Abstract: A device includes a fault generation circuit and a first fault injection circuit. The fault generation circuit is configured to generate a fault signal and a plurality of control signals according to a mode signal. The first fault injection circuit is configured to inject a first final fault signal to an under-test device based on the fault signal and the plurality of control signals, in order to verify robustness of the under-test device.

Abstract: A bi-directional scan chain includes a plurality of cell structures, each cell structure having a storage device and at least one multiplexer, the plurality of cell structures coupled to one another in a series configuration, wherein an output of a (K?1)-th cell structure is provided as input to the K-th cell structure to provide a forward data shifting operation, and an output of the K-th cell structure is provided as an input to the (K?1)-th cell structure to provide a backward data shifting operation, where K is an integer greater than 1.

Abstract: Electronic system level (ESL) design and verification of the present disclosure is utilized to provide an electronic simulation of a various loads on one or more batteries of an electronic device resulting from the electronic device performing one or more functional behaviors. Before this electronic simulation occurs, the electronic device is modeled using the high-level software language or the high-level software format. For example, a battery discharge model, a regulator efficiency model, a power delivery network (PDN) model, or a component power model are used to model behaviors of the one or more batteries, regulator circuitry, power delivery network (PDN) circuitry, and other electronic circuits, respectively, of the electronic device.

Abstract: A method for testing a monolithic stacked integrated circuit (IC) is provided. The method includes receiving a layer of the IC. The layer has a first surface and a second surface, and the layer includes a substrate. The method further includes attaching probe pads to the first surface, and applying a first fault testing to the IC through the probe pads. The method further includes forming another layer of the IC over the second surface, and applying a second fault testing to the IC through the probe pads.

Abstract: A method of estimating power consumption for a system on chip (SOC) includes simulating operation of a first sub-block to obtain power consumption information for the first sub-block including first activation information for a first IP block. The method further includes simulating operation of a second sub-block to obtain power consumption information for the second sub-block including second activation information for the first IP block and activation information for a plurality of second IP blocks. The method further includes determining a weighting factor for the first activation information for the first IP block, the second activation information for the first IP block and the activation information for each second IP block. The method further includes estimating power consumption for the SOC based on the first and second activation information for the first IP block, the activation information for at least one second IP block, and corresponding weighting factors.

Abstract: A method of estimating power consumption of a processor includes accessing an electronic system level (ESL) model of the processor, the ESL model including a plurality of functional blocks, identifying a plurality of processor events by tracing activity of the plurality of functional blocks for a plurality of machine code instructions, and calculating a first power consumption value based on the plurality of processor events. The method also includes identifying a plurality of cycles by analyzing a plurality of micro-code operation codes corresponding to the plurality of machine code instructions, calculating a second power consumption value based on the plurality of cycles, and calculating a total power consumption value from the first power consumption value summed with the second power consumption value.

Abstract: Systems and methods for circuit fault diagnosis are provided. An original circuit design is evaluated to determine whether the original circuit design is to be modified based at least in part on one or more first faults. In response to the original circuit design being determined not to be modified based at least in part on the one or more first faults, a first test pattern set is automatically generated based at least in part on the original circuit design. The original circuit design is evaluated to determine whether the original circuit design is to be modified based at least in part on the first test pattern set. In response to the original circuit design being determined not to be modified based at least in part on the first test pattern set, fault testing is performed to determine whether the original circuit design fails.

Abstract: A method for dynamic frequency scaling (DFS) on the electronic systems level (ESL). The method can run in a virtual environment and dynamically scale the frequency of a virtual component based on a first transaction time and a second transaction time.

Abstract: A device includes a fault generation circuit and a first fault injection circuit. The fault generation circuit is configured to generate a fault signal and a plurality of control signals according to a mode signal. The first fault injection circuit is configured to inject a first final fault signal to an under-test device based on the fault signal and the plurality of control signals, in order to verify robustness of the under-test device.

Abstract: A clock distribution circuit configured to output a clock signal includes a first circuit configured to use a reference clock signal to provide first and second reference signals, wherein the second reference signal indicates whether the first reference signal is locked with the reference clock signal; a second circuit configured to use the reference clock signal to provide an output signal and an indication signal indicative whether the output signal is locked with the reference clock signal; and a monitor circuit, coupled to the first and second circuits, and configured to use at least one of the first reference signal, the second reference signal, the output signal, and the indication signal to determine whether the second circuit is functioning correctly.

Abstract: A system includes a memory and a processor. The processor is configured to execute computer program codes to perform operations below. A netlist of a functional unit is transformed to a first matrix. The netlist includes information associated with nodes and flip-flops. A first node is selected from the nodes according to the first matrix and a second matrix, to generate a fault list. The second matrix includes weighting values for the nodes. The first node is determined to be associated with a maximum number of the flip-flops. A fault injection is performed on the functional unit. The functional unit is analyzed according to the netlist and the fault list, to generate a first file. A safety mechanism unit is analyzed to generate a second file. A failure is detected according to the first file or a combination of the first file and the second file.

Abstract: A network-on-chip (NoC) system includes a default communication path between a master device and a slave device, and a backup communication path between the master device and the slave device. The default communication path is configured to work in a normal operation state of the chip. The backup communication path is configured to replace the default communication path when a fault arises in the default communication path.

Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.

Abstract: A circuit includes a plurality of scan chains arranged in a ring network topology. Each scan chain includes a plurality of scan blocks, each of the plurality of scan blocks including a storage element and a switching device. Each switching device includes a first input configured to receive an output of a storage element in a different scan chain from the scan chain in which the switching device is disposed, and a second input configured to receive one of a function logic signal or a test scan signal. The switching device configured to selectively couple the first input or the second input to an input of the storage element.

Abstract: A device comprises a first die; and a second die stacked below the first die with interconnections between the first die and the second die. A least one of the first die or the second die has a circuit for performing a function and provides a functional path. Each of the first and second dies comprise a plurality of latches, including a respective latch corresponding to each one of the interconnections; and a plurality of multiplexers. Each multiplexer is connected to a respective one of the plurality of latches and arranged for receiving and selecting one of a scan test pattern or a signal from the functional path for outputting during a scan chain test of the first die and second die.

Abstract: A method performed at least partially by a processor includes performing a test sequence. In the test sequence, a test pattern is loaded into a circuit. The test pattern is configured to cause the circuit to output a predetermined test response. A test response is unloaded from the circuit after a test wait time period has passed since the loading of the test pattern into the circuit. The unloaded test response is compared with the predetermined test response.

Abstract: A method of estimating power consumption of a processor includes accessing an electronic system level (ESL) model of the processor, the ESL model including a plurality of functional blocks, identifying a plurality of processor events by tracing activity of the plurality of functional blocks for a plurality of machine code instructions, and calculating a first power consumption value based on the plurality of processor events. The method also includes identifying a plurality of cycles by analyzing a plurality of micro-code operation codes corresponding to the plurality of machine code instructions, calculating a second power consumption value based on the plurality of cycles, and calculating a total power consumption value from the first power consumption value summed with the second power consumption value.

Abstract: A power state transformer, a system and a method thereof are disclosed. The power state transformer is coupled with a processing unit model. The power state transformer is configured for counting performance activities executed in the processing unit model, and further for determining a power state of the processing unit model according to count values of the performance activities.

Abstract: A method is disclosed that includes establishing an intellectual property (IP) bank, an application bank, and a technology bank; selecting valid configurations from the IP bank for corresponding IPs and at least one subsystem based on the application data, for generating in response to a user-defined requirement, by a model generator, a performance, power, area and cost (PPAC) model of the valid configurations; based on the PPAC model, creating at least one architecture comprising at least one of the corresponding IPs, and at least one of the valid configurations for the at least one of the corresponding IPs; and, estimating, by a PPAC explorer assessing the technology bank, at least one of a performance value, a power value, an area value and a cost value for a fabrication of the at least one architecture by simulating available fabrication process technology based on the technology bank.

Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.