Abstract: A method for manufacturing a vibration element includes, a first base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a first protective film forming step of forming a first protective film in a first bank portion forming region of the first base film, a first dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film, a second base film forming step of forming a second base film at a second substrate surface of the quartz crystal substrate in the first and second vibrating arm forming regions, a second protective film forming step of forming a second protective film in a second bank portion forming region of the second base film, and a second dry-etching step of dry-etching the quartz crystal substrate through the second base film and the second protective film.

Abstract: A method of manufacturing a vibration element includes: a protective film forming step of forming a protective film on a first substrate surface of a crystal substrate; and a dry etching step of dry-etching the crystal substrate via the protective film. The protective film satisfies a relationship of T1<T2<T3, in which T1 is a thickness of the protective film in an inter-arm region positioned between a first vibration arm forming region in which a first vibration arm is formed and a second vibration arm forming region in which a second vibration arm is formed, T2 is a thickness of the protective film in a groove forming region in which a groove is formed, and T3 is a thickness of the protective film in a region of the first vibration arm forming region and the second vibration arm forming region excluding the groove forming region.

Abstract: A method of manufacturing a vibration element includes: a first protective film forming step of forming a first protective film on a first substrate surface of a crystal substrate; a first dry etching step of dry-etching the crystal substrate via the first protective film; a second protective film forming step of forming a second protective film on a second substrate surface of the crystal substrate; and a second dry etching step of dry-etching the crystal substrate via the second protective film. A relationship of T1<T2<T3 or T4<T5<T6 is satisfied, in which T1 and T4 are thicknesses of the first and second protective films in an inter-arm region, respectively, T2 and T5 are thicknesses of the first and second protective films in first and second groove forming regions, respectively, and T3 and T6 are thicknesses of the first and second protective films in first and second bank portion forming regions, respectively.

Abstract: A resonator device includes: a resonator element; a heat generating unit; a first package including a first base at which the resonator element and the heat generating unit are disposed, and a first lid bonded to the first base so as to accommodate the resonator element between the first lid and the first base; and a low emissivity layer that is disposed at an inner surface of the first lid and that has an emissivity lower than an emissivity of the first lid. In addition, a constituent material of the first lid is silicon, and the emissivity of the low emissivity layer at room temperature is less than 0.5.

Abstract: A resonator device includes: a resonator element; a heat generating unit; a first package including a first base at which the resonator element and the heat generating unit are disposed, and a first lid bonded to the first base so as to accommodate the resonator element between the first lid and the first base; and a high emissivity layer that is disposed at a surface of the heat generating unit on a first lid side and that has an emissivity higher than an emissivity of the surface. In addition, a constituent material of the surface is silicon, and the emissivity of the high emissivity layer at room temperature is 0.5 or more.

Abstract: A resonator device includes a quartz crystal substrate, a resonator element including a first excitation electrode arranged on a first surface of the quartz crystal substrate, a second excitation electrode arranged on a second surface of the quartz crystal substrate in opposition to the first excitation electrode, and first and second pad electrodes that are arranged on the first surface and are coupled to the first and second excitation electrodes, a base including a substrate and first and second interconnects arranged on the substrate, a first bonding member bonding the first pad electrode to the first interconnect, and a second bonding member bonding the second pad electrode to the second interconnect. The first and second bonding members are arranged such that a first imaginary line that passes through a centroid of the resonator element and is parallel to an X axis is interposed between the first and second bonding members.

Abstract: A method for manufacturing a vibrator device includes a first dry etching step of dry-etching a quartz crystal substrate having a first surface and a second surface from the side facing the first surface to form first grooves and part of the outer shapes of a first vibrating arm and a second vibrating arm, a second dry etching step of dry-etching the quartz crystal substrate from the side facing the second surface to form second grooves and part of the outer shapes of the first vibrating arm and the second vibrating arm, and thereafter, a wet etching step of wet-etching the side surfaces of the first vibrating arm and the second vibrating arm.

Abstract: A gyro vibrating element includes a drive signal pattern including a drive signal electrode to which a drive signal is applied and a drive signal wire connected to the drive signal electrode, a first detection signal pattern including a first detection electrode that outputs a first detection signal and a first detection signal wire connected to the first detection electrode, the first detection signal pattern being capacitively coupled to the drive signal pattern, and a second detection signal pattern including a second detection electrode that outputs a second detection signal opposite in phase to the first detection signal and a second detection signal wire connected to the second detection electrode, the second detection signal pattern being capacitively coupled to the drive signal pattern. Any one of the first detection signal pattern, the second detection signal pattern, and the drive signal pattern includes an adjustment pattern for adjusting an area of the signal pattern.

Abstract: A resonator device includes a resonator element, a base which has a first surface and a second surface that are in front-back relation, and in which the resonator element is arranged at the first surface, an integrated circuit provided to the base, a lid which has an inner surface opposed to the resonator element, and an outer surface in a front-back relationship with the inner surface, and which is bonded to the base so as to house the resonator element, and a radiation layer which is arranged at the inner surface of the lid, and is higher in emissivity than the lid.

Abstract: A vibrator includes: a vibration element that includes a pair of first excitation electrodes formed at the first vibration portion, a pair of second excitation electrodes formed at the second vibration portion, and a pair of third excitation electrodes formed at the third vibration portion, in which one second excitation electrode of the pair of second excitation electrodes is formed at a first inclined surface that is inclined with respect to two main surfaces, and one third excitation electrode of the pair of third excitation electrodes is formed at a second inclined surface that is inclined with respect to the two main surfaces and the first inclined surface; and a package that houses the vibration element. The vibration element includes a fixing portion to be fixed to the package. The fixing portion is provided between the first vibration portion and the second and third vibration portions.

Abstract: The vibrator device includes: a base; a circuit element disposed on the base; a vibrating element disposed to at least partially overlap the circuit element in a plan view; and a support substrate that is disposed between the circuit element and the vibrating element and supports the vibrating element. In addition, the vibrating element has a frequency adjustment portion that performs frequency adjustment by removing at least a part of the vibrating element, and the support substrate includes a base portion that supports the vibrating element, a support portion that supports the base portion, a beam portion that couples the base portion the support portion, and a shielding portion that is connected to the beam portion, overlaps the frequency adjustment portion in a plan view, and has light shielding properties.

Abstract: A method for manufacturing a vibration element includes: a preparing step of preparing a quartz crystal substrate having a first surface and a second surface; a protective film forming step of forming a protective film on the first surface of the quartz crystal substrate, excluding groove forming regions where grooves are formed and an inter-arm region located between a first vibrating arm forming region where a first vibrating arm is formed and a second vibrating arm forming region where a second vibrating arm is formed; and a dry etching step of dry etching the quartz crystal substrate from a first surface side via the protective film and forming the grooves and contours of the first vibrating arm and the second vibrating arm. Wa/Aa<1, wherein Wa indicates a depth of the grooves formed in the dry etching step, and Aa indicates a depth of the contours.

Abstract: A vibrating element includes a quartz crystal substrate having a first vibrating portion having a pair of first excitation electrodes, a second vibrating portion having a pair of second excitation electrodes, and a third vibration portion having a pair of third excitation electrodes, in which at least one second excitation electrode of the pair of second excitation electrodes is formed into a first inclined surface inclined with respect to both main surfaces of the quartz crystal substrate, and at least one third excitation electrode of the pair of third excitation electrodes is formed into a second inclined surface inclined with respect to both the main surfaces and the first inclined surface.

Abstract: A method for manufacturing a vibration element includes: a first dry etching step of dry etching the quartz crystal substrate from a first surface and forming first grooves and contours of a first vibrating arm and a second vibrating arm on the first surface; and a second dry etching step of dry etching the quartz crystal substrate from a second surface side and forming second grooves and contours of the first vibrating arm and the second vibrating arm on the second surface, in which Wa/Aa<1 in at least one of the first and second dry etching steps, Wa is a depth of the first and second grooves formed in the first and second dry etching steps, and Aa is a depth of the contours formed in the first and second dry etching steps.

Abstract: A method for manufacturing a vibration element that includes a base portion, a first vibration arm and a second vibration arm that extend from the base portion along a first direction and are arranged along a second direction intersecting the first direction, and bottomed grooves on both main surfaces of the first vibration arm and both main surfaces of the second vibration arm includes: a preparing step of preparing a crystal substrate; a protective film forming step of forming a protective film on the crystal substrate except for groove regions that are regions in which the grooves are formed; and a dry etching step of dry etching the crystal substrate through the protective film to form the grooves. The grooves provided in at least one of the first vibration arm and the second vibration arm include a first groove and a second groove arranged along the second direction.

Abstract: A vibrator device includes a vibrator element, and a support substrate configured to support the vibrator element. The vibrator element includes a drive arm provided with a drive signal electrode and a drive constant-potential electrode, and a detection arm provided with a detection signal electrode and a detection constant-potential electrode. The support substrate includes a base, and a drive signal interconnection electrically coupled to the drive signal electrode, a drive constant-potential interconnection electrically coupled to the drive constant-potential electrode, and a detection signal interconnection electrically coupled to the detection signal electrode all provided to the base, and the drive arm includes a first surface located at the support substrate side, and a second surface located at an opposite side to the first surface. Further, the drive constant-potential electrode is disposed on the first surface, and the drive signal electrode is disposed on the second surface.

Abstract: A vibrator device includes a vibrator element, and a support substrate disposed so as to be opposed to the vibrator element. The support substrate includes a base configured to support the vibrator element, a support configured to support the base, a plurality of beams configured to couple the base and the support to each other, and a drive signal interconnection, a drive constant-potential interconnection, a detection signal interconnection, and a detection constant-potential interconnection each laid around the base and the support passing the beams, and in predetermined one of the beams, at least one of the drive constant-potential interconnection and the detection constant-potential interconnection is disposed on a surface on the vibrator element side, and the detection signal interconnection is disposed on a surface on the opposite side.

Abstract: Provided is a vibrator device including a vibrator structure body. When the A axis, the B axis, and the C axis are three axes orthogonal to each other, the vibrator structure body includes a vibrator element and a support substrate that is aligned with the vibrator element along the C axis. The vibrator element includes vibrating arms configured to flexurally vibrate along a plane parallel to the A axis and the B axis and along the A axis. The support substrate includes a base that supports the vibrator element, a support that supports the base, and a beam that couples the base and the support. A relationship f0<f1 is satisfied in which f0 is a resonance frequency of a vibration of the vibrator structure body along the B axis and f1 is a drive frequency of the vibrator element.

Abstract: A resonator device includes: a base; a resonator element that includes a resonator substrate and an electrode; a conductive layer that is disposed on the base; a metal bump that is disposed between the conductive layer and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the conductive layer and the resonator element; and at least one of a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump.

Abstract: A vibrator device includes a vibrator element, and a support substrate disposed so as to be opposed to the vibrator element. The support substrate includes a base configured to support the vibrator element, a support configured to support the base, a plurality of beams configured to couple the base and the support to each other, and a drive signal interconnection, a drive constant-potential interconnection, a detection signal interconnection, and a detection constant-potential interconnection each laid around the base and the support passing the beams, and in predetermined one of the beams, at least one of the drive constant-potential interconnection and the detection constant-potential interconnection is disposed on a surface on the vibrator element side, and the detection signal interconnection is disposed on a surface on the opposite side.