Abstract: The present invention provides a thermal flow meter 300 which reduces a stress applied from a fixing portion 3721, which is used to hold and fix a circuit package 400 with respect to a housing 302, to the circuit package 400 and has high reliability. In the thermal flow meter of the invention, the circuit package 400 embedded with a flow rate measurement circuit is formed through a first resin molding process, the fixing portion 3721 is formed along with the housing 302 through a second resin molding process, and the circuit package 400 is enveloped by the fixing portion 3721, whereby the circuit package 400 is held by and fixed to the housing 302. In order to reduce the influence of a stress, generated based on a temperature change of the fixing portion 3721, on the circuit package 400, the fixing portion 3721 is constituted of a thick portion 4714 and a thin portion 4710.

Abstract: The purpose of the present invention is to provide a thermal flow-rate sensor that is capable of self-diagnosis. Provided is a thermal flow-rate sensor provided with a semiconductor element that detects a flow rate and that is equipped with electrode pads for electrical conduction with the outside, wherein at least two of the electrode pads are provided, and other electrode pads proximate to the electrode pads are arranged and have an electric potential beyond the scope of output to be used at the time of flow rate detection.

Abstract: Provided is a thermal flow meter to improve the measurement accuracy of a temperature detector provided in a thermal flow meter. The thermal flow meter includes a bypass passage through which a measurement target gas 30 flowing through a main passage flows, and a circuit package 400 which includes a measurement circuit for measuring a flow rate of the measurement target gas 30 flowing through the bypass passage and a temperature detecting portion 452 for detecting a temperature of the measurement target gas. The circuit package 400 includes a circuit package body which is molded by a resin to internally envelope the measurement circuit and a protrusion 424 molded by the resin. The temperature detecting portion 452 is provided in the leading end portion of the protrusion 424, and at least the leading end portion of the protrusion protrudes to the outside from a housing 302.

Abstract: A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.

Abstract: Provided is a thermal flow meter that can be prevented from being eroded due to adhesion of water or like to a cut end portion of the lead exposed from the mold resin of the circuit package. A thermal flow meter 300 of the present invention is a thermal flow meter having a circuit package 400 formed by mounting a detection element 518 on leads 544 and 545 supported by a support frame 512, sealing with a mold resin, and cutting off the support frame 512, wherein cut end portions 544a and 545a of the leads 544 and 545 exposed from the mold resin of the circuit package 400 by cutting off the support frame 512 is covered by a covering portion 371.

Abstract: A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.

Abstract: An object of the present invention is to improve the reliability of a product in which a semiconductor device is partially exposed when sealed with resin. In achieving the above object and according to this invention, there is provided a thermal airflow sensor including: a semiconductor substrate having a thin-wall portion, a heating resistor provided over the thin-wall portion, and resistance temperature detectors installed upstream and downstream of the heating resistor; a protective film provided over the semiconductor substrate; and a resin that seals the semiconductor substrate, the resin further including an exposure portion for partially exposing an area including the thin-wall portion. The protective film is provided in a manner seamlessly enclosing the heating resistor, the protective film having an outer peripheral edge located outside the thin-wall portion and over the exposure portion.

Abstract: In order to provide a thermal-type flowmeter highly accurate, with high reliability, and simple in construction, while being available at a lower price, a thermal-type flowmeter as proposed includes a sub-path that takes in a fluid under measurement; a sensor element that measures a flow-rate of the fluid under measurement in the sub-path; a temperature detection element that detects a temperature of the fluid under measurement; a drive circuit that controls a heating temperature of the sensor element; and a protection circuit that protects the drive circuit from noise, a cavity being formed on a substrate of the sensor element, an exothermic resistor being provided on a thin-film part on the cavity through the intermediary of an electrically insulating film, and a flow rate being detected on the basis of temperature distribution in the thin-film part.

Abstract: A flow rate measuring device with high precision is provided. The flow rate measuring device includes a sub-passage that takes a part of the fluid flowing in a main passage, first temperature measuring means for measuring a temperature of the fluid flowing in the passage, second temperature measuring means for measuring a temperature of a fluid flowing in the sub-passage, detecting means for detecting a flow rate of the fluid flowing in the sub-passage, and measuring means for measuring a flow rate of the fluid flowing within the main channel on the basis of an output of the first temperature measuring means, an output of the second temperature measuring means, and an output of the detecting means.

Abstract: An airflow measuring apparatus includes a sub-passage that takes in part of flow of fluid flowing through an intake pipe, a sensor element disposed in the sub-passage to measure the flow of fluid, a circuit part converting the flow of fluid detected by the sensor element into an electric signal, a connector part connected to the circuit part to output a signal externally, and a casing supporting the sensor element and the circuit part. The sensor element is disposed in the intake pipe, and includes a cavity disposed at a semiconductor substrate and a diaphragm including a thin film part that covers the cavity. The sensor element on a lead frame has surfaces that are mold-packaged with resin so that the diaphragm and part of the lead frame are exposed. One hole is disposed at the lead frame for communication between the cavity and exterior.

Abstract: A first oscillation circuit and a second oscillation circuit are connected to a first pressure sensor and a second pressure sensor, respectively, and oscillate based on the capacity values of the corresponding pressure sensors. The first oscillation circuit and the second oscillation circuit operate in response to instruction from a CPU. The one of the first oscillation circuit and the second oscillation circuit that has received an activation signal from the CPU outputs a signal having a frequency that corresponds to the capacity value of the corresponding pressure sensor. An adjustment circuit is connected to the first oscillation circuit and the second oscillation circuit, and allows one of the frequency signals to pass therethrough, outputting the signal to the CPU.

Abstract: A thermal flow sensor with improved measurement accuracy is provided. The thermal flow sensor includes: an air flow rate detection element with a diaphragm having a thin-film portion in a semiconductor substrate; at least one heat generating resistor on the diaphragm; at least one temperature measuring resistor that detects temperature on each of an upstream side and a downstream side of the heat generating resistor; and a correction circuit portion that processes an output signal of the air flow rate detection element on the basis of temperature difference information of at least the two temperature measuring resistors on the upstream side and the downstream side, wherein a waveform of the output signal processed by the correction circuit portion is a waveform obtained by cutting a part of a mountain part or a valley part constituting a peak value by outputting of an arbitrary predetermined value when the peak value of the waveform exceeds the arbitrary predetermined value.

Abstract: Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.

Abstract: In an electronic sphygmomanometer, the thickness of the second connection tube is set to be lower than the thickness of the first connection tube, and therefore, even if error has occurred in the structural dimensions of the pressure sensor air tube, the error can be absorbed as a result of the second connection tube extending/contracting. It is therefore possible to provide an electronic sphygmomanometer that includes, in a structure in which a pressure sensor used in the electronic sphygmomanometer is disposed, a peripheral structure for the pressure sensor that can improve the reliability of blood pressure measurement values.

Abstract: It is an object of the present invention to improve a measurement accuracy of a thermal flow meter. A circuit package 401 is such that a measurement surface 430 and a backside of measurement surface 431 of a rear surface thereof are located in a bypass passage, and the bypass passage is configured to allow a measurement target gas 30 to flow upon dividing the measurement target gas 30 into a flow path 386 at a side of the measurement surface 430 of the circuit package and a flow path 387 at a side of the backside of measurement surface 431 of a rear surface of the measurement surface 430, and an inflow-side end surface of the circuit package for dividing the measurement target gas 30 has different shapes at the side of the measurement surface and at the side of the backside of measurement surface.

Abstract: An object of the present invention is to improve the reliability of a product in which a semiconductor device is partially exposed when sealed with resin. In achieving the above object and according to this invention, there is provided a thermal airflow sensor including: a semiconductor substrate having a thin-wall portion, a heating resistor provided over the thin-wall portion, and resistance temperature detectors installed upstream and downstream of the heating resistor; a protective film provided over the semiconductor substrate; and a resin that seals the semiconductor substrate, the resin further including an exposure portion for partially exposing an area including the thin-wall portion. The protective film is provided in a manner seamlessly enclosing the heating resistor, the protective film having an outer peripheral edge located outside the thin-wall portion and over the exposure portion.

Abstract: In an electronic sphygmomanometer, a first pressure sensor and a second pressure sensor are disposed on a front surface side that serves as a first main surface of an internal circuit board, following a horizontal direction (the X direction) that is orthogonal to the direction in which the internal circuit board is sloped. As a result, the first pressure sensor and the second pressure sensor are disposed having the same height position. It is therefore possible to provide an electronic sphygmomanometer that includes, as a structure in which a pressure sensor used in the electronic sphygmomanometer is disposed, a peripheral structure for the pressure sensor that can improve the reliability of blood pressure measurement values.

Abstract: In order to provide a thermal flow meter (300) for improving workability of a flow rate measurement device having a temperature measurement function for the measurement target gas (30) and measurement accuracy for measuring a temperature, the thermal flow meter is structured such that a flow rate measurement circuit package (400) having a protrusion (424) for measuring a gas temperature is formed through resin molding, an inlet port (343) opened to the upstream side of the measurement target gas (30) is formed, a protrusion (424) is arranged inside the inlet port, an inlet port (344) and an outlet port (345) are formed in the front and rear covers (303 and 304) along the protrusion (424), and the measurement target gas (30) received from the inlet port (343) flows along the protrusion (424). Since the measurement target gas (30) subjected to the measurement flows along the protrusion (424), it is possible to reduce influence of the heat from other heat resources and improve measurement accuracy.

Abstract: Provided is a thermal flow meter that can be prevented from being eroded due to adhesion of water or like to a cut end portion of the lead exposed from the mold resin of the circuit package. A thermal flow meter 300 of the present invention is a thermal flow meter having a circuit package 400 formed by mounting a detection element 518 on leads 544 and 545 supported by a support frame 512, sealing with a mold resin, and cutting off the support frame 512, wherein cut end portions 544a and 545a of the leads 544 and 545 exposed from the mold resin of the circuit package 400 by cutting off the support frame 512 is covered by a covering portion 371.

Abstract: The present invention provides a thermal flow meter which can suppress a degradation of measurement accuracy caused by deformation of a diaphragm and a stained rear surface thereof even in a case where a gap is provided in order to form the diaphragm in an air flow sensing element. The present invention relates to a thermal flow meter 300 which includes a bypass passage through which a measurement target gas 30 received from a main passage 124 flows, and an air flow sensing element which measures a flow rate of the measurement target gas 30 by performing heat transfer with the measurement target gas 30 flowing through the bypass passage. The thermal flow meter 300 includes at least a circuit package 400 which contains the air flow sensing element 602. A gap 674 is formed in a rear surface of the air flow sensing element 602 to form a diaphragm 672 in an air flow sensing area 437 of the air flow sensing element 602, and the gap 674 becomes a sealed space reduced in pressure compared to an atmospheric pressure.