Abstract: A cleaning member for use in an image forming apparatus and configured to be inserted into the apparatus, the apparatus comprising a holding body that holds a substrate and lenses, the cleaning member comprising a rod, a cleaning portion provided in the rod to clean a light emission surface of each lens, a magnet attached to the rod, the magnet emitting a magnetic field to generates a magnetic force to draw the holding body thereto so that the cleaning portion maintains contact with the light emission surface, a yoke member attached to the rod and in contact with the magnet. The yoke member is configured to protrude, with respect to the magnet, towards a side on which the holding body is disposed, and a contact portion that is configured to contact the holding body and that to protrude, with respect to the yoke member, towards the above side.

Abstract: A cleaning member that is used in an image forming apparatus and that is inserted from outside the image forming apparatus, the apparatus including a holding body that holds a substrate on which light emitting elements that expose a photosensitive drum are aligned and that holds lenses, the cleaning member including a rod-shaped rhabdoid formed of resin, a cleaning portion provided in the rhabdoid to clean a light emission surface of each lens, the cleaning portion moving together with the rhabdoid inserted in the image forming apparatus and opposing the light emission surface in an optical axis direction of the lens, and a magnet provided on the rhabdoid, the magnet emitting magnetic force that generates force drawing the holding body thereto so that the cleaning portion continues to contact the light emission surface.

Abstract: A cleaning member for use in an image forming apparatus and configured to be inserted into the apparatus, the apparatus comprising a holding body that holds a substrate and lenses, the cleaning member comprising a rod, a cleaning portion provided in the rod to clean a light emission surface of each lens, a magnet attached to the rod, the magnet emitting a magnetic field to generates a magnetic force to draw the holding body thereto so that the cleaning portion maintains contact with the light emission surface, a yoke member attached to the rod and in contact with the magnet. The yoke member is configured to protrude, with respect to the magnet, towards a side on which the holding body is disposed, and a contact portion that is configured to contact the holding body and that to protrude, with respect to the yoke member, towards the above side.

Abstract: A tubular cable interconnect unit arranged on an outer periphery of a joint of a power cable, includes a tubular insulating tube, a non-ohmic resistor layer formed from a non-ohmic composition and provided on an inner peripheral surface of the insulating tube, and an inner semiconductive layer provided on the non-ohmic resistor layer, wherein the non-ohmic composition includes a base polymer including at least one of thermoplastic and rubber, and varistor grains having a non-ohmic characteristic in which a volume resistivity varies non-linearly with respect to an applied voltage, and the varistor grains have a maximum grain diameter of 30 ?m or less.

Abstract: A potential of a gate of a driving transistor is fixed, and the driving transistor is operated in a saturation region, so that a current is supplied thereto anytime. A current control transistor operating in a linear region is disposed serially with the driving transistor, and a video signal for transmitting a signal of emission or non-emission of the pixel is input to a gate of the current control transistor via a switching transistor.

Abstract: A heat-shrinkable tube or heat-shrinkable cap includes an adhesive layer disposed on the inner surface thereof, the adhesive layer including a low-viscosity adhesive layer formed of a resin having a viscosity of 10 Pa·s or less at a shear rate of 1 s?1 at the heat shrinkage temperature and a viscosity of 100 Pa·s or more at a shear rate of 1 s?1 at the maximum continuous use temperature. The heat-shrinkable tube or heat-shrinkable cap is used for waterproofing an exposed portion of electrical wires of an electrical wire bundle such as a wire harness, in which merely by placing the heat-shrinkable tube or heat-shrinkable cap over the exposed portion of electrical wires, waterproofing and water blocking between strands can be achieved, and outflow of the resin during heat shrinking does not occur. A method of waterproofing an electrical wire bundle uses the heat-shrinkable tube or heat-shrinkable cap.

Abstract: A heat-recoverable component includes a tube-shaped or cap-shaped base material layer having heat shrinkability, and an adhesive layer formed on an inner circumferential surface of the base material layer. The adhesive layer includes a low-viscosity adhesive portion and a high-viscosity adhesive portion disposed between the low-viscosity adhesive portion and an opening of the base material layer. The low-viscosity adhesive portion has a shear viscosity of 10 Pa·s or less at a shear rate of 1 s?1 at a heat shrinkage temperature of the base material layer. The high-viscosity adhesive portion has a shear viscosity of 100 Pa·s or more at a shear rate of 1 s?1 at the heat shrinkage temperature of the base material layer. At the heat shrinkage temperature, a ratio of the shear viscosity of the high-viscosity adhesive portion to the shear viscosity of the low-viscosity adhesive portion is 15,000 or less.

Abstract: A heat-recoverable component includes a tube-shaped or cap-shaped base material layer having heat shrinkability, and an adhesive layer formed on an inner circumferential surface of the base material layer. The adhesive layer includes a low-viscosity adhesive portion and a high-viscosity adhesive portion disposed between the low-viscosity adhesive portion and an opening of the base material layer. The low-viscosity adhesive portion has a shear viscosity of 10 Pa·s or less at a shear rate of 1 s?1 at a heat shrinkage temperature of the base material layer. The high-viscosity adhesive portion has a shear viscosity of 100 Pa·s or more at a shear rate of 1 s?1 at the heat shrinkage temperature of the base material layer. At the heat shrinkage temperature, a ratio of the shear viscosity of the high-viscosity adhesive portion to the shear viscosity of the low-viscosity adhesive portion is 15,000 or less.

Abstract: Semiconductor elements deteriorate or are destroyed due to electrostatic discharge damage. The present invention provides a semiconductor device in which a protecting means is formed in each pixel. The protecting means is provided with one or a plurality of elements selected from the group consisting of resistor elements, capacitor elements, and rectifying elements. Sudden changes in the electric potential of a source electrode or a drain electrode of a transistor due to electric charge that builds up in a pixel electrode is relieved by disposing the protecting means between the pixel electrode of the light-emitting element and the source electrode or the drain electrode of the transistor. Deterioration or destruction of the semiconductor element due to electrostatic discharge damage is thus prevented.

Abstract: Semiconductor elements deteriorate or are destroyed due to electrostatic discharge damage. The present invention provides a semiconductor device in which a protecting means is formed in each pixel. The protecting means is provided with one or a plurality of elements selected from the group consisting of resistor elements, capacitor elements, and rectifying elements. Sudden changes in the electric potential of a source electrode or a drain electrode of a transistor due to electric charge that builds up in a pixel electrode is relieved by disposing the protecting means between the pixel electrode of the light-emitting element and the source electrode or the drain electrode of the transistor. Deterioration or destruction of the semiconductor element due to electrostatic discharge damage is thus prevented.

Abstract: A heat-recoverable component includes a tube-shaped or cap-shaped base material layer having heat shrinkability, and an adhesive layer formed on an inner circumferential surface of the base material layer. The adhesive layer includes a low-viscosity adhesive portion and a high-viscosity adhesive portion disposed between the low-viscosity adhesive portion and an opening of the base material layer. The low-viscosity adhesive portion has a shear viscosity of 10 Pa·s or less at a shear rate of 1 s?1 at a heat shrinkage temperature of the base material layer. The high-viscosity adhesive portion has a shear viscosity of 100 Pa·s or more at a shear rate of 1 s?1 at the heat shrinkage temperature of the base material layer. At the heat shrinkage temperature, a ratio of the shear viscosity of the high-viscosity adhesive portion to the shear viscosity of the low-viscosity adhesive portion is 15,000 or less.

Abstract: A potential of a gate of a driving transistor is fixed, and the driving transistor is operated in a saturation region, so that a current is supplied thereto anytime. A current control transistor operating in a linear region is disposed serially with the driving transistor, and a video signal for transmitting a signal of emission or non-emission of the pixel is input to a gate of the current control transistor via a switching transistor.

Abstract: Semiconductor elements deteriorate or are destroyed due to electrostatic discharge damage. The present invention provides a semiconductor device in which a protecting means is formed in each pixel. The protecting means is provided with one or a plurality of elements selected from the group consisting of resistor elements, capacitor elements, and rectifying elements. Sudden changes in the electric potential of a source electrode or a drain electrode of a transistor due to electric charge that builds up in a pixel electrode is relieved by disposing the protecting means between the pixel electrode of the light-emitting element and the source electrode or the drain electrode of the transistor. Deterioration or destruction of the semiconductor element due to electrostatic discharge damage is thus prevented.

Abstract: A heat-shrinkable tube or heat-shrinkable cap includes an adhesive layer disposed on the inner surface thereof, the adhesive layer including a low-viscosity adhesive layer formed of a resin having a viscosity of 10 Pa·s or less at a shear rate of 1 s?1 at the heat shrinkage temperature and a viscosity of 100 Pa·s or more at a shear rate of 1 s?1 at the maximum continuous use temperature. The heat-shrinkable tube or heat-shrinkable cap is used for waterproofing an exposed portion of electrical wires of an electrical wire bundle such as a wire harness, in which merely by placing the heat-shrinkable tube or heat-shrinkable cap over the exposed portion of electrical wires, waterproofing and water blocking between strands can be achieved, and outflow of the resin during heat shrinking does not occur. A method of waterproofing an electrical wire bundle uses the heat-shrinkable tube or heat-shrinkable cap.

Abstract: A potential of a gate of a driving transistor is fixed, and the driving transistor is operated in a saturation region, so that a current is supplied thereto anytime. A current control transistor operating in a linear region is disposed serially with the driving transistor, and a video signal for transmitting a signal of emission or non-emission of the pixel is input to a gate of the current control transistor via a switching transistor.

Abstract: It is an object of the present invention to provide a heat-recoverable article which heat-shrinks in an appropriate temperature range, in which the occurrence of bloom and bleeding is small, and which has excellent resistance to copper-induced damage; and a wire splice and a wire harness each including the heat-recoverable article. A heat-recoverable article according to the present invention has a cylindrical shape and includes a base material layer, in which the base material layer contains an antioxidant and two or more polyolefin resins, the base material layer has one melting-point peak temperature, the melting-point peak temperature is 112° C. to 128° C., the heat of fusion of all of the resin components of the base material layer is 80 to 130 J/g, and the oxidation induction temperature of the base material layer is 265° C. to 280° C.

Abstract: A resin has a viscosity of 10 Pa·s or less at a shear rate of 1 s?1 at 150° C. and a viscosity of 100 Pa·s or more at a shear rate of 1 s?1 at 125° C., the resin having a low viscosity that allows easy penetration into strands of a wire harness at a heat shrinkage temperature and having a high viscosity that does not allow flowing of the resin at a temperature at which the wire harness is used.

Abstract: An object of the present invention is to provide a light emitting device that is able to suppress power consumption while a balance of white light is kept, without making a configuration of a power source circuit complicated. A power source potential corresponding to each color of a light emitting element is used as a higher electric potential of a video signal and an electric potential of a power source line in the case that a transistor for controlling a supply of electric current to the light emitting element is a p-channel TFT. Conversely, a power source potential corresponding to each color of a light emitting element is used as a lower electric potential of a video signal and an electric potential of a power source line in the case that a transistor for controlling a supply of electric current to the light emitting element is an n-channel TFT.

Abstract: A potential of a gate of a driving transistor is fixed, and the driving transistor is operated in a saturation region, so that a current is supplied thereto anytime. A current control transistor operating in a linear region is disposed serially with the driving transistor, and a video signal for transmitting a signal of emission or non-emission of the pixel is input to a gate of the current control transistor via a switching transistor.

Abstract: An object of the present invention is to provide a multilayered heat-recoverable article in which an adhesive layer easily flows during heat shrinkage to ensure adhesiveness with an adherend and does not flow out from a base material layer after heat shrinkage, and a wire splice and a wire harness that include a tube formed by thermally shrinking such a multilayered heat-recoverable article. The multilayered heat-recoverable article (1) according to the present invention includes a cylindrical base material layer (10), and an adhesive layer (11) formed on an inner circumferential surface of the base material layer. The adhesive layer (11) is formed of a resin composition that contains a polyamide as a main component and that does not substantially contain an inorganic filler. The resin composition is cross-linked by irradiation with ionizing radiation. A shear viscosity of the adhesive layer (11) at 150° C. is 300 Pa·s or more at a shear rate of 0.01 s?1 and 200 Pa·s or less at a shear rate of 100 s?1.