Abstract: With the blood pressure meter of the present invention, a pump unit is connected via a first fluid path to a fluid bladder. The first fluid path extends straight in the Z direction between the pump unit and the fluid bladder, sends air supplied from the pump unit to the fluid bladder or sends air inside of the fluid bladder to a valve.

Abstract: The purpose of the present invention is to provide a thermal flow-rate sensor that is capable of self-diagnosis. Provided is a thermal flow-rate sensor provided with a semiconductor element that detects a flow rate and that is equipped with electrode pads for electrical conduction with the outside, wherein at least two of the electrode pads are provided, and other electrode pads proximate to the electrode pads are arranged and have an electric potential beyond the scope of output to be used at the time of flow rate detection.

Abstract: A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.

Abstract: Provided is a thermal flow meter to improve the measurement accuracy of a temperature detector. The thermal flow meter includes a bypass passage through which a measurement target gas flowing through a main passage flows, and a circuit package which includes a measurement circuit for measuring a flow rate of the measurement target gas flowing through the bypass passage and a temperature detecting portion for detecting a temperature of the measurement target gas. The circuit package includes a circuit package body which is molded by a resin to internally envelope the measurement circuit and a protrusion molded by the resin. The temperature detecting portion is provided in the leading end portion of the protrusion, and at least the leading end portion of the protrusion protrudes to the outside from a housing.

Abstract: A thermal airflow sensor includes a sensor element, a bonding wire, a resin, and a protective film. The sensor element has a thin-wall portion. The thin-wall portion has a heating resistor. The bonding wire is electrically connected to the sensor element. The resin covers the bonding wire. The protective film is formed on a surface of the sensor element so that the heating resistor is exposed. The protective film has at least a slit between the resin and the thin-wall portion.

Abstract: The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

Abstract: A bodily information measurement apparatus includes a band-shaped belt to be wrapped around a measurement site; a main body that is connected to a base end portion in the lengthwise direction of the belt and on which a pressure detection unit and a fluid supply unit are mounted; and a fastening unit for fastening the base end portion and the leading end portion of the belt. The belt is formed by stacking an outer circumferential layer and a fluid bladder for compressing the measurement site. The bodily information measurement apparatus is attached to the measurement site due to the base end portion and the leading end portion being fastened by the fastening portion in a state in which the fluid bladder and the leading end portion of the belt overlap.

Abstract: A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.

Abstract: The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

Abstract: A thermal flow sensor with improved measurement accuracy is provided. The thermal flow sensor includes: an air flow rate detection element with a diaphragm having a thin-film portion in a semiconductor substrate; at least one heat generating resistor on the diaphragm; at least one temperature measuring resistor that detects temperature on each of an upstream side and a downstream side of the heat generating resistor; and a correction circuit portion that processes an output signal of the air flow rate detection element on the basis of temperature difference information of at least the two temperature measuring resistors on the upstream side and the downstream side, wherein a waveform of the output signal processed by the correction circuit portion is a waveform obtained by cutting a part of a mountain part or a valley part constituting a peak value by outputting of an arbitrary predetermined value when the peak value of the waveform exceeds the arbitrary predetermined value.

Abstract: A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.

Abstract: A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.

Abstract: In order to provide a flow measuring device high in thermal responsiveness, the flow measuring device includes a temperature detecting element 2 for temperature detection, and a conductive metal lead frame 3 that supports and fixes the temperature detecting element. Of the metal lead frame, a part of the metal lead frame mounted with the temperature detecting element has a portion which is thinner than the thickness of the other metal lead frame or narrower than the width of the other metal lead frame.

Abstract: In a conventional air flow meter, in the case of foreign matter having a large particle diameter, the inertia thereof is used as a measure to prevent contact with a detection element, but for foreign matter having a particle diameter of 10 ?m or less and an extremely small mass, the inertia thereof inside a bypass structure has almost no effect, and the foreign matter can adhere to the detection element. AC dust or the like defined by the SAE standard J726C in the U.S. being mainly cited an example of the abovementioned foreign matter having a particle diameter of 10 ?m or less and an extremely small mass, it is known that sand (dust) manufactured by refining Arizona desert sand is readily charged, and once dust having an extremely small particle diameter that has become electrostatically charged adheres to a detection element, the problem arises that the dust is difficult to eliminate, due to the Coulomb force thereof.

Abstract: An appliance includes a belt that is worn by being wound around a wrist. The appliance includes: at least a first display region that is positioned in an area of the belt that corresponds to a volar-side surface or a radius-side surface of the wrist; and a second display region that is positioned in an area of the belt that corresponds to a back-side surface of the wrist. During a blood pressure measurement period, first control for displaying ongoing blood pressure measurement information only on the first display region is performed, and during a period other than the blood pressure measurement period, second control for displaying information that needs to be displayed on the first or second display region is performed.

Abstract: A bodily information measurement apparatus includes a band-shaped belt to be wrapped around a measurement site; a main body that is connected to a base end portion in the lengthwise direction of the belt and on which a pressure detection unit and a fluid supply unit are mounted; and a fastening unit for fastening the base end portion and the leading end portion of the belt. The belt is formed by stacking an outer circumferential layer and a fluid bladder for compressing the measurement site. The bodily information measurement apparatus is attached to the measurement site due to the base end portion and the leading end portion being fastened by the fastening portion in a state in which the fluid bladder and the leading end portion of the belt overlap.

Abstract: A blood pressure monitor cuff is formed by stacking an outer circumferential layer arranged on a side opposite to that of a measurement site and a fluid bladder arranged on the measurement site side. The outer circumferential layer and the fluid bladder are formed of an elastomer material. Two edge portions in a lengthwise direction of the outer circumferential layer protrude in a thickness direction toward the measurement site. The fluid bladder includes a base layer that opposes the outer circumferential layer and a top layer overlapping with the base layer, and the edge portions of the base layer and the top layer are welded together forming a bladder shape. Additional sheets are welded in the thickness direction to the welded edge portions of the top layer and the base layer. The fluid bladder is arranged between the two edge portions of the outer circumferential layer in the width direction.

Abstract: A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.

Abstract: A fluid bladder has a first fluid bladder region that inflates due to receiving a supply of fluid and is contained in a portion of an outer circumferential surface of a measurement site in a lengthwise direction of a cuff, the portion corresponding to a first half surface, where an artery is. Also, the fluid bladder has an expansion region that is expanded due to an action from outside, and is contained at a portion of the outer circumferential surface of the measurement site that corresponds to a second half surface, in the lengthwise direction of the cuff. During inflation for blood pressure measurement, a stroke amount by which the expansion region expands is larger in the thickness direction than a stroke amount by which the first fluid bladder region swells.

Abstract: A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.