality detecting section that detects abnormality of the sensors and the inverter, wherein the control section turns-ON the control of the inverter when the state detecting section does not detect abnormality and turns-OFF the control of the inverter when the state detecting se
    Type: Application
    Filed: March 2, 2017
    Publication date: March 28, 2019
    Applicant: NSK LTD.
    Inventors: Teruyoshi KOGURE, Shigeru SHIMAKAWA, Shin KUMAGAI, Ryoichi SUZUKI
  • Publication number: 20190039159
    Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 7, 2019
    Inventors: Ryoichi Suzuki, Yasuji Kawashima, Tetuya Okuno, Shigeo Komine, Takashi Sugihara
  • Patent number: 10192818
    Abstract: An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: January 29, 2019
    Assignee: NSK LTD.
    Inventors: Shigeru Simakawa, Takashi Sunaga, Takaaki Sekine, Teruyoshi Kogure, Ryoichi Suzuki
  • Publication number: 20180376600
    Abstract: In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.
    Type: Application
    Filed: December 15, 2016
    Publication date: December 27, 2018
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Hideki NAKAMURA, Takashi NAUCHI, Toshihiko MUTSUJI, Ryoichi SUZUKI
  • Patent number: 10033735
    Abstract: A communication apparatus includes a first communication unit that transmits connection data of a second network to an electronic device by way of a first network, a second communication unit that communicates with the electronic device by way of the second network in accordance with the connection data transmitted by the first communication unit, a storage unit that stores identification data of the electronic device that communicates with the second communication unit, a determination unit that determines whether the electronic device is authorized to communicate by way of the first network based on the identification data of the electronic device stored in the storage unit, and an access control unit that prohibits the electronic device from accessing the communication apparatus by way of the second network when the determination unit determines that the electronic device is not authorized to communicate by way of the first network.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: July 24, 2018
    Assignee: Ricoh Company, Ltd.
    Inventor: Ryoichi Suzuki
  • Patent number: 10022748
    Abstract: According to one embodiment, a stencil mask includes a first opening and a second opening, the first opening is provided corresponding to a mark region in a template, the second opening is provided adjacent to the first opening, and the diameter of a circle circumscribing the second opening is smaller than the diameter of a circle circumscribing the first opening.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: July 17, 2018
    Assignee: Toshiba Memory Corporation
    Inventors: Masato Suzuki, Akiko Mimotogi, Yohko Komatsu, Ryoichi Suzuki, Kazuya Fukuhara
  • Patent number: 10018915
    Abstract: A pattern forming method includes forming a guide pattern on a substrate including first and second regions and applying a directed self-assembly material including a first and a second polymer portion to the substrate. The first region is irradiated with an energy beam. The substrate is subjected to a heating process after irradiation and the directed self-assembly material in the second region separates into a first polymer phase and a second polymer phase. The directed self-assembly material is removed from the first region after irradiation.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: July 10, 2018
    Assignee: Toshiba Memory Corporation
    Inventors: Kazuto Matsuki, Ryoichi Suzuki, Shinichi Ito, Seiji Morita
  • Patent number: 10015206
    Abstract: A network system includes a server and an apparatus connected to the server via a network. The server includes a connection information generation part configured to generate connection information including network connection information for a portable terminal connecting to the network and apparatus connection information including the IP address of the apparatus, and a connection information transmission part configured to transmit the connection information to the apparatus. The apparatus includes an image code display part configured to display an image code into which the connection information is converted, a request reception part configured to receive a job request specifying the IP address of the apparatus and transmitted from the portable terminal having decoded the image code and connected to the network using the network connection information, and a job execution part configured to execute a job based on the job request.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: July 3, 2018
    Assignee: Ricoh Company, Ltd.
    Inventor: Ryoichi Suzuki
  • Patent number: 9937582
    Abstract: A resistance welding device is provided with a moving distance measuring section for measuring distances between conductors to be joined before and after joining and evaluating joining quality based on the distances, and a projection including a base and a projecting surface is provided to the conductor to be connected in order to easily secure a distance between the conductors after the joining.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: April 10, 2018
    Assignee: NSK LTD.
    Inventors: Takashi Sunaga, Noboru Kaneko, Osamu Miyoshi, Ryoichi Suzuki
  • Publication number: 20170309555
    Abstract: [Problem] An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.
    Type: Application
    Filed: November 20, 2015
    Publication date: October 26, 2017
    Applicant: NSK LTD.
    Inventors: Shigeru SHIMAKAWA, Takashi SUNAGA, Takaaki SEKINE, Teruyoshi KOGURE, Ryoichi SUZUKI
  • Publication number: 20170309556
    Abstract: An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.
    Type: Application
    Filed: November 20, 2015
    Publication date: October 26, 2017
    Applicant: NSK Ltd.
    Inventors: Shigeru SHIMAKAWA, Takashi SUNAGA, Takaaki SEKINE, Teruyoshi KOGURE, Ryoichi SUZUKI
  • Publication number: 20170294374
    Abstract: An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape
    Type: Application
    Filed: November 20, 2015
    Publication date: October 12, 2017
    Applicant: NSK Ltd.
    Inventors: Shigeru SIMAKAWA, Takashi SUNAGA, Takaaki SEKINE, Teruyoshi KOGURE, Ryoichi SUZUKI
  • Patent number: 9765823
    Abstract: A guide member 48 includes a cylindrical portion 52 fitted to a front end of a pinion shaft 19 and extending on the side of an opposite yoke and a slit engagement plate 54 extending on the side of the pinion shaft 19 from a portion, on the side of the pinion shaft 19, of the cylindrical portion 52 and engaging with a slit 42 of a yoke 22, the cylindrical portion 52 being inserted first in a clamp portion 36 of the yoke 22 upon the yoke 22 being fitted to the pinion shaft 19, the yoke 22 being rotatably guided by the cylindrical portion 52.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: September 19, 2017
    Assignee: NSK Ltd.
    Inventors: Shuhei Ikeda, Ryoichi Suzuki, Makoto Nagasawa
  • Publication number: 20170178896
    Abstract: A pattern forming method includes forming a guide pattern on a substrate including first and second regions and applying a directed self-assembly material including a first and a second polymer portion to the substrate. The first region is irradiated with an energy beam. The substrate is subjected to a heating process after irradiation and the directed self-assembly material in the second region separates into a first polymer phase and a second polymer phase. The directed self-assembly material is removed from the first region after irradiation.
    Type: Application
    Filed: July 12, 2016
    Publication date: June 22, 2017
    Inventors: Kazuto MATSUKI, Ryoichi SUZUKI, Shinichi ITO, Seiji MORITA
  • Patent number: 9637159
    Abstract: A steering device which slides when an impulse load is applied. A steering device includes an inner column having a cylindrical shape and a first hole opened therein, an outer column having a cylindrical shape into which at least a part of the inner column is inserted and having a slit at one end thereof where the inner column is inserted, an outer column bracket to tighten the outer column along with a telescopic friction plate, an inner column bracket having a second hole opened therein and supported by the telescopic friction plate, a connection member that is a resinous member provided at a position straddling the first hole and the second hole and detachably connecting the inner column and the inner column bracket, and an inner plate that covers the inside of the first hole.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: May 2, 2017
    Assignee: NSK LTD.
    Inventors: Masaya Johta, Hideki Kojima, Wataru Hagiwara, Ryoichi Suzuki
  • Patent number: 9633967
    Abstract: To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: April 25, 2017
    Assignee: NSK Ltd.
    Inventors: Takashi Sunaga, Noboru Kaneko, Osamu Miyoshi, Ryoichi Suzuki
  • Patent number: 9623895
    Abstract: A steering device includes a cylindrical inner column, a cylindrical outer column, a column bracket, a tilt bolt, a lock member attached to the outer periphery of the tilt bolt, a first fixing mechanism, and a second fixing mechanism. The first fixing mechanism clamps the outer column by a pressing bracket in response to the rotation of an operation lever. The second fixing mechanism urges the lock member to the inner column in the tilt direction in response to the rotation of the operation lever. When the inner column moves toward a front side of a vehicle body in a state where the first fixing mechanism and the second fixing mechanism are fixed, the lock member separates from the tilt bolt.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: April 18, 2017
    Assignee: NSK LTD.
    Inventors: Masaya Johta, Daiki Orihara, Ryoichi Suzuki