Abstract: An x-ray inspection device includes an x-ray irradiation unit that irradiates an object for inspection with an x-ray; a sensor that detects an electric signal corresponding to a back-scattered x-ray reflected off the object for inspection; a measurement unit that measures the object for inspection with reference to the electric signal output by the sensor; and a heavy metal plate having a pinhole that allows the back-scattered x-ray to pass therethrough, the pinhole forming an image of the back-scattered x-ray on the sensor.

Abstract: An electric drive device and an electric power steering device that reduce temperature increase of a magnetic sensor are provided. The electric drive device includes: an electric motor; an electronic control device including a magnet at an anti-load side end of a shaft to control drive of the electric motor, and a circuit board on the anti-load side of the shaft on an extended line in an axial direction of the shaft; first coil wiring connecting the first coil groups of the electric motor to the circuit board; and second coil wiring connecting the second coil groups of the electric motor to the circuit board. Each of the first and second coil wiring includes a first portion projecting in a direction intersecting the axial direction of the shaft to the outside of the housing, and a second portion projecting outside the housing from the first portion toward the circuit board.

Abstract: A gas monitoring system includes at least one sensor device that detects gas and outputs a detection result; and a gateway that receives the detection result. The at least one sensor device includes a sensor module having a gas sensor that detects gas; an analog-to-digital (A/D) converter that processes the detection result outputted from the gas sensor; a communication module that communicates with the sensor module and transmits information processed by the A/D converter exteriorly of the at least one sensor device; a power source that is an electric power source of the sensor module; and a power source that is an electric power source of the communication module.

Abstract: A motor control unit that is connected to a motor release switch which includes FETs and is disposed between an inverter and a motor, including: a control section to detect an assist state of the inverter, to turn-ON or turn-OFF a control of the inverter based on a detection result and to detect whether abnormality is existed or not; a motor rotational speed detecting section to detect a motor rotational speed; an energy calculating section to calculate an energy based on the motor rotational speed; a judging section to turn-OFF all of the FETs of the motor release switch when the energy is within an area of safety operation; and a state detecting section to detect whether abnormality is existed or not based on information from an abnormality detecting section that detects abnormality of the sensors and the inverter, wherein the control section turns-ON the control of the inverter when the state detecting section does not detect abnormality and turns-OFF the control of the inverter when the state detecting se

Abstract: A template includes a base, and a protruding portion on the base and having a pattern on an upper surface thereof. A side wall of the protruding portion includes impurities at a surface of the side wall and inwardly of the side wall.

Abstract: A pattern-forming method includes forming a first film above a material to be processed, processing the first film into a pattern to be formed in the material to be processed, providing a second film on the first film and the material to be processed, supplying a precursor containing at least one of a metal material or a semiconductor material to the second film, removing the first film, and processing the material to be processed using the second film impregnated with at least one of the metal material and the semiconductor material, as a mask.

Abstract: An electronic part mounting heat-dissipating substrate which includes lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frame 110H is used for a large current signal and the thin lead frame 110L is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.

Abstract: An assembly structure of a sensor includes: a shaft; a housing including: a first cylindrical part; and a first annular plate that is an annular plate, an outer periphery of which is connected to an end of the first cylindrical part, and that is orthogonal to a rotation axis of the shaft; a magnet accommodated inside the first cylindrical part in a radial direction and fixed to an end of the shaft; a sensor configured to detect rotation of the magnet; and a holder that is fixed to the first annular plate and that holds the sensor such that the sensor is disposed at a predetermined position with respect to the magnet.

Abstract: An x-ray inspection device includes an x-ray irradiation unit that irradiates an object for inspection with an x-ray; a sensor that detects an electric signal corresponding to a back-scattered x-ray reflected off the object for inspection; a measurement unit that measures the object for inspection with reference to the electric signal output by the sensor; and a heavy metal plate having a pinhole that allows the back-scattered x-ray to pass therethrough, the pinhole forming an image of the back-scattered x-ray on the sensor.

Abstract: An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.

Abstract: A motor control unit that is connected to a motor release switch which includes FETs and is disposed between an inverter and a motor, including: a control section to detect an assist state of the inverter, to turn-ON or turn-OFF a control of the inverter based on a detection result and to detect whether abnormality is existed or not; a motor rotational speed detecting section to detect a motor rotational speed; an energy calculating section to calculate an energy based on the motor rotational speed; a judging section to turn-OFF all of the FETs of the motor release switch when the energy is within an area of safety operation; and a state detecting section to detect whether abnormality is existed or not based on information from an abnormality detecting section that detects abnormality of the sensors and the inverter, wherein the control section turns-ON the control of the inverter when the state detecting section does not detect abnormality and turns-OFF the control of the inverter when the state detecting se

Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

Abstract: An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape.

Abstract: In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.

Abstract: A communication apparatus includes a first communication unit that transmits connection data of a second network to an electronic device by way of a first network, a second communication unit that communicates with the electronic device by way of the second network in accordance with the connection data transmitted by the first communication unit, a storage unit that stores identification data of the electronic device that communicates with the second communication unit, a determination unit that determines whether the electronic device is authorized to communicate by way of the first network based on the identification data of the electronic device stored in the storage unit, and an access control unit that prohibits the electronic device from accessing the communication apparatus by way of the second network when the determination unit determines that the electronic device is not authorized to communicate by way of the first network.

Abstract: According to one embodiment, a stencil mask includes a first opening and a second opening, the first opening is provided corresponding to a mark region in a template, the second opening is provided adjacent to the first opening, and the diameter of a circle circumscribing the second opening is smaller than the diameter of a circle circumscribing the first opening.

Abstract: A pattern forming method includes forming a guide pattern on a substrate including first and second regions and applying a directed self-assembly material including a first and a second polymer portion to the substrate. The first region is irradiated with an energy beam. The substrate is subjected to a heating process after irradiation and the directed self-assembly material in the second region separates into a first polymer phase and a second polymer phase. The directed self-assembly material is removed from the first region after irradiation.

Abstract: A network system includes a server and an apparatus connected to the server via a network. The server includes a connection information generation part configured to generate connection information including network connection information for a portable terminal connecting to the network and apparatus connection information including the IP address of the apparatus, and a connection information transmission part configured to transmit the connection information to the apparatus. The apparatus includes an image code display part configured to display an image code into which the connection information is converted, a request reception part configured to receive a job request specifying the IP address of the apparatus and transmitted from the portable terminal having decoded the image code and connected to the network using the network connection information, and a job execution part configured to execute a job based on the job request.

Abstract: A resistance welding device is provided with a moving distance measuring section for measuring distances between conductors to be joined before and after joining and evaluating joining quality based on the distances, and a projection including a base and a projecting surface is provided to the conductor to be connected in order to easily secure a distance between the conductors after the joining.

Abstract: An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.