Abstract: A semiconductor memory device includes: a first pad layer in a surface of a memory chip including a cell region in which a memory cell array coupled to a plurality of row lines and a step region including staggered step portions of the plurality of row lines, and including a plurality of first pads that are coupled to the step portions; a second pad layer in a surface of a circuit chip bonded to the surface of the memory chip, and having a plurality of second pads coupled to a plurality of pass transistors defined in the circuit chip; a first redistribution line disposed in the first pad layer that couples one of the step portions and one of the pass transistors; and a second redistribution line disposed in the second pad layer that couples another one of the step portions and another one of the pass transistors.

Abstract: A semiconductor device includes a first chip, divided into a plurality of regions, including a plurality of first pads and a plurality of first test pads in each of the plurality of regions; and a second chip including a plurality of second pads corresponding to the plurality of first pads and a plurality of second test pads corresponding to the plurality of first test pads, and bonded onto the first chip such that the plurality of second pads are coupled to the plurality of first pads. The second chip includes a voltage generation circuit linked to the plurality of second pads, that provides a compensated voltage to the plurality of second pads for each of the plurality of regions, based on a voltage drop value for each region due to a contact resistance between the plurality of first test pads and the plurality of second test pads.

Abstract: A semiconductor memory device includes a substrate including a cell region and a slimming region; a logic structure disposed over the substrate, the logic structure including logic circuit elements and bottom wiring lines electrically coupled to the logic circuit elements; a source plate disposed over the logic structure; a memory structure including a plurality of memory cells and a plurality of gate electrode layers, wherein the plurality of memory cells are disposed over the source plate of the cell region and a plurality of gate electrode layers are stacked over the source plate of the cell region and the slimming region to be separated from one another and are coupled to the plurality of memory cells; and a first slit cutting the source plate at a boundary between the cell region and the slimming region, wherein the source plate of the slimming region is floated regardless an operation of the memory cells and the logic circuit elements.

Abstract: A semiconductor memory device includes an electrode structure including a plurality of electrode layers and a plurality of interlayer dielectric layers which are alternately stacked on a substrate defined with a plurality of cell areas and a plurality of coupling areas in a first direction; a hard mask pattern disposed on the electrode structure, and having a plurality of opening holes in the coupling areas; and a plurality of contact holes defined in the electrode structure under the plurality of opening holes, and exposing pad areas of the electrode layers, respectively. The plurality of opening holes are disposed by being distributed in a plurality of rows arranged in a second direction intersecting with the first direction.

Abstract: A semiconductor memory device includes a plurality of memory cell arrays accessed through a plurality of row lines and a plurality of bit lines; a pass transistor coupled to one of the plurality of row lines and configured to transfer an operating voltage to the one of the plurality of row lines; and a plurality of wiring lines disposed in a wiring line layer over the pass transistor. The wiring line layer includes a wiring inhibition interval which overlaps a source and a drain of the pass transistor. One or more of the plurality of wiring lines is disposed outside of the wiring inhibition interval.

Abstract: A semiconductor memory device includes a substrate having a second region extending in a first direction; a memory block including electrodes; a slit dividing the memory block into first and second electrode structures in the second region; and step-shaped grooves formed in the memory block in the second region, and divided by the slit. In the second region, the first and second electrode structures are adjacently disposed with the slit interposed therebetween, in a second direction intersecting with the first direction. Each of the electrodes of the first electrode structure has a first pad region, each of the electrodes of the second electrode structure has a second pad region, and first and second pad regions of the first and second electrode structures which are positioned in the same step-shaped groove and are disposed at the same layers are adjacently disposed in the second direction with the slit interposed therebetween.

Abstract: A semiconductor memory device includes a substrate including a cell region and a slimming region; a logic structure disposed over the substrate, the logic structure including logic circuit elements and bottom wiring lines electrically coupled to the logic circuit elements; a source plate disposed over the logic structure; a memory structure including a plurality of memory cells and a plurality of gate electrode layers, wherein the plurality of memory cells are disposed over the source plate of the cell region and a plurality of gate electrode layers are stacked over the source plate of the cell region and the slimming region to be separated from one another and are coupled to the plurality of memory cells; and a first slit cutting the source plate at a boundary between the cell region and the slimming region, wherein the source plate of the slimming region is floated regardless an operation of the memory cells and the logic circuit elements.

Abstract: A semiconductor memory device includes a memory cell array and a row decoder disposed in a first direction over a substrate and a plurality of coupling lines for electrically coupling the memory cell array and the row decoder. Each of the coupling lines includes a first conductive line disposed in the first direction; a second conductive line disposed parallel to the first conductive line; and a pad coupling the first conductive line and the second conductive line, and coupled to the memory cell array or the row decoder through a contact plug. The coupling lines are routed from both sides of the pad in the first direction.

Abstract: A semiconductor memory device includes a semiconductor layer including a memory cell region; a memory cell array including a plurality of first gate electrode layers stacked over the semiconductor layer, and disposed in the memory cell region; and a capacitor circuit disposed over the semiconductor layer outside the memory cell region. The capacitor circuit includes a plurality of gate structural bodies each including second gate electrode layers stacked over the semiconductor layer, and arranged along a first direction; a plurality of electrodes disposed between the gate structural bodies; and dielectric layers interposed between the gate structural bodies and the electrodes.

Abstract: A semiconductor memory device includes a peripheral circuit element provided over a lower substrate; an upper substrate provided over an interlayer dielectric layer which partially covers the peripheral circuit element; a memory cell array including a channel structure which extends in a first direction perpendicular to a top surface of the upper substrate and a plurality of gate lines which are stacked over the upper substrate to surround the channel structure; and a plurality of transistors electrically coupling the gate lines to the peripheral circuit element. The transistors include a gate electrode provided over the interlayer dielectric layer and disposed to overlap with the memory cell array in the first direction; a plurality of vertical channels passing through the gate electrode in the first direction and electrically coupled to the gate lines, respectively; and gate dielectric layers disposed between the vertical channels and the gate electrode.

Abstract: A semiconductor memory device includes a semiconductor layer including a memory cell region; a memory cell array including a plurality of first gate electrode layers stacked over the semiconductor layer, and disposed in the memory cell region; and a capacitor circuit disposed over the semiconductor layer outside the memory cell region. The capacitor circuit includes a plurality of gate structural bodies each including second gate electrode layers stacked over the semiconductor layer, and arranged along a first direction; a plurality of electrodes disposed between the gate structural bodies; and dielectric layers interposed between the gate structural bodies and the electrodes.

Abstract: A semiconductor memory device includes a memory cell array and a row decoder disposed in a first direction over a substrate and a plurality of coupling lines for electrically coupling the memory cell array and the row decoder. Each of the coupling lines includes a first conductive line disposed in the first direction; a second conductive line disposed parallel to the first conductive line; and a pad coupling the first conductive line and the second conductive line, and coupled to the memory cell array or the row decoder through a contact plug. The coupling lines are routed from both sides of the pad in the first direction.

Abstract: A nonvolatile memory device includes a memory block including a plurality of cell strings each of which includes memory cells electrically coupled with word lines stacked over a substrate; a plurality of sub common sources electrically coupled to one ends of the cell strings; and a plurality of bit lines electrically coupled to the other ends of the cell strings, wherein the memory block includes sub blocks respectively corresponding to the sub common sources, and cell strings electrically coupled to the same bit line among the cell strings are included in the same sub block.

Abstract: A nonvolatile memory device includes a memory block including a plurality of cell strings each of which includes memory cells electrically coupled with word lines stacked over a substrate; a plurality of sub common sources electrically coupled to one ends of the cell strings; and a plurality of bit lines electrically coupled to the other ends of the cell strings, wherein the memory block includes sub blocks respectively corresponding to the sub common sources, and cell strings electrically coupled to the same bit line among the cell strings are included in the same sub block.

Abstract: A semiconductor device includes an insulating layer formed on a substrate, and a capacitor including first and second electrodes formed in the insulating layer, wherein a lower surface of the first electrode is formed to have a greater depth than a lower surface of the second electrode in the insulating layer.

Abstract: A three-dimensional nonvolatile memory device includes a substrate defined with a slimming region, first and second pass regions on both sides of the slimming region, and a cell region adjacent to the slimming region with the first pass region interposed therebetween; a word line stack including a plurality of word lines stacked over the cell region, the first pass region, and the slimming region of the substrate; first wiring lines extending from the slimming region to the first pass region and electrically coupling some word lines with pass transistors formed in the first pass region of the substrate; and second wiring lines extending from the slimming region to the second pass region and electrically coupling remaining word lines, other than the some word lines, with pass transistors formed in the second pass region of the substrate.

Abstract: A semiconductor device includes a substrate on which a plurality of contact regions are defined, a plurality of transistors formed in the plurality of contact regions, a support body formed over the plurality of transistors and including a top surface, portions of which have different heights in the plurality of contact regions, a plurality of stacked structures including a plurality of conductive layers stacked over the support body, slits located between the plurality of stacked structures, first lines coupled to first junctions of the plurality of transistors through the slits, and second lines coupled to second junctions of the plurality of transistors through the slits.

Abstract: A semiconductor device includes a substrate where a cell region and a contact region are defined, an isolation region and an active region disposed alternately in the contact region, transistors configured to include a gate formed over the substrate and a source and a drain formed in the active region at both sides of the gate, in the contact region, memory blocks configured to include conductive lines stacked over the substrate and formed over the transistors, the conductive lines being extended from the cell region to the contact region in the direction crossing over the isolation region and the active region, and contact plugs formed between the memory blocks in the contact region.

Abstract: A semiconductor device includes an insulating layer formed on a substrate, and a capacitor including first and second electrodes formed in the insulating layer, wherein a lower surface of the first electrode is formed to have a greater depth than a lower surface of the second electrode in the insulating layer.

Abstract: A semiconductor device includes a substrate on which a plurality of contact regions are defined, a plurality of transistors formed in the plurality of contact regions, a support body formed over the plurality of transistors and including a top surface, portions of which have different heights in the plurality of contact regions, a plurality of stacked structures including a plurality of conductive layers stacked over the support body, slits located between the plurality of stacked structures, first lines coupled to first junctions of the plurality of transistors through the slits, and second lines coupled to second junctions of the plurality of transistors through the slits.