Patents by Inventor Sandeep Kumar Goel
Sandeep Kumar Goel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250103786Abstract: An integrated circuit design implementation system includes a die-to-die (D2D) complier configured to receive a configuration of a semiconductor package. The semiconductor package includes a first semiconductor die and a second semiconductor die bonded to each other. The D2D compiler is configured to generate, based on the configuration of the semiconductor package, a first bump map and a second bump map for the first semiconductor die and the second semiconductor die, respectively. The first bump map indicates respective locations of a plurality of first bump structures of the first semiconductor die, and the second bump map indicates respective locations of a plurality of second bump structures of the second semiconductor die.Type: ApplicationFiled: September 22, 2023Publication date: March 27, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yun-Chia Chen, Yu-Ze Lin, Huang-Yu Chen, King-Ho Tam, Chen-Jih Lui, Tze-Chiang Huang, Sandeep Kumar Goel
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Patent number: 12229483Abstract: A method (of manufacturing a semiconductor device) includes: migrating a circuit design from a first netlist corresponding with a first semiconductor process technology (SPT) to a second netlist corresponding with a second SPT, at least the second netlist being stored on a non-transitory computer-readable medium, the migrating including: generating first versions correspondingly of the first and second netlists; abstracting selected components in the first version of the second netlist and correspondingly in the first version of the second netlist to form corresponding second versions of the second and first netlists; performing a logic equivalence check (LEC) between the second versions of the first and second netlists, thereby identifying migration errors; and revising the second version of the second netlist to reduce the migration errors, thereby resulting in a third version of the second netlist.Type: GrantFiled: July 11, 2023Date of Patent: February 18, 2025Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY, LIMITEDInventors: Sandeep Kumar Goel, Ankita Patidar, Yun-Han Lee
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Patent number: 12204825Abstract: Electronic system level (ESL) design and verification of the present disclosure is utilized to provide an electronic simulation and modeling of function safety and fault management of an electronic device. A method for simulating a safety circuit includes providing an electronic architectural design to perform one or more functional behaviors of the electronic device in accordance with an electronic design specification. The method further includes modeling the safety circuit of the electronic architectural design and one or more other electronic circuits of the electronic architectural design that communicate with the safety circuit. The method further includes simulating, using the modeling, operation of the safety circuit while the electronic architectural design is performing the one or more functional behaviors. The method also includes determining whether the simulated operation of the safety circuit satisfies the electronic design specification.Type: GrantFiled: May 27, 2022Date of Patent: January 21, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kai-Yuan Ting, Hsin-Cheng Chen, Sandeep Kumar Goel, Mei Wong, Yun-Han Lee
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Publication number: 20250020719Abstract: A circuit includes a scan chain comprising a cell structure, wherein the cell structure comprises a first plural number (N) of stages, and each of the stages is configured to store a bit. The circuit includes a second plural number (S) of multiplexers operatively coupled to the scan chain, wherein the S is determined as N M , where the M represents a diagnostic resolution. The multiplexers are each configured to receive a respective one of S control signals to selectively bypass a corresponding subset of the stages.Type: ApplicationFiled: July 11, 2023Publication date: January 16, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mohammed Moiz Khan, Sandeep Kumar Goel
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Publication number: 20240394440Abstract: Electronic system level (ESL) design and verification of the present disclosure is utilized to provide an electronic simulation and modeling of function safety and fault management of an electronic device. A method for simulating a safety circuit includes providing an electronic architectural design to perform one or more functional behaviors of the electronic device in accordance with an electronic design specification. The method further includes modeling the safety circuit of the electronic architectural design and one or more other electronic circuits of the electronic architectural design that communicate with the safety circuit. The method further includes simulating, using the modeling, operation of the safety circuit while the electronic architectural design is performing the one or more functional behaviors. The method also includes determining whether the simulated operation of the safety circuit satisfies the electronic design specification.Type: ApplicationFiled: July 31, 2024Publication date: November 28, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Yuan TING, Hsin-Cheng Chen, Sandeep Kumar Goel, Mei Wong, Yun-Han Lee
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Publication number: 20240361385Abstract: Systems, methods, and devices are described herein for performing intra-die and inter-die tests of one or more dies of an integrated circuit. A cell of an integrated circuit includes a data register, an I/O pad, and a first multiplexer. The data register is configured to output a signal. The I/O pad is coupled to the data register and configured to receive and buffer the signal. The first multiplexer is coupled to the I/O pad and the data register. The multiplexer is configured to selectively output either the buffered signal or the signal based on whether a scan mode or a functional mode is enabled.Type: ApplicationFiled: July 9, 2024Publication date: October 31, 2024Inventors: Anshuman Chandra, Sandeep Kumar Goel
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Publication number: 20240338506Abstract: A non-transitory computer-readable storage medium is encoded with a set of instructions for designing a semiconductor device using electronic system level (ESL) modeling for machine learning applications that, when executed by at least one processor, cause the at least one processor to: retrieve a source code operable to execute a plurality of operations of a machine learning algorithm; classify a first group of the plurality of operations as slow group operations and classify a second group of the plurality of operations as fast group operations, based on a time required to complete each operation; define a neural network operable to execute the slow group operations; define a trained neural network configuration including a plurality of interconnected neurons operable to execute the slow group operations; and generate an ESL platform for evaluating a design of a semiconductor device based on the trained neural network configuration.Type: ApplicationFiled: June 17, 2024Publication date: October 10, 2024Inventors: Kai-Yuan TING, Sandeep Kumar GOEL, Tze-Chiang HUANG, Yun-Han LEE
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Patent number: 12066490Abstract: Systems, methods, and devices are described herein for performing intra-die and inter-die tests of one or more dies of an integrated circuit. A cell of an integrated circuit includes a data register, an I/O pad, and a first multiplexer. The data register is configured to output a signal. The I/O pad is coupled to the data register and configured to receive and buffer the signal. The first multiplexer is coupled to the I/O pad and the data register. The multiplexer is configured to selectively output either the buffered signal or the signal based on whether a scan mode or a functional mode is enabled.Type: GrantFiled: August 23, 2022Date of Patent: August 20, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Anshuman Chandra, Sandeep Kumar Goel
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Publication number: 20240205168Abstract: A network-on-chip (NoC) system includes a default communication path between a master device and a slave device, and a backup communication path between the master device and the slave device. The default communication path is configured to work in a normal operation state of the chip. The backup communication path is configured to replace the default communication path when a fault arises in the default communication path.Type: ApplicationFiled: March 4, 2024Publication date: June 20, 2024Inventors: RAVI VENUGOPALAN, SANDEEP KUMAR GOEL, YUN-HAN LEE
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Patent number: 12014130Abstract: A method includes receiving a source code for executing a plurality of operations associated with a machine learning algorithm, classifying each operation into a fast operation group and/or a slow operation group, defining a neuron network for executing operations of the slow operation group, and mapping the neuron network to an initial machine learning hardware configuration. The method also includes executing the slow operation group operation on the machine learning hardware configuration, finalizing the machine learning hardware configuration capable of successfully executing least one test data set.Type: GrantFiled: December 8, 2020Date of Patent: June 18, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kai-Yuan Ting, Sandeep Kumar Goel, Tze-Chiang Huang, Yun-Han Lee
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Publication number: 20240133951Abstract: In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.Type: ApplicationFiled: January 3, 2024Publication date: April 25, 2024Inventors: Sandeep Kumar GOEL, Yun-Han LEE, Saman M.I. ADHAM, Marat GERSHOIG
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Patent number: 11949603Abstract: A network-on-chip (NoC) system includes a default communication path between a master device and a slave device, and a backup communication path between the master device and the slave device. The default communication path is configured to work in a normal operation state of the chip. The backup communication path is configured to replace the default communication path when a fault arises in the default communication path.Type: GrantFiled: October 24, 2022Date of Patent: April 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Ravi Venugopalan, Sandeep Kumar Goel, Yun-Han Lee
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Publication number: 20240094281Abstract: A method of testing an integrated circuit on a test circuit board includes performing, by a processor, a simulation of a first heat distribution throughout an integrated circuit design, and simultaneously performing a burn-in test of the integrated circuit and an automated test of the integrated circuit. The burn-in test has a minimum burn-in temperature of the integrated circuit or a burn-in heat distribution across the integrated circuit that includes a set of circuit blocks or a first set of heaters. The integrated circuit design corresponding to the integrated circuit. The performing the simulation includes determining a heat signature of the integrated circuit design from configured power information or location information for each circuit block of the set of circuit blocks or each heater of the set of heaters included in the integrated circuit design. The heat signature includes heat values distributed throughout the integrated circuit design.Type: ApplicationFiled: November 28, 2023Publication date: March 21, 2024Inventors: Ankita PATIDAR, Sandeep Kumar GOEL, Yun-Han LEE
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Publication number: 20240087668Abstract: A method of identifying cell-internal defects: obtaining a circuit design of an integrated circuit, the circuit design including netlists of one or more cells coupled to one another; identifying the netlist corresponding to one of the one or more cells; injecting a defect to one of a plurality of circuit elements and one or more interconnects of the cell; retrieving a first current waveform at a location of the cell where the defect is injected by applying excitations to inputs of the cell; retrieving, without the defect injected, a second current waveform at the location of the cell by applying the same excitations to the inputs of the cell; and selectively annotating, based on the first current waveform and the second current waveform, an input/output table of the cell with the defect.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ankita Patidar, Sandeep Kumar Goel
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Patent number: 11899064Abstract: In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.Type: GrantFiled: December 13, 2022Date of Patent: February 13, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Sandeep Kumar Goel, Yun-Han Lee, Saman M. I. Adham, Marat Gershoig
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Patent number: 11879933Abstract: A method of testing an integrated circuit on a test circuit board includes performing, by a processor, a simulation of a first heat distribution throughout an integrated circuit design, manufacturing the integrated circuit according to the integrated circuit design, and simultaneously performing a burn-in test of the integrated circuit and an automated test of the integrated circuit. The burn-in test has a minimum burn-in temperature of the integrated circuit and a burn-in heat distribution across the integrated circuit. The integrated circuit design corresponds to the integrated circuit. The integrated circuit is coupled to the test circuit board. The integrated circuit includes a set of circuit blocks and a first set of heaters.Type: GrantFiled: August 3, 2021Date of Patent: January 23, 2024Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY, LIMITEDInventors: Ankita Patidar, Sandeep Kumar Goel, Yun-Han Lee
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Publication number: 20240022427Abstract: A device is disclosed. The device includes a first memory circuit and a processing circuit. The first memory circuit stores identifications of the device that are used to generate first hash data through a hash algorithm. The processing circuit is coupled to the first memory circuit and selects at least one bit of each of the identifications in sequence to form a bit sequence, generates second hash data through the hash algorithm based on the bit sequence and authenticates the device according to a comparison between the first hash data and the second hash data.Type: ApplicationFiled: September 27, 2023Publication date: January 18, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Haohua ZHOU, Sandeep Kumar GOEL
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Patent number: 11837308Abstract: A method of identifying cell-internal defects: obtaining a circuit design of an integrated circuit, the circuit design including netlists of one or more cells coupled to one another; identifying the netlist corresponding to one of the one or more cells; injecting a defect to one of a plurality of circuit elements and one or more interconnects of the cell; retrieving a first current waveform at a location of the cell where the defect is injected by applying excitations to inputs of the cell; retrieving, without the defect injected, a second current waveform at the location of the cell by applying the same excitations to the inputs of the cell; and selectively annotating, based on the first current waveform and the second current waveform, an input/output table of the cell with the defect.Type: GrantFiled: April 5, 2022Date of Patent: December 5, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ankita Patidar, Sandeep Kumar Goel
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Publication number: 20230385498Abstract: Process for determining defects in cells of a circuit is provided. A layout of a circuit is received. The layout comprises a first cell and a second cell separated by a boundary circuit. Bridge pairs for the first cell and the second cell is determined. The bridge pairs comprises a first plurality of boundary nodes of the first cell paired with a second plurality of boundary nodes of the second cell. Bridge pair faults between the bridge pairs are modeled. A test pattern for the bridge pair faults is generated.Type: ApplicationFiled: April 19, 2023Publication date: November 30, 2023Inventors: Sandeep Kumar Goel, Ankita Patidar
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Patent number: 11831781Abstract: A device includes a first memory circuit and a processing circuit. The first memory circuit is configured to store first hash data. The processing circuit is coupled to the first memory circuit. The processing circuit is configured to: at least based on a volume of the device, define a size of a distinguishable identification (ID) and a size of second hash data; based on a combination of at least one bit of each of the distinguishable ID and IDs of the device, generate the second hash data; and compare the first hash data with the second hash data, in order to identify whether the device is tampered. A method is also discloses herein.Type: GrantFiled: March 25, 2021Date of Patent: November 28, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Haohua Zhou, Sandeep Kumar Goel